K. N. Tu

22.8k total citations · 3 hit papers
489 papers, 18.9k citations indexed

About

K. N. Tu is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, K. N. Tu has authored 489 papers receiving a total of 18.9k indexed citations (citations by other indexed papers that have themselves been cited), including 338 papers in Electrical and Electronic Engineering, 177 papers in Atomic and Molecular Physics, and Optics and 131 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in K. N. Tu's work include Electronic Packaging and Soldering Technologies (192 papers), Semiconductor materials and interfaces (154 papers) and 3D IC and TSV technologies (129 papers). K. N. Tu is often cited by papers focused on Electronic Packaging and Soldering Technologies (192 papers), Semiconductor materials and interfaces (154 papers) and 3D IC and TSV technologies (129 papers). K. N. Tu collaborates with scholars based in United States, Italy and Taiwan. K. N. Tu's co-authors include Chih Chen, U. Gösele, Andriy Gusak, R. D. Thompson, J. W. Mayer, Ke Zeng, David Turnbull, Liang Zhang, D. R. Frear and G. Ottaviani and has published in prestigious journals such as Science, Journal of the American Chemical Society and Physical Review Letters.

In The Last Decade

K. N. Tu

467 papers receiving 18.2k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Tin–lead (SnPb) solder reaction in flip chip technology

2001 495 citations K. N. Tu et al. profile →
Growth kinetics of planar binary diffusion couples: ’’Thin-film case’’ versus ’’bulk cases’’

1982 480 citations K. N. Tu et al. profile →
Kinetics of interfacial reaction in bimetallic CuSn thin films

1982 411 citations K. N. Tu et al. profile →

Peers

Countries citing papers authored by K. N. Tu

Since Specialization

Citations

This map shows the geographic impact of K. N. Tu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. N. Tu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. N. Tu more than expected).

Fields of papers citing papers by K. N. Tu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. N. Tu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. N. Tu. The network helps show where K. N. Tu may publish in the future.

Co-authorship network of co-authors of K. N. Tu

This figure shows the co-authorship network connecting the top 25 collaborators of K. N. Tu. A scholar is included among the top collaborators of K. N. Tu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. N. Tu. K. N. Tu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work	Indexed citations
1	Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/SnAg/Ni/Cu microbumps 2025 ·Journal of Alloys and Compounds ·Shih‐Chi Yang, Hao Su, K. N. Tu, Chih Chen	3
2	The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers 2025 ·Applied Surface Science ·(unknown), (unknown), (unknown), (unknown), (unknown), K. N. Tu, Yingxia Liu	0
3	Softening-resistant ultra-strong nanotwinned CoCrFeNi medium entropy alloy thin films 2025 ·Materials Science and Engineering A ·Jianjie Wang, (unknown), Shou-Yi Chang, K. N. Tu, Fan-Yi Ouyang	2
4	PEDOT:PSS-Loaded Gelatin Cryogels for Electrically Controlled Drug Release 2025 ·ACS Omega ·Huai‐An Chen, Ching‐Yu Lee, (unknown), K. N. Tu, (unknown), (unknown), Ching‐Li Tseng	2
5	Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test 2025 ·Journal of Materials Science Materials in Electronics ·(unknown), (unknown), Yifan Yao, Qinglei Sun, K. N. Tu, Yingxia Liu	0
6	Piezocatalysis‐Enabled High‐Efficiency Hydrogen Evolution with Single‐Atom Platinum on MoS ₂ Nanoflowers 2025 ·Small ·Yuming Chen, Yu‐Ching Chen, K. N. Tu, (unknown), Yan‐Gu Lin, (unknown), (unknown), Jyh Ming Wu	0
7	Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines 2025 ·Journal of Materials Research and Technology ·(unknown), (unknown), (unknown), K. N. Tu, Chih Chen	2
8	The study on low temperature reflow of antioxidant multicomponent solder paste on copper substrates 2025 ·Journal of Materials Research and Technology ·(unknown), Qinglei Sun, (unknown), Yulong Chen, (unknown), (unknown), Yong Yang, K. N. Tu, Yingxia Liu	0
9	Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder 2023 ·(unknown), (unknown), (unknown), K. N. Tu, Yingxia Liu	0
10	Electromigration in three-dimensional integrated circuits 2023 ·Applied Physics Reviews ·(unknown), (unknown), (unknown), Yifan Yao, K. N. Tu, Yingxia Liu	26
11	Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology 2023 ·Yulong Chen, (unknown), K. N. Tu, Yingxia Liu	0
12	To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints 2023 ·Journal of Materials Research and Technology ·(unknown), Dinh-Phuc Tran, (unknown), Shih‐Chi Yang, Andriy Gusak, K. N. Tu, Chih Chen	7
13	A kinetic model of copper-to-copper direct bonding under thermal compression 2021 ·Journal of Materials Research and Technology ·Kai-Cheng Shie, Andriy Gusak, K. N. Tu, Chih Chen	70
14	Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain 2021 ·Nanotechnology ·Yu-An Shen, (unknown), Shou-Yi Chang, (unknown), K. N. Tu, Chih Chen	8
15	Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating 2019 ·Scientific Reports ·E‐Wen Huang, (unknown), K. N. Tu, Wei‐Song Hung, Tu‐Ngoc Lam, Che‐Wei Tsai, Ching‐Yu Chiang, Bi‐Hsuan Lin, An‐Chou Yeh, (unknown), Yao-Jen Chang, (unknown), (unknown), Ching‐Shun Ku, Ke An, (unknown), (unknown)	40
16	Approaching the ideal elastic strain limit in silicon nanowires 2016 ·Science Advances ·Hongti Zhang, J. Tersoff, Shang Xu, Huixin Chen, Qiaobao Zhang, Kaili Zhang, Yong Yang, Chun‐Sing Lee, K. N. Tu, Ju Li, Yang Lü	199
17	Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu 2015 ·Scientific Reports ·Chien-Min Liu, Han-wen Lin, Yi-Sa Huang, Yi‐Cheng Chu, Chih Chen, (unknown), Kuan‐Neng Chen, K. N. Tu	191
18	Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking 2011 ·Yu-Min Lin, Chau‐Jie Zhan, (unknown), John H. Lau, Tai‐Hong Chen, (unknown), Ming‐Jer Kao, Tian Tian, K. N. Tu	37
19	Microstructure evolution of tin under electromigration studied by synchrotron X-Ray \nmicro-diffraction 2005 ·eScholarship (California Digital Library) ·Albert T. Wu, J. R. Lloyd, Nobumichi Tamura, K. N. Tu	1
20	Break-up of dipolar rings under an external magnetic field 2000 ·Physics Letters A ·Ferenc Kun, Károly F. Pál, Weijia Wen, K. N. Tu	10

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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