Didier Landru

485 total citations
42 papers, 336 citations indexed

About

Didier Landru is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Didier Landru has authored 42 papers receiving a total of 336 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in Didier Landru's work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Surface Polishing Techniques (9 papers). Didier Landru is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Surface Polishing Techniques (9 papers). Didier Landru collaborates with scholars based in France, United States and Austria. Didier Landru's co-authors include F. Rieutord, Ionut Radu, Y. Bréchet, L. Salvò, Oleg Kononchuk, F. Letertre, L. Clavelier, Pierric Gueguen, L. Di Cioccio and L.L. Chapelon and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Didier Landru

38 papers receiving 327 citations

Peers

Didier Landru

EEE

K.-D. Lang Germany

Ser Choong Chong Singapore

Wei-Lan Chiu Taiwan

П. А. Новиков Russia

Jong-Tae Moon South Korea

Serena Iacovo Belgium

Klaus-Juergen Wolter Germany

Christopher Williams Canada

Su‐Tsai Lu Taiwan

K.-D. Lang Germany

Didier Landru

346 ×1.5

EEE

54 ×0.7

57 ×0.8

48 ×0.7

69 ×1.5

Citations per year, relative to Didier Landru Didier Landru (= 1×) peers K.-D. Lang

Countries citing papers authored by Didier Landru

Since Specialization

Citations

This map shows the geographic impact of Didier Landru's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Didier Landru with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Didier Landru more than expected).

Fields of papers citing papers by Didier Landru

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Didier Landru. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Didier Landru. The network helps show where Didier Landru may publish in the future.

Co-authorship network of co-authors of Didier Landru

This figure shows the co-authorship network connecting the top 25 collaborators of Didier Landru. A scholar is included among the top collaborators of Didier Landru based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Didier Landru. Didier Landru is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Larrey, Vincent, et al.. (2025). Hydroxide and fluoride catalyzed bonding interface closure for low-temperature wafer bonding. Japanese Journal of Applied Physics. 64(3). 03SP06–03SP06. 1 indexed citations

Rieutord, F., et al.. (2024). High temperature evolution of a confined silicon layer. Journal of Applied Physics. 135(24). 2 indexed citations

Rieutord, F., et al.. (2024). High temperature evolution of interfacial metal film bonding two 4H-SiC substrates. Applied Surface Science. 682. 161678–161678. 1 indexed citations

Noël, Paul, Vincent Larrey, Samuel Tardif, et al.. (2024). Hydroxide and Fluoride Catalyzed Bonding Interface Closure for Low Temperature Wafer Bonding. 1–1. 1 indexed citations

Larrey, Vincent, Christophe Morales, Paul Noël, et al.. (2023). Nanosecond Laser Irradiation for Interface Bonding Characterization. ECS Transactions. 112(3). 39–49. 5 indexed citations

Gravouil, Anthony, et al.. (2022). Three-dimensional X-FEM modeling of crack coalescence phenomena in the Smart CutTM technology. Finite Elements in Analysis and Design. 213. 103839–103839. 2 indexed citations

Mazen, Frédéric, et al.. (2021). In Situ Observation of Pressurized Microcrack Growth in Silicon. physica status solidi (a). 218(23). 3 indexed citations

Mazen, Frédéric, et al.. (2021). Experimental study of post-crack vibrations in dynamic fracture. Journal of Applied Physics. 129(18). 2 indexed citations

Landru, Didier, et al.. (2021). Fracture Wake Patterns in Brittle Solids. Physical Review Applied. 15(2). 5 indexed citations

10.

Charles, Matthew, Patricia Pimenta‐Barros, Maxime Argoud, et al.. (2019). SiGe nano-heteroepitaxy: An investigation of the nano-template. Journal of Crystal Growth. 527. 125232–125232. 1 indexed citations

11.

Charles, Matthew, Y. Bogumilowicz, Quang Minh Thai, et al.. (2018). SiGe nano-heteroepitaxy on Si and SiGe nano-pillars. Nanotechnology. 29(27). 275702–275702. 5 indexed citations

12.

Mazen, F., Didier Landru, Samuel Tardif, et al.. (2018). Crack Front Interaction with Self-Emitted Acoustic Waves. Physical Review Letters. 121(19). 195501–195501. 15 indexed citations

13.

Charles, Matthew, Y. Bogumilowicz, Patricia Pimenta‐Barros, et al.. (2018). Nano-Heteroepitaxy: An Investigation of SiGe Nano-Pillars Coalescence. ECS Transactions. 86(7). 249–258. 1 indexed citations

14.

Rieutord, F., Samuel Tardif, Didier Landru, et al.. (2016). Edge Water Penetration in Direct Bonding Interface. ECS Meeting Abstracts. MA2016-02(32). 2087–2087.

15.

Reboh, S., F. Rieutord, F. Mazen, et al.. (2013). Effect of H-implantation in the local elastic properties of silicon crystals. Applied Physics Letters. 103(18). 181911–181911. 13 indexed citations

16.

Penot, Jean-Daniel, F. Rieutord, Frédéric Mazen, et al.. (2013). Development of microcracks in hydrogen-implanted silicon substrates. Journal of Applied Physics. 114(12). 16 indexed citations

17.

Landru, Didier, et al.. (2010). Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 1. 1–4. 8 indexed citations

18.

Landru, Didier, Y. Bréchet, & C. Tassin. (2002). Aide information à la sélection des revêtements et des traitements de surface. Matériaux & Techniques. 90(1-2). 3–18. 2 indexed citations

19.

Bréchet, Y., et al.. (2001). Challenges in materials and process selection. Progress in Materials Science. 46(3-4). 407–428. 43 indexed citations

20.

Salvò, L., et al.. (1999). Optimum design of metal foam in sandwich structures using genetic algorithm. HAL (Le Centre pour la Communication Scientifique Directe). 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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