Kuan-Hsun Lu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
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- Copper Interconnects and Reliability
Papers in
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- Metallurgical and Alloy Processes 1
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- Copper Interconnects and Reliability 3
Kuan-Hsun Lu
9 papers receiving 473 citations
Peers
Comparison fields: 5 of 17
- Electrical and Electronic Engineering 476
- Electronic, Optical and Magnetic Materials 104
- Automotive Engineering 49
- Mechanical Engineering 79
- Biomedical Engineering 87
Countries citing papers authored by Kuan-Hsun Lu
This map shows the geographic impact of Kuan-Hsun Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kuan-Hsun Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kuan-Hsun Lu more than expected).
Fields of papers citing papers by Kuan-Hsun Lu
This network shows the impact of papers produced by Kuan-Hsun Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kuan-Hsun Lu. The network helps show where Kuan-Hsun Lu may publish in the future.
Co-authors
The 15 scholars most cited alongside Kuan-Hsun Lu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 4 | |
| 2 | 2012 | 95 | |
| 3 | 2011 | 25 | |
| 4 | 2010 | 206 | |
| 5 | 2008 | 4 | |
| 6 | 2006 | 5 | |
| 7 | 2006 | 31 | |
| 8 | 2006 | 94 | |
| 9 | 2006 | 17 |
About Kuan-Hsun Lu
Kuan-Hsun Lu is a scholar working on General Materials Science, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering, having authored 9 papers that have together received 481 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (3 papers), Advanced Surface Polishing Techniques (3 papers), Intermetallics and Advanced Alloy Properties (2 papers), Metallurgical and Alloy Processes (1 paper), Advanced MEMS and NEMS Technologies (1 paper) and Semiconductor materials and devices (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (476 citations), Electronic, Optical and Magnetic Materials (104 citations), Automotive Engineering (49 citations), Mechanical Engineering (79 citations) and Biomedical Engineering (87 citations). Kuan-Hsun Lu has collaborated with scholars based in United States and Taiwan. Frequent co-authors include Paul S. Ho, Suk-Kyu Ryu, Rui Huang, Xuefeng Zhang, Jang‐Hi Im, Jay Im, Min Ding, Tengfei Jiang, Brook Chao and Peng Su. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Journal of Applied Physics and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.