Ming‐Jer Kao

2.4k citations

121 papers · 1.7k indexed · h-index 24

Impact in

Electrical and Electronic Engineering top 5%
- Advanced Memory and Neural Computing
- Ferroelectric and Negative Capacitance Devices
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
Hardware and Architecture top 5%

Papers in ⓘ

Electrical and Electronic Engineering 101
- 3D IC and TSV technologies 39
- Advanced Memory and Neural Computing 37
- Electronic Packaging and Soldering Technologies 31
- Ferroelectric and Negative Capacitance Devices 27
- Semiconductor materials and devices 23
Materials Chemistry 22
- Phase-change materials and chalcogenides 13

Co-authors: Ming‐Jinn Tsai (38 shared papers)Frederick T. Chen (17 shared papers)John H. Lau (32 shared papers)Heng-Yuan Lee (11 shared papers)S. Maikap (13 shared papers)Shyh-Shyuan Sheu (16 shared papers)Keng-Li Su (13 shared papers)Tzu-Kun Ku (21 shared papers)
Journals: Japanese Journal of Applied Physics (7 papers)Applied Physics Letters (5 papers)Physics of Fluids (5 papers)IEEE Electron Device Letters (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)
Partner nations: Taiwan United States Sweden

In The Last Decade

Ming‐Jer Kao

113 papers receiving 1.6k citations

Peers

Countries citing papers authored by Ming‐Jer Kao

Since Specialization

Citations

This map shows the geographic impact of Ming‐Jer Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming‐Jer Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming‐Jer Kao more than expected).

Fields of papers citing papers by Ming‐Jer Kao

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ming‐Jer Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming‐Jer Kao. The network helps show where Ming‐Jer Kao may publish in the future.

Co-authors

The 25 scholars most cited alongside Ming‐Jer Kao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Ming‐Jer Kao Line = papers co-authored together Ming‐Jer Kao links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 121 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Redox Reaction Switching Mechanism in RRAM Device With $\hbox{Pt/CoSiO}_{X}\hbox{/}\hbox{TiN}$ Structure IEEE Electron Device Letters ·Yong-En Syu, Ting‐Chang Chang, Tsung‐Ming Tsai, Ya-Chi Hung, Kuan‐Chang Chang, Ming‐Jinn Tsai, Ming‐Jer Kao, Simon M. Sze	2011	114
2	A High-Speed 7.2-ns Read-Write Random Access 4-Mb Embedded Resistive RAM (ReRAM) Macro Using Process-Variation-Tolerant Current-Mode Read Schemes IEEE Journal of Solid-State Circuits ·Meng‐Fan Chang, Shyh-Shyuan Sheu, Ku-Feng Lin, Che-Wei Wu, Chia-Chen Kuo, Pi-Feng Chiu, Yih-Shan Yang, Yu-Sheng Chen, Heng-Yuan Lee, Chenhsin Lien, Frederick T. Chen, Keng-Li Su, Tzu-Kun Ku, Ming‐Jer Kao, Ming‐Jinn Tsai	2013	78
3	Interfacial and annealing effects on magnetic properties of CoFeB thin films Journal of Applied Physics ·Yung-Hung Wang, Wei‐Chuan Chen, Shan-Yi Yang, Kuei‐Hung Shen, Chando Park, Ming‐Jer Kao, Ming‐Jinn Tsai	2006	77
4	Excellent resistive memory characteristics and switching mechanism using a Ti nanolayer at the Cu/TaOx interface Nanoscale Research Letters ·S. Z. Rahaman, S. Maikap, Ta–Chang Tien, Heng-Yuan Lee, Wei-Su Chen, Frederick T. Chen, Ming‐Jer Kao, Ming‐Jinn Tsai	2012	71
5	A 5ns fast write multi-level non-volatile 1 K bits RRAM memory with advance write scheme Shyh-Shyuan Sheu, Pei-Chia Chiang, Wen-Pin Lin, Heng-Yuan Lee, Pang-Shiu Chen, Yu‐Sheng Chen, Tai-Yuan Wu, Frederick T. Chen, Keng-Li Su, Ming‐Jer Kao, Kuo‐Hsing Cheng, Ming‐Jinn Tsai	2009	70
6	Repeatable unipolar/bipolar resistive memory characteristics and switching mechanism using a Cu nanofilament in a GeOx film Applied Physics Letters ·S. Z. Rahaman, S. Maikap, Wen‐Shan Chen, H. Y. Lee, F. T. Chen, Ming‐Jer Kao, M.-J. Tsai	2012	51
7	Formation polarity dependent improved resistive switching memory characteristics using nanoscale (1.3 nm) core-shell IrOx nano-dots Nanoscale Research Letters ·Writam Banerjee, S. Maikap, Chao‐Sung Lai, Yiyan Chen, Ta–Chang Tien, Heng-Yuan Lee, Wei-Su Chen, Frederick T. Chen, Ming‐Jer Kao, Ming‐Jinn Tsai, Jer‐Ren Yang	2012	48
8	How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration? Wei‐Chi Tsai, Hwan‐You Chang, Chi‐Hsien Chien, John H. Lau, Han Fu, Chia‐Wei Chiang, T. Y. Kuo, Yizheng Chen, Robert Lo, Ming‐Jer Kao	2011	45
9	Fast-Write Resistive RAM (RRAM) for Embedded Applications IEEE Design & Test of Computers ·Shyh-Shyuan Sheu, Kuo‐Hsing Cheng, Meng‐Fan Chang, Pei-Chia Chiang, Wen-Pin Lin, Heng-Yuan Lee, Pang-Shiu Chen, Yu‐Sheng Chen, Tai-Yuan Wu, Frederick T. Chen, Keng-Li Su, Ming‐Jer Kao, Ming‐Jinn Tsai	2010	44
10	A ReRAM integrated 7T2R non-volatile SRAM for normally-off computing application Shyh-Shyuan Sheu, Chia-Chen Kuo, Meng‐Fan Chang, Pei-Ling Tseng, Lin Chih-Sheng, Min-Chuan Wang, Chih-He Lin, Wen-Pin Lin, Tsai-Kan Chien, Sih-Han Lee, Szu-Chieh Liu, Heng-Yuan Lee, Pang-Shiu Chen, Yu‐Sheng Chen, Ching-Chih Hsu, Frederick T. Chen, Keng-Li Su, Tzu-Kun Ku, Ming‐Jinn Tsai, Ming‐Jer Kao	2013	42
11	ReRAM-based 4T2R nonvolatile TCAM with 7x NVM-stress reduction, and 4x improvement in speed-wordlength-capacity for normally-off instant-on filter-based search engines used in big-data processing Li-Yue Huang, Meng‐Fan Chang, Ching-Hao Chuang, Chia-Chen Kuo, Chien-Fu Chen, Geng-Hau Yang, Hsiang-Jen Tsai, Tien-Fu Chen, Shyh-Shyuan Sheu, Keng-Li Su, Frederick T. Chen, Tzu-Kun Ku, Ming‐Jinn Tsai, Ming‐Jer Kao	2014	42
12	Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking Yu-Min Lin, Chau‐Jie Zhan, Jing-Ye Juang, John H. Lau, Tai‐Hong Chen, Robert Lo, Ming‐Jer Kao, Tian Tian, K. N. Tu	2011	37
13	Impact of incomplete set programing on the performance of phase change memory cell Applied Physics Letters ·Der-Sheng Chao, Chenhsin Lien, Chain‐Ming Lee, Yi-Chan Chen, Jyi-Tyan Yeh, Fred K. Chen, Ming‐Jung Chen, Philip H. Yen, Ming‐Jer Kao, Ming‐Jinn Tsai	2008	36
14	Bipolar resistive switching of chromium oxide for resistive random access memory Solid-State Electronics ·Shih-Cheng Chen, Ting‐Chang Chang, Shih‐Yang Chen, Chi‐Wen Chen, Shih-Ching Chen, Simon M. Sze, Ming‐Jinn Tsai, Ming‐Jer Kao, Fon-Shan Yeh	2011	36
15	A low store energy, low VDDmin, nonvolatile 8T2R SRAM with 3D stacked RRAM devices for low power mobile applications Pi-Feng Chiu, Meng‐Fan Chang, Shyh-Shyuan Sheu, Ku-Feng Lin, Pei-Chia Chiang, Che-Wei Wu, Wen-Pin Lin, Chih-He Lin, Ching-Chih Hsu, Frederick T. Chen, Keng-Li Su, Ming‐Jer Kao, Ming‐Jinn Tsai	2010	35
16	Reduction in critical current density for spin torque transfer switching with composite free layer Applied Physics Letters ·Cheng-Tyng Yen, Wei‐Chuan Chen, Ding-Yeong Wang, Yuan-Jen Lee, Chih-Ta Shen, Shan-Yi Yang, Ching-Hsiang Tsai, Chien‐Ching Hung, Kuei‐Hung Shen, Ming‐Jinn Tsai, Ming‐Jer Kao	2008	34
17	Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang, Huan‐Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, John H. Lau, Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo‐Shu Kao, Yulan Lu, Robert Lo, Ming‐Jer Kao	2011	32
18	Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers Yu-Chen Hsin, Chien‐Chou Chen, John H. Lau, Pei-Jer Tzeng, Shang-Hung Shen, Y. Y. Hsu, Shang-Chun Chen, Chien-Ying Wn, Jui‐Chin Chen, Tzu-Kun Ku, Ming‐Jer Kao	2011	32
19	Through-Silicon Hole Interposers for 3-D IC Integration IEEE Transactions on Components Packaging and Manufacturing Technology ·John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan, Sheng-Tsai Wu, Fang‐Lin Chao, Ming-Ji Dai, Ra-Min Tain, Heng-Chieh Chien, Jui-Feng Hung, Chun-Hsien Chien, Ren-Shing Cheng, Yu-Wei Huang, Yu-Mei Cheng, Li-Ling Liao, Wei‐Chung Lo, Ming‐Jer Kao	2014	32
20	59‐2: Invited Paper: Ultra‐Fine Pitch Thin‐Film Micro LED Display for Indoor Applications SID Symposium Digest of Technical Papers ·Chien‐Chung Lin, Yen‐Hsiang Fang, Ming‐Jer Kao, Ping-Kai Huang, Feng-Pin Chang, Li-Chang Yang, Chih‐I Wu	2018	31

About Ming‐Jer Kao

Ming‐Jer Kao is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Atomic and Molecular Physics, and Optics, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 121 papers that have together received 1.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (39 papers), Advanced Memory and Neural Computing (37 papers), Electronic Packaging and Soldering Technologies (31 papers), Ferroelectric and Negative Capacitance Devices (27 papers), Semiconductor materials and devices (23 papers), Phase-change materials and chalcogenides (13 papers), Magnetic properties of thin films (11 papers) and Coastal and Marine Dynamics (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Hardware and Architecture (91 citations), Polymers and Plastics (189 citations), Earth-Surface Processes (73 citations) and Automotive Engineering (127 citations). Ming‐Jer Kao has collaborated with scholars based in Taiwan, United States and Sweden. Frequent co-authors include Ming‐Jinn Tsai, Frederick T. Chen, John H. Lau, Heng-Yuan Lee, S. Maikap, Shyh-Shyuan Sheu, Keng-Li Su, Tzu-Kun Ku, Wei-Su Chen and S. Z. Rahaman. Their work appears in journals such as Japanese Journal of Applied Physics, Applied Physics Letters, Physics of Fluids, IEEE Electron Device Letters and IEEE Transactions on Components Packaging and Manufacturing Technology.

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