Eric Eisenbraun

1.5k total citations
95 papers, 1.3k citations indexed

About

Eric Eisenbraun is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Eric Eisenbraun has authored 95 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 85 papers in Electrical and Electronic Engineering, 55 papers in Electronic, Optical and Magnetic Materials and 28 papers in Materials Chemistry. Recurrent topics in Eric Eisenbraun's work include Semiconductor materials and devices (70 papers), Copper Interconnects and Reliability (54 papers) and Metal and Thin Film Mechanics (18 papers). Eric Eisenbraun is often cited by papers focused on Semiconductor materials and devices (70 papers), Copper Interconnects and Reliability (54 papers) and Metal and Thin Film Mechanics (18 papers). Eric Eisenbraun collaborates with scholars based in United States, Netherlands and Canada. Eric Eisenbraun's co-authors include Alain E. Kaloyeros, Tonmoy Chakraborty, Sumit Kumar, Mengbing Huang, Spyros Gallis, Michael A. Carpenter, Zheng Bo, John J. Sullivan, Kathleen Dunn and O. van der Straten and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Eric Eisenbraun

90 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Eric Eisenbraun United States 19 1.0k 591 438 310 180 95 1.3k
Jill Becker United States 10 1.0k 1.0× 228 0.4× 818 1.9× 158 0.5× 161 0.9× 25 1.3k
M. Friedrich Germany 22 679 0.7× 236 0.4× 659 1.5× 173 0.6× 315 1.8× 79 1.2k
Chang‐Koo Kim South Korea 22 1.1k 1.1× 619 1.0× 889 2.0× 244 0.8× 148 0.8× 88 1.7k
Eiji Aoyagi Japan 15 313 0.3× 302 0.5× 260 0.6× 145 0.5× 156 0.9× 63 775
K.P. Korona Poland 24 980 0.9× 542 0.9× 828 1.9× 108 0.3× 581 3.2× 132 1.9k
George Adamopoulos United Kingdom 22 1.4k 1.3× 276 0.5× 1.6k 3.7× 198 0.6× 65 0.4× 37 1.9k
Chih‐Wei Hsu Taiwan 24 615 0.6× 544 0.9× 863 2.0× 154 0.5× 384 2.1× 73 1.7k
A. Ashour Egypt 19 919 0.9× 374 0.6× 1.2k 2.8× 46 0.1× 167 0.9× 51 1.6k
Patrice Miska France 20 653 0.6× 211 0.4× 849 1.9× 156 0.5× 257 1.4× 67 1.2k
Xing Yin China 23 1.0k 1.0× 180 0.3× 466 1.1× 59 0.2× 308 1.7× 47 1.3k

Countries citing papers authored by Eric Eisenbraun

Since Specialization
Citations

This map shows the geographic impact of Eric Eisenbraun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Eisenbraun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Eisenbraun more than expected).

Fields of papers citing papers by Eric Eisenbraun

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Eric Eisenbraun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Eisenbraun. The network helps show where Eric Eisenbraun may publish in the future.

Co-authorship network of co-authors of Eric Eisenbraun

This figure shows the co-authorship network connecting the top 25 collaborators of Eric Eisenbraun. A scholar is included among the top collaborators of Eric Eisenbraun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Eric Eisenbraun. Eric Eisenbraun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Banham, Dustin, et al.. (2016). Unexpected hydrogen oxidation selectivity of Pt/NbTiO2 catalysts. Nano Energy. 27. 157–166. 7 indexed citations
2.
Witt, Christian, C. Cabral, Conal E. Murray, et al.. (2013). Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements. Journal of Applied Physics. 113(21). 7 indexed citations
3.
He, Xiaoli, et al.. (2012). Processing and functionalization of conductive substoichiometric TiO2 catalyst supports for PEM fuel cell applications. Journal of materials research/Pratt's guide to venture capital sources. 28(3). 461–467. 6 indexed citations
4.
Arkles, Barry, et al.. (2012). Hydridosilane Modification of Metals: An Exploratory Study. Journal of Adhesion Science and Technology. 26(1-3). 41–54. 5 indexed citations
5.
Lund, Isaac, et al.. (2011). Silicide-induced multi-wall carbon nanotube growth on silicon nanowires. Nanotechnology. 22(8). 85603–85603. 9 indexed citations
6.
Carlsen, Autumn, Seiichiro Higashiya, Kathleen Dunn, et al.. (2011). Metallization of a Genetically Engineered Polypeptide. Macromolecular Bioscience. 12(2). 269–273. 2 indexed citations
7.
Eisenbraun, Eric, et al.. (2011). Substoichiometric TiO2 Thin Films as a Support Catalyst for Hydrogen Fuel Cells. ECS Transactions. 35(34). 17–24.
8.
Mao, Jiajun, et al.. (2010). Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD. ECS Transactions. 33(12). 125–135. 6 indexed citations
9.
Chakraborty, Tonmoy, et al.. (2009). Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 27(3). 572–576. 33 indexed citations
10.
Eisenbraun, Eric, et al.. (2007). Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers. ECS Transactions. 11(7). 67–78. 5 indexed citations
11.
Wang, Xiaodong, et al.. (2007). Sub-0.25 micron silicon via etching for 3D interconnects. Journal of Micromechanics and Microengineering. 17(4). 804–811. 8 indexed citations
12.
Cale, T.S., James Castracane, Eric Eisenbraun, et al.. (2003). Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems. TechConnect Briefs. 1(2003). 530–533. 1 indexed citations
13.
Lü, Jian-Qiang, Yongchai Kwon, G. Rajagopalan, et al.. (2003). A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects. 89. 78–80. 19 indexed citations
14.
Banger, K.K., Andrei Kornilov, Eric Eisenbraun, et al.. (2001). The first metal complex containing a silylated β-diketonate ligand: bis(2,2,6,6-tetramethyl-2-sila-3,5-heptanedionato) copper(II). Inorganic Chemistry Communications. 4(9). 496–500. 15 indexed citations
15.
Kaloyeros, Alain E. & Eric Eisenbraun. (2000). Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization. Annual Review of Materials Science. 30(1). 363–385. 332 indexed citations
16.
Welch, John T., Paul J. Toscano, K.K. Banger, et al.. (2000). The 2,2,6,6-Tetramethyl-2-Sila-3,5-Heptanedione Route to the Chemical Vapor Deposition of Copper for Gigascale Interconnect Applications. MRS Proceedings. 612. 8 indexed citations
17.
Neves, Herc P., et al.. (1993). IN-SITU Analysis Of The Microstructure of Thermally Treated Thin Copper Films. MRS Proceedings. 309. 6 indexed citations
18.
Kirchner, Eric, S. P. Murarka, Eric Eisenbraun, & Alain E. Kaloyeros. (1993). Ultra Thin Sacrificial Diffusion Barriers - Control of Diffusion Across the Cu-SiO2 Interface. MRS Proceedings. 318. 4 indexed citations
19.
Eisenbraun, Eric, et al.. (1992). Remote plasma chemical vapor deposition of copper for applications in microelectronics. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 10(4). 1337–1340. 9 indexed citations
20.
Eisenbraun, Eric, et al.. (1986). Array Macro Set for a Microsystem in CMOS-Technology. 62–64. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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