Ra-Min Tain

417 total citations
25 papers, 320 citations indexed

About

Ra-Min Tain is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Ra-Min Tain has authored 25 papers receiving a total of 320 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 6 papers in Biomedical Engineering. Recurrent topics in Ra-Min Tain's work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (17 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). Ra-Min Tain is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (17 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). Ra-Min Tain collaborates with scholars based in Taiwan, United States and Canada. Ra-Min Tain's co-authors include Fang‐Lin Chao, Chun-Kai Liu, Heng-Chieh Chien, John H. Lau, Ming-Ji Dai, Wei‐Chung Lo, D.C. Groeneveld, Ming‐Jer Kao, Siyuan Cheng and Peng Su and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Microelectronic Engineering and Journal of Electronic Packaging.

In The Last Decade

Ra-Min Tain

23 papers receiving 301 citations

Peers

Ra-Min Tain
N. Seliger Germany
Joshua Major United States
Kevin Robinson United Kingdom
Raphael Mandel United States
Mohamad Abo Ras Germany
Finbarr Waldron Ireland
Mark Mihalic United States
Vadim Gektin United States
N. Seliger Germany
Ra-Min Tain
Citations per year, relative to Ra-Min Tain Ra-Min Tain (= 1×) peers N. Seliger

Countries citing papers authored by Ra-Min Tain

Since Specialization
Citations

This map shows the geographic impact of Ra-Min Tain's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ra-Min Tain with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ra-Min Tain more than expected).

Fields of papers citing papers by Ra-Min Tain

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ra-Min Tain. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ra-Min Tain. The network helps show where Ra-Min Tain may publish in the future.

Co-authorship network of co-authors of Ra-Min Tain

This figure shows the co-authorship network connecting the top 25 collaborators of Ra-Min Tain. A scholar is included among the top collaborators of Ra-Min Tain based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ra-Min Tain. Ra-Min Tain is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tain, Ra-Min, et al.. (2016). 3D SiP Assembly and Reliability for Glass Substrate with Through Vias. IMAPSource Proceedings. 2016(1). 282–287.
2.
Chen, Yu Hua, et al.. (2015). Embedded glass interposer for heterogeneous multi-chip integration. 314–317. 15 indexed citations
3.
Lin, Yu-Min, Tao‐Chih Chang, Wei‐Chung Lo, et al.. (2015). A TXV-less Packaging Platform for the Era of IoTs. IMAPSource Proceedings. 2015(1). 1–5. 1 indexed citations
4.
Lau, John H., Chau‐Jie Zhan, Fang‐Lin Chao, et al.. (2014). Low-cost TSH (through-silicon hole) interposers for 3D IC integration. 2. 290–296. 8 indexed citations
5.
Lau, John H., Chau‐Jie Zhan, Fang‐Lin Chao, et al.. (2014). Through-Silicon Hole Interposers for 3-D IC Integration. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(9). 1407–1419. 32 indexed citations
6.
Chen, Yuhua, et al.. (2014). Embed glass interposer to substrate for high density interconnection. 360–364. 4 indexed citations
7.
Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2012). Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications. 1866–1873. 41 indexed citations
8.
Lau, John H., Heng-Chieh Chien, Ming-Ji Dai, et al.. (2012). Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs. 1618–1624. 7 indexed citations
9.
Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2012). Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV). Journal of Microelectronics and Electronic Packaging. 9(2). 97–103. 14 indexed citations
10.
Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2011). Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV). IMAPSource Proceedings. 2011(1). 25–32. 13 indexed citations
11.
12.
13.
Hsieh, Ming-Che, et al.. (2011). Energy release rate investigation for through silicon vias (TSVs) in 3D IC integration. 1/7–7/7. 15 indexed citations
14.
Chien, Heng-Chieh, Fang‐Lin Chao, John H. Lau, et al.. (2011). A thermal performance measurement method for blind through silicon vias (TSVs) in a 300mm wafer. 1204–1210. 10 indexed citations
15.
Hsieh, Ming-Che, et al.. (2010). Thermo-mechanical analysis and interfacial energy release rate estimation for metal–insulator–metal capacitor device. Microelectronic Engineering. 88(5). 779–784. 3 indexed citations
16.
Hsieh, Ming-Che, et al.. (2009). The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages. 507–512. 2 indexed citations
17.
Liu, Chun-Kai, et al.. (2005). Cooling performance of silicon-based thermoelectric device on high power LED. 53–56. 67 indexed citations
18.
Culham, J. R., et al.. (2000). Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape. Journal of Electronic Packaging. 123(3). 182–188. 19 indexed citations
19.
Tain, Ra-Min, D.C. Groeneveld, & Siyuan Cheng. (1995). Limitations of the fluid-to-fluid scaling technique for critical heat flux in flow boiling. International Journal of Heat and Mass Transfer. 38(12). 2195–2208. 8 indexed citations
20.
Tain, Ra-Min, Siyuan Cheng, & D.C. Groeneveld. (1993). Critical heat flux measurements in a round tube for CFCs and CFC alternatives. International Journal of Heat and Mass Transfer. 36(8). 3039–2049. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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