Philippe Soussan

1.5k total citations
91 papers, 1.0k citations indexed

About

Philippe Soussan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Philippe Soussan has authored 91 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 82 papers in Electrical and Electronic Engineering, 36 papers in Biomedical Engineering and 17 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Philippe Soussan's work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (31 papers) and Photonic and Optical Devices (17 papers). Philippe Soussan is often cited by papers focused on 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (31 papers) and Photonic and Optical Devices (17 papers). Philippe Soussan collaborates with scholars based in Belgium, Netherlands and Japan. Philippe Soussan's co-authors include Eric Beyne, Deniz Sabuncuoglu Tezcan, Andy Lambrechts, Bart Swinnen, Yann Civale, Riet Labie, H.A.C. Tilmans, L. Haspeslagh, Nicolaas Tack and Paresh Limaye and has published in prestigious journals such as Optics Letters, Japanese Journal of Applied Physics and Journal of Lightwave Technology.

In The Last Decade

Philippe Soussan

87 papers receiving 983 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Philippe Soussan Belgium	18	861	282	188	99	73	91	1.0k
Erik Beckert Germany	17	456 0.5×	534 1.9×	167 0.9×	58 0.6×	53 0.7×	96	969
K. Warner United States	12	766 0.9×	115 0.4×	106 0.6×	80 0.8×	24 0.3×	42	875
Chenglin Gu China	20	589 0.7×	189 0.7×	606 3.2×	29 0.3×	38 0.5×	85	924
C.L. Keast United States	21	1.5k 1.8×	387 1.4×	302 1.6×	87 0.9×	83 1.1×	69	1.8k
Brian Morgan United States	15	563 0.7×	428 1.5×	110 0.6×	30 0.3×	27 0.4×	49	1.0k
Yingtao Ding China	17	784 0.9×	266 0.9×	144 0.8×	23 0.2×	173 2.4×	98	1.1k
Guoliang Deng China	15	387 0.4×	159 0.6×	222 1.2×	15 0.2×	51 0.7×	109	714
J.M. Knecht United States	12	684 0.8×	142 0.5×	112 0.6×	78 0.8×	16 0.2×	37	735
H. Kück Germany	14	607 0.7×	331 1.2×	181 1.0×	15 0.2×	29 0.4×	44	774

Countries citing papers authored by Philippe Soussan

Since Specialization

Citations

This map shows the geographic impact of Philippe Soussan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Philippe Soussan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Philippe Soussan more than expected).

Fields of papers citing papers by Philippe Soussan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Philippe Soussan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Philippe Soussan. The network helps show where Philippe Soussan may publish in the future.

Co-authorship network of co-authors of Philippe Soussan

This figure shows the co-authorship network connecting the top 25 collaborators of Philippe Soussan. A scholar is included among the top collaborators of Philippe Soussan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Philippe Soussan. Philippe Soussan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Li, Yunlong, Vasyl Motsnyi, Wei Wei, et al.. (2023). Wafer Reconstitution: embedded multi-die III-V and silicon co-integration platform. 2 indexed citations

Zhu, Jianjun, Min Huang, & Philippe Soussan. (2022). 38 GHz T/R Heterogeneous Integrated Module. 1–3. 2 indexed citations

Prost, Mathias, H. K. Tyagi, Sarvagya Dwivedi, et al.. (2022). Densely Integrated Phase Interrogators for Low-Complexity On-Chip Calibration of Optical Phased Arrays. Journal of Lightwave Technology. 40(16). 5660–5667. 9 indexed citations

Cherman, Vladimir, et al.. (2019). High heat flux dissipation via interposer active micro-cooling. Japanese Journal of Applied Physics. 58(SB). SBBB11–SBBB11. 5 indexed citations

Dwivedi, Sarvagya, Sarp Kerman, Roelof Jansen, et al.. (2019). Silicon photonics co-integrated with silicon nitride for optical phased arrays. Japanese Journal of Applied Physics. 59(SG). SGGE02–SGGE02. 12 indexed citations

Welkenhuysen, Marleen, Silke Musa, S. Severi, et al.. (2015). High-density optrode-electrode neural probe using SixNy photonics for in vivo optogenetics. Lirias (KU Leuven). 29.5.1–29.5.4. 13 indexed citations

Tack, Nicolaas, Andy Lambrechts, Philippe Soussan, & L. Haspeslagh. (2012). A compact, high-speed, and low-cost hyperspectral imager. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8266. 82660Q–82660Q. 85 indexed citations

Pham, Nga, Vladimir Cherman, Bart Vandevelde, et al.. (2011). Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding. 1588–1595. 6 indexed citations

Vos, Joeri De, Koen De Munck, Wen Qi Zhang, et al.. (2011). Hybrid Backside Illuminated CMOS Imager for High-End Applications. ECS Transactions. 35(30). 53–63. 1 indexed citations

10.

Agarwal, Rahul, Wenqi Zhang, Paresh Limaye, et al.. (2010). Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1254–1281. 2 indexed citations

11.

Civale, Yann, Deniz Sabuncuoglu Tezcan, Harold Philipsen, et al.. (2009). Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 1–4. 20 indexed citations

12.

Agarwal, Rahul, et al.. (2009). Diamond bit cutting for processing high topography wafers. 267–271. 13 indexed citations

13.

Tezcan, Deniz Sabuncuoglu, et al.. (2009). Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging. 1159–1164. 41 indexed citations

14.

Pan, Wanling, Philippe Soussan, Bart Nauwelaers, & H.A.C. Tilmans. (2006). Design and fabrication of a surface micromachined frequency tunable film bulk acoustic resonator with an extended electrostatic tuning range. 3. 1840–1843. 4 indexed citations

15.

Pan, Wanling, Philippe Soussan, Bart Nauwelaers, Raya Mertens, & H.A.C. Tilmans. (2006). A Comparison Between Tunable Fbars with an Integrated and with a Discrete Variable MEMS Capacitor. 902–905. 1 indexed citations

16.

Sun, Xiao, Dimitri Linten, G. Carchon, et al.. (2006). High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA. IEEE Transactions on Advanced Packaging. 29(4). 810–817. 21 indexed citations

17.

Carchon, G., et al.. (2006). Ar Implantation, a Passivation Technique for High-Resistivity Silicon within the MCM-D Technology. 21–24. 11 indexed citations

18.

Drăgoi, Viorel, et al.. (2006). Wafer-scale BCB Resist-Processing Technologies for High Density Integration and Electronic Packaging. 5116. 187–191. 1 indexed citations

19.

Thijs, S., D. Linten, M. Natarajan, et al.. (2005). Class 3 HBM and class M4 MM ESD protected 5.5 GHz LNA in 90 nm RFCMOS using above-IC inductor. VUBIR (Vrije Universiteit Brussel). 1–8. 2 indexed citations

20.

Pan, Wanling, Philippe Soussan, Bart Nauwelaers, & H.A.C. Tilmans. (2004). A surface micromachined tunable film bulk acoustic resonator. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5455. 166–166. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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