Ra-Min Tain
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
Papers in
-
- 3D IC and TSV technologies 19
- Electronic Packaging and Soldering Technologies 17
- Semiconductor Lasers and Optical Devices 4
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- Heat Transfer and Optimization 3
- Refrigeration and Air Conditioning Technologies 3
- Co-authors
- Chun-Kai Liu (4 shared papers)Ming-Ji Dai (14 shared papers)Heng-Chieh Chien (14 shared papers)John H. Lau (11 shared papers)Wei‐Chung Lo (12 shared papers)Ming‐Jer Kao (8 shared papers)Siyuan Cheng (2 shared papers)D.C. Groeneveld (2 shared papers)
- Journals
- International Journal of Heat and Mass Transfer (2 papers)Microelectronic Engineering (1 paper)Applied Thermal Engineering (1 paper)Journal of Electronic Packaging (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- TaiwanUnited StatesCanada
In The Last Decade
Ra-Min Tain
24 papers receiving 314 citations
Peers
Comparison fields: 5 of 32
- Automotive Engineering 56
- Electrical and Electronic Engineering 226
- Condensed Matter Physics 41
- Mechanical Engineering 89
- Civil and Structural Engineering 39
Countries citing papers authored by Ra-Min Tain
This map shows the geographic impact of Ra-Min Tain's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ra-Min Tain with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ra-Min Tain more than expected).
Fields of papers citing papers by Ra-Min Tain
This network shows the impact of papers produced by Ra-Min Tain. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ra-Min Tain. The network helps show where Ra-Min Tain may publish in the future.
Co-authors
The 25 scholars most cited alongside Ra-Min Tain, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 67 | |
| 2 | 2012 | 41 | |
| 3 | 2014 | 32 | |
| 4 | 1993 | 20 | |
| 5 | 2000 | 19 | |
| 6 | 2012 | 16 | |
| 7 | 2015 | 15 | |
| 8 | 2011 | 15 | |
| 9 | 2011 | 13 | |
| 10 | 2012 | 13 | |
| 11 | 2011 | 12 | |
| 12 | 2011 | 10 | |
| 13 | 2013 | 9 | |
| 14 | 1995 | 8 | |
| 15 | 2014 | 8 | |
| 16 | 2012 | 7 | |
| 17 | 2011 | 6 | |
| 18 | 2011 | 5 | |
| 19 | 2012 | 4 | |
| 20 | 2014 | 4 |
About Ra-Min Tain
Ra-Min Tain is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Automotive Engineering and Civil and Structural Engineering, having authored 26 papers that have together received 336 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (17 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Semiconductor Lasers and Optical Devices (4 papers), Advanced Surface Polishing Techniques (4 papers), Heat Transfer and Optimization (3 papers), Refrigeration and Air Conditioning Technologies (3 papers) and Advanced Thermoelectric Materials and Devices (3 papers). The work is most often cited by research in Automotive Engineering (56 citations), Electrical and Electronic Engineering (226 citations), Condensed Matter Physics (41 citations), Mechanical Engineering (89 citations) and Civil and Structural Engineering (39 citations). Ra-Min Tain has collaborated with scholars based in Taiwan, United States and Canada. Frequent co-authors include Chun-Kai Liu, Ming-Ji Dai, Heng-Chieh Chien, John H. Lau, Wei‐Chung Lo, Ming‐Jer Kao, Siyuan Cheng, D.C. Groeneveld, Jianyi Xue and M. Brillhart. Their work appears in journals such as International Journal of Heat and Mass Transfer, Microelectronic Engineering, Applied Thermal Engineering, Journal of Electronic Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.