Cheng-Ta Ko

451 total citations
10 papers, 355 citations indexed

About

Cheng-Ta Ko is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Polymers and Plastics. According to data from OpenAlex, Cheng-Ta Ko has authored 10 papers receiving a total of 355 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 4 papers in Automotive Engineering and 2 papers in Polymers and Plastics. Recurrent topics in Cheng-Ta Ko's work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Cheng-Ta Ko is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Cheng-Ta Ko collaborates with scholars based in Taiwan and United States. Cheng-Ta Ko's co-authors include Kuan‐Neng Chen, Yuhua Chen, Hao‐Chung Kuo, Chia‐Feng Lin, S. C. Wang, Chun‐An Cheng, Wei-Ta Huang, J.T. Chu, Chao Lin and Irene A. Chen and has published in prestigious journals such as Journal of Crystal Growth, Journal of Nanoscience and Nanotechnology and Microelectronics Reliability.

In The Last Decade

Cheng-Ta Ko

9 papers receiving 348 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Cheng-Ta Ko Taiwan	4	339	88	71	67	57	10	355
Masaya Kawano Singapore	13	435 1.3×	70 0.8×	57 0.8×	38 0.6×	80 1.4×	45	465
Kazumasa Tanida Japan	7	344 1.0×	60 0.7×	32 0.5×	64 1.0×	65 1.1×	14	360
Pierric Gueguen France	11	355 1.0×	80 0.9×	96 1.4×	30 0.4×	58 1.0×	20	390
Chau‐Jie Zhan Taiwan	14	451 1.3×	89 1.0×	61 0.9×	67 1.0×	75 1.3×	56	475
Jang‐Hi Im United States	9	419 1.2×	49 0.6×	74 1.0×	32 0.5×	106 1.9×	16	448
E.B. Liao Singapore	14	465 1.4×	80 0.9×	38 0.5×	47 0.7×	157 2.8×	35	530
Vasarla Nagendra Sekhar Singapore	11	417 1.2×	65 0.7×	50 0.7×	51 0.8×	80 1.4×	64	456
John Slabbekoorn Belgium	13	373 1.1×	33 0.4×	69 1.0×	28 0.4×	88 1.5×	57	401
Scott Pollard United States	14	338 1.0×	57 0.6×	54 0.8×	26 0.4×	84 1.5×	39	380
Sayuri Kohara Japan	9	279 0.8×	51 0.6×	31 0.4×	53 0.8×	64 1.1×	52	310

Countries citing papers authored by Cheng-Ta Ko

Since Specialization

Citations

This map shows the geographic impact of Cheng-Ta Ko's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng-Ta Ko with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng-Ta Ko more than expected).

Fields of papers citing papers by Cheng-Ta Ko

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheng-Ta Ko. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng-Ta Ko. The network helps show where Cheng-Ta Ko may publish in the future.

Co-authorship network of co-authors of Cheng-Ta Ko

This figure shows the co-authorship network connecting the top 25 collaborators of Cheng-Ta Ko. A scholar is included among the top collaborators of Cheng-Ta Ko based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheng-Ta Ko. Cheng-Ta Ko is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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10 of 10 papers shown

1.

Chen, Irene A., et al.. (2024). Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology. 1–2. 1 indexed citations

2.

Chen, Kuan‐Neng, et al.. (2012). Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration. Journal of Nanoscience and Nanotechnology. 12(3). 1821–1828. 1 indexed citations

3.

Ko, Cheng-Ta & Kuan‐Neng Chen. (2012). Reliability of key technologies in 3D integration. Microelectronics Reliability. 53(1). 7–16. 51 indexed citations

4.

Chen, Kuan‐Neng, Chun‐An Cheng, Wei-Ta Huang, & Cheng-Ta Ko. (2011). Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding. Journal of Nanoscience and Nanotechnology. 11(8). 6969–6972. 3 indexed citations

5.

Cheng, Chun‐An, Cheng-Ta Ko, & Kuan‐Neng Chen. (2011). Investigation of bonding temperature for SU-8 materials in wafer-level hybrid bonding technology for 3D IC. 863. 1–2. 1 indexed citations

6.

Ko, Cheng-Ta & Kuan‐Neng Chen. (2011). Low temperature bonding technology for 3D integration. Microelectronics Reliability. 52(2). 302–311. 127 indexed citations

7.

Ko, Cheng-Ta, et al.. (2010). Wafer-to-wafer hybrid bonding technology for 3D IC. 1–5. 20 indexed citations

8.

Ko, Cheng-Ta & Kuan‐Neng Chen. (2009). Wafer-level bonding/stacking technology for 3D integration. Microelectronics Reliability. 50(4). 481–488. 147 indexed citations

9.

Ko, Cheng-Ta, et al.. (2008). Stretchable circuit with elastic bumps. 1381–1386. 1 indexed citations

10.

Chu, J.T., et al.. (2005). MOCVD growth of highly strained 1.3 μm InGaAs:Sb/GaAs vertical cavity surface emitting laser. Journal of Crystal Growth. 287(2). 550–553. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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