Philippe Soussan

1.5k citations

91 papers · 1.0k · h-index 18

Impact in

Electrical and Electronic Engineering top 5%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
- Photonic and Optical Devices
Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies

Papers in

Electrical and Electronic Engineering 82
- 3D IC and TSV technologies 43
- Electronic Packaging and Soldering Technologies 31
- Photonic and Optical Devices 17
- Advanced MEMS and NEMS Technologies 16
- Radio Frequency Integrated Circuit Design 8
Biomedical Engineering 36
- Nanofabrication and Lithography Techniques 11
- Acoustic Wave Resonator Technologies 10

Co-authors: Eric Beyne (24 shared papers)Deniz Sabuncuoglu Tezcan (21 shared papers)Bart Swinnen (9 shared papers)Andy Lambrechts (2 shared papers)Yann Civale (9 shared papers)Riet Labie (4 shared papers)H.A.C. Tilmans (13 shared papers)Nicolaas Tack (1 shared paper)
Journals: Japanese Journal of Applied Physics (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Sensors and Actuators A Physical (2 papers)Microelectronic Engineering (2 papers)IEEE Transactions on Advanced Packaging (1 paper)
Partner nations: Belgium Netherlands Japan

In The Last Decade

Philippe Soussan

87 papers receiving 983 citations

Peers

Countries citing papers authored by Philippe Soussan

Since Specialization

Citations

This map shows the geographic impact of Philippe Soussan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Philippe Soussan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Philippe Soussan more than expected).

Fields of papers citing papers by Philippe Soussan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Philippe Soussan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Philippe Soussan. The network helps show where Philippe Soussan may publish in the future.

Co-authors

The 25 scholars most cited alongside Philippe Soussan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Philippe Soussan Line = papers co-authored together Philippe Soussan links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 91 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Cu/Sn microbumps interconnect for 3D TSV chip stacking Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Riet Labie, Biljana Dimčić, Alain Phommahaxay, Philippe Soussan	2010	87
2	A compact, high-speed, and low-cost hyperspectral imager Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Nicolaas Tack, Andy Lambrechts, Philippe Soussan, L. Haspeslagh	2012	85
3	Through-silicon via and die stacking technologies for microsystems-integration Eric Beyne, Piet De Moor, Wouter Ruythooren, Riet Labie, Anne Jourdain, H.A.C. Tilmans, Deniz Sabuncuoglu Tezcan, Philippe Soussan, Bart Swinnen, R. Cartuyvels	2008	66
4	3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias IEEE Transactions on Components Packaging and Manufacturing Technology ·Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen, Fabrice Duval, Patrick Jaenen, Youssef Travaly, Philippe Soussan, Bart Swinnen, Eric Beyne	2011	42
5	Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging Deniz Sabuncuoglu Tezcan, Fabrice Duval, Harold Philipsen, Ole Lühn, Philippe Soussan, Bart Swinnen	2009	41
6	A CMOS-compatible, integrated approach to hyper- and multispectral imaging Andy Lambrechts, Pilar Gonzalez, Bert Geelen, Philippe Soussan, Klaas Tack, Murali Jayapala	2014	41
7	Polymer Filling of Silicon Trenches for 3-D Through Silicon vias Applications IEEE Transactions on Components Packaging and Manufacturing Technology ·Fabrice Duval, Chukwudi Okoro, Yann Civale, Philippe Soussan, Eric Beyne	2011	30
8	High-pulse-energy III-V-on-silicon-nitride mode-locked laser APL Photonics ·Artur Hermans, Kasper Van Gasse, Jon Kjellman, Charles Caër, Tasuku Nakamura, Yasuhisa Inada, Kazuya Hisada, Taku Hirasawa, Stijn Cuyvers, Sulakshna Kumari, Aleksandrs Marinins, Roelof Jansen, Günther Roelkens, Philippe Soussan, Xavier Rottenberg, Bart Kuyken	2021	26
9	Electrically yielding Collective Hybrid Bonding for 3D stacking of ICs Anne Jourdain, Philippe Soussan, Bart Swinnen, Eric Beyne	2009	25
10	Effect of substrate charging on the reliability of capacitive RF MEMS switches Sensors and Actuators A Physical ·P. Czarnecki, Xavier Rottenberg, Philippe Soussan, P. Ekkels, Philippe Müller, P. Nolmans, W. De Raedt, H.A.C. Tilmans, Robert Puers, L. Marchand, Ingrid De Wolf	2008	25
11	Grating devices on a silicon nitride technology platform for visible light applications OSA Continuum ·Jeong Hwan Song, Tangla D. Kongnyuy, Benedetto Troia, Sandeep Seema Saseendran, Philippe Soussan, Roelof Jansen, Xavier Rottenberg	2019	23
12	High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA IEEE Transactions on Advanced Packaging ·Xiao Sun, O. Dupuis, Dimitri Linten, G. Carchon, Philippe Soussan, Stefaan Decoutere, W. De Raedt, Eric Beyne	2006	21
13	Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen, Patrick Jaenen, Rahul Agarwal, Fabrice Duval, Philippe Soussan, Youssef Travaly, Eric Beyne	2009	20
14	24 GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors O. Dupuis, Xiao Sun, G. Carchon, Philippe Soussan, Mattias Ferndahl, S. Decoutere, W. De Raedt	2005	20
15	Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration W. Zhang, Paresh Limaye, Yann Civale, Riet Labie, Philippe Soussan	2010	20
16	Influence of the substrate on the lifetime of capacitive RF MEMS switches Proceedings, IEEE micro electro mechanical systems ·P. Czarnecki, Xavier Rottenberg, Philippe Soussan, P. Ekkels, Philippe Müller, P. Nolmans, W. De Raedt, H.A.C. Tilmans, Robert Puers, L. Marchand, Ingrid De Wolf	2008	19
17	Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections W. Zhang, B. Dimcic P. Limaye, Antonio Manna, Philippe Soussan, Eric Beyne	2011	19
18	3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies F. Iker, Deniz Sabuncuoglu Tezcan, Ricardo Cotrin Teixeira, Philippe Soussan, Piet De Moor, Eric Beyne, Kris Baert	2007	17
19	High density 20μm pitch CuSn microbump process for high-end 3D applications Joeri De Vos, Anne Jourdain, Mehmet Akif Erişmiş, W. Zhang, Koen De Munck, Antonio Manna, Deniz Sabuncuoglu Tezcan, Philippe Soussan	2011	17
20	New insights into charging in capacitive RF MEMS switches P. Czarnecki, Xavier Rottenberg, Philippe Soussan, P. Nolmans, P. Ekkels, Philippe Müller, H.A.C. Tilmans, W. De Raedt, Robert Puers, L. Marchand, Ingrid De Wolf	2008	17

About Philippe Soussan

Philippe Soussan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics, Automotive Engineering and Mechanical Engineering, having authored 91 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (31 papers), Photonic and Optical Devices (17 papers), Advanced MEMS and NEMS Technologies (16 papers), Nanofabrication and Lithography Techniques (11 papers), Acoustic Wave Resonator Technologies (10 papers), Additive Manufacturing and 3D Printing Technologies (10 papers) and Radio Frequency Integrated Circuit Design (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (861 citations), Automotive Engineering (99 citations), Biomedical Engineering (282 citations), Atomic and Molecular Physics, and Optics (188 citations) and Media Technology (42 citations). Philippe Soussan has collaborated with scholars based in Belgium, Netherlands and Japan. Frequent co-authors include Eric Beyne, Deniz Sabuncuoglu Tezcan, Bart Swinnen, Andy Lambrechts, Yann Civale, Riet Labie, H.A.C. Tilmans, Nicolaas Tack, L. Haspeslagh and Paresh Limaye. Their work appears in journals such as Japanese Journal of Applied Physics, IEEE Transactions on Components Packaging and Manufacturing Technology, Sensors and Actuators A Physical, Microelectronic Engineering and IEEE Transactions on Advanced Packaging.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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