Ming-Ji Dai

485 total citations
29 papers, 359 citations indexed

About

Ming-Ji Dai is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Automotive Engineering. According to data from OpenAlex, Ming-Ji Dai has authored 29 papers receiving a total of 359 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 8 papers in Materials Chemistry and 7 papers in Automotive Engineering. Recurrent topics in Ming-Ji Dai's work include 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (16 papers) and Advanced Thermoelectric Materials and Devices (8 papers). Ming-Ji Dai is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (16 papers) and Advanced Thermoelectric Materials and Devices (8 papers). Ming-Ji Dai collaborates with scholars based in Taiwan, United States and Netherlands. Ming-Ji Dai's co-authors include Heng-Chieh Chien, Chun-Kai Liu, Ra-Min Tain, John H. Lau, Fang‐Lin Chao, Wei‐Chung Lo, Ming‐Jer Kao, Chau‐Jie Zhan, Peng Su and Kuo‐Ning Chiang and has published in prestigious journals such as Journal of Applied Physics, Computers in Biology and Medicine and Journal of Electronic Materials.

In The Last Decade

Ming-Ji Dai

28 papers receiving 332 citations

Peers

Ming-Ji Dai

EEE

MC

BE

CSE

AE

Ra-Min Tain Taiwan

Zhao Tang China

Kevin Robinson United Kingdom

K. Matsunaga Japan

M. H. Lim United States

Michele Calabretta Italy

Hiroyuki Juso Japan

Elisha Rejovitzky Israel

Maximilian Schmid Germany

N. Seliger Germany

Ra-Min Tain Taiwan

Ming-Ji Dai

218 ×0.8

EEE

32 ×0.3

MC

67 ×1.0

BE

37 ×0.6

CSE

56 ×1.0

AE

Citations per year, relative to Ming-Ji Dai Ming-Ji Dai (= 1×) peers Ra-Min Tain

Countries citing papers authored by Ming-Ji Dai

Since Specialization

Citations

This map shows the geographic impact of Ming-Ji Dai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming-Ji Dai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming-Ji Dai more than expected).

Fields of papers citing papers by Ming-Ji Dai

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ming-Ji Dai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming-Ji Dai. The network helps show where Ming-Ji Dai may publish in the future.

Co-authorship network of co-authors of Ming-Ji Dai

This figure shows the co-authorship network connecting the top 25 collaborators of Ming-Ji Dai. A scholar is included among the top collaborators of Ming-Ji Dai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ming-Ji Dai. Ming-Ji Dai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

1.

Liu, Chien‐Liang, Min‐Hsuan Lee, Chun‐Ju Lin, et al.. (2024). A bagging approach for improved predictive accuracy of intradialytic hypotension during hemodialysis treatment. Computers in Biology and Medicine. 172. 108244–108244. 4 indexed citations

2.

Zhang, Jie, Po-Tsang Huang, Sih-Han Li, et al.. (2022). An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 262–263. 3 indexed citations

3.

Liu, Chun-Kai, et al.. (2014). Electro-thermal finite element analysis and verification of power module with aluminum wire. Microelectronic Engineering. 120. 114–120. 25 indexed citations

4.

Lau, John H., Chau‐Jie Zhan, Fang‐Lin Chao, et al.. (2014). Low-cost TSH (through-silicon hole) interposers for 3D IC integration. 2. 290–296. 8 indexed citations

5.

Lau, John H., Chau‐Jie Zhan, Fang‐Lin Chao, et al.. (2014). Through-Silicon Hole Interposers for 3-D IC Integration. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(9). 1407–1419. 32 indexed citations

6.

Chien, Heng-Chieh, et al.. (2013). Evaluation of Temperature-Dependent Effective Material Properties and Performance of a Thermoelectric Module. Journal of Electronic Materials. 42(7). 2362–2370. 10 indexed citations

7.

Dai, Ming-Ji, et al.. (2013). Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound. Microelectronic Engineering. 120. 194–199. 5 indexed citations

8.

Chien, Heng-Chieh, Ming-Ji Dai, Yu-Min Lin, et al.. (2013). Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration. IMAPSource Proceedings. 2013(1). 618–624. 32 indexed citations

9.

Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2012). Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications. 1866–1873. 41 indexed citations

10.

Zhan, Chau‐Jie, Pei-Jer Tzeng, John H. Lau, et al.. (2012). Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP. 548–554. 14 indexed citations

11.

Lau, John H., Heng-Chieh Chien, Ming-Ji Dai, et al.. (2012). Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs. 1618–1624. 7 indexed citations

12.

Tzeng, Pei-Jer, John H. Lau, Ming-Ji Dai, et al.. (2012). Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer. 32. 1731–1737. 6 indexed citations

13.

Lau, John H., Pei-Jer Tzeng, Chau‐Jie Zhan, et al.. (2012). Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP). IMAPSource Proceedings. 2012(1). 1209–1214. 6 indexed citations

14.

Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2011). Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV). IMAPSource Proceedings. 2011(1). 25–32. 13 indexed citations

15.

Liu, Chun-Kai, et al.. (2011). Hot spot cooling in 3DIC package utilizing embedded thermoelectric cooler combined with silicon interposer. 470–473. 6 indexed citations

16.

Hsieh, Ming-Che, et al.. (2009). The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages. 507–512. 2 indexed citations

17.

Liu, Chun-Kai, Heng-Chieh Chien, Ming-Ji Dai, et al.. (2008). Thermal conductivity of Si/SiGe superlattice films. Journal of Applied Physics. 104(11). 46 indexed citations

18.

Liu, Chun-Kai, et al.. (2008). Thermal Measurement and Simulation of 3D stacked die packages. 8. 379–382.

19.

Dai, Ming-Ji, et al.. (2007). High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package. 229–233. 1 indexed citations

20.

Liu, Chun-Kai, et al.. (2007). Thermal performance of the IC package integrated with micro- thermoelectric device. 88–92. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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