Heng-Chieh Chien

654 total citations
37 papers, 490 citations indexed

About

Heng-Chieh Chien is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Automotive Engineering. According to data from OpenAlex, Heng-Chieh Chien has authored 37 papers receiving a total of 490 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 11 papers in Materials Chemistry and 10 papers in Automotive Engineering. Recurrent topics in Heng-Chieh Chien's work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (19 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Heng-Chieh Chien is often cited by papers focused on 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (19 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Heng-Chieh Chien collaborates with scholars based in Taiwan, United States and Netherlands. Heng-Chieh Chien's co-authors include Da‐Jeng Yao, Ming-Ji Dai, Mei‐Jiau Huang, John H. Lau, Ra-Min Tain, Fang‐Lin Chao, Cheng‐Ting Hsu, Wei‐Chung Lo, Chun-Kai Liu and Ming‐Jer Kao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Applied Thermal Engineering.

In The Last Decade

Heng-Chieh Chien

36 papers receiving 458 citations

Peers

Heng-Chieh Chien

EEE

MC

BE

ME

CSE

Till Huesgen Germany

Ruikang Wu China

Boon Long Lau Singapore

Keunjoo Kim South Korea

Vishwas Bedekar United States

Wenbin Qiu China

L. Mendizabal France

Myung‐Hwan Oh South Korea

Dimeji Ibitayo United States

Haksun Lee South Korea

Till Huesgen Germany

Heng-Chieh Chien

229 ×0.7

EEE

185 ×1.0

MC

183 ×2.0

BE

192 ×2.3

ME

83 ×1.1

CSE

Citations per year, relative to Heng-Chieh Chien Heng-Chieh Chien (= 1×) peers Till Huesgen

Countries citing papers authored by Heng-Chieh Chien

Since Specialization

Citations

This map shows the geographic impact of Heng-Chieh Chien's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Heng-Chieh Chien with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Heng-Chieh Chien more than expected).

Fields of papers citing papers by Heng-Chieh Chien

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Heng-Chieh Chien. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Heng-Chieh Chien. The network helps show where Heng-Chieh Chien may publish in the future.

Co-authorship network of co-authors of Heng-Chieh Chien

This figure shows the co-authorship network connecting the top 25 collaborators of Heng-Chieh Chien. A scholar is included among the top collaborators of Heng-Chieh Chien based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Heng-Chieh Chien. Heng-Chieh Chien is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

He, Ping, Heng-Chieh Chien, Yu-Hsiang Chang, et al.. (2025). Implementation of hierarchical dendritic wicks in vapor chambers for high-power heat dissipation applications. Applied Thermal Engineering. 271. 126295–126295.

2.

Chien, Heng-Chieh, et al.. (2023). High-performance electrodeposited copper wicks for heat-spreading vapor chambers. Applied Thermal Engineering. 228. 120495–120495. 25 indexed citations

3.

Huang, Mei‐Jiau, et al.. (2019). Thermal spreading resistance of heat sources on rectangular flux channel under non-uniform convective cooling. International Journal of Thermal Sciences. 145. 105979–105979. 7 indexed citations

4.

Chen, Ying-Chung, et al.. (2015). Annealing effects on the thermoelectric properties of silver-doped bismuth telluride thin films. Microelectronic Engineering. 148. 51–54. 8 indexed citations

5.

Chen, Cheng‐fu, et al.. (2014). Interplay and influence of thermomechanical stress in copper-filled TSV interposers. 963–966. 5 indexed citations

6.

Lau, John H., Chau‐Jie Zhan, Fang‐Lin Chao, et al.. (2014). Low-cost TSH (through-silicon hole) interposers for 3D IC integration. 2. 290–296. 8 indexed citations

7.

Lau, John H., Chau‐Jie Zhan, Fang‐Lin Chao, et al.. (2014). Through-Silicon Hole Interposers for 3-D IC Integration. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(9). 1407–1419. 32 indexed citations

8.

Chien, Heng-Chieh, et al.. (2013). Evaluation of Temperature-Dependent Effective Material Properties and Performance of a Thermoelectric Module. Journal of Electronic Materials. 42(7). 2362–2370. 10 indexed citations

9.

Lau, John H., et al.. (2012). Thermal-mechanical responses of 3D IC integration with a passive TSV interposer. 1/8–8/8. 2 indexed citations

10.

Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2012). Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications. 1866–1873. 41 indexed citations

11.

Zhan, Chau‐Jie, Pei-Jer Tzeng, John H. Lau, et al.. (2012). Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP. 548–554. 14 indexed citations

12.

Lau, John H., Heng-Chieh Chien, Ming-Ji Dai, et al.. (2012). Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs. 1618–1624. 7 indexed citations

13.

Tzeng, Pei-Jer, John H. Lau, Ming-Ji Dai, et al.. (2012). Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer. 32. 1731–1737. 6 indexed citations

14.

Chien, Heng-Chieh, et al.. (2012). A novel method to rapidly determine the key properties of thermoelectric devices. 99. 93–98. 2 indexed citations

15.

Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2011). Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV). IMAPSource Proceedings. 2011(1). 25–32. 13 indexed citations

16.

Huang, Mei‐Jiau, et al.. (2010). A novel method for measuring thick film thermal conductivity. 1052–1056. 3 indexed citations

17.

Chien, Heng-Chieh, Da‐Jeng Yao, & Cheng‐Ting Hsu. (2008). Measurement and evaluation of the interfacial thermal resistance between a metal and a dielectric. Applied Physics Letters. 93(23). 41 indexed citations

18.

Liu, Chun-Kai, et al.. (2008). Stacked Thermoelectric Generator Module Integrated with Partial Electric Conducted Interposer Structure. 413. 355–360. 2 indexed citations

19.

Yao, Da‐Jeng, Wei‐Chih Lai, & Heng-Chieh Chien. (2008). Temperature Dependence of Thermal Conductivity for Silicon Dioxide. 435–439. 7 indexed citations

20.

Liu, Chun-Kai, Heng-Chieh Chien, Ming-Ji Dai, et al.. (2008). Thermal conductivity of Si/SiGe superlattice films. Journal of Applied Physics. 104(11). 46 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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