Wei‐Chung Lo
- Electrical and Electronic Engineering top 5%
- Organic Chemistry top 10%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials top 10%
- Oncology
- Co-authors
- Shie‐Ming PengChi‐Ming CheGene‐Hsiang LeeShyh-Shyuan SheuHong XiaoDan LiChih-Chieh WangJin‐Ming Chen
- Topics
- 3D IC and TSV technologies (55 papers)Electronic Packaging and Soldering Technologies (46 papers)Ferroelectric and Negative Capacitance Devices (16 papers)
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsHardware and Architecture
- Partner nations
- TaiwanUnited StatesHong Kong
In The Last Decade
Wei‐Chung Lo
85 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 47
- Electrical and Electronic Engineering 915
- Organic Chemistry 248
- Materials Chemistry 243
- Electronic, Optical and Magnetic Materials 209
- Oncology 139
Countries citing papers authored by Wei‐Chung Lo
This map shows the geographic impact of Wei‐Chung Lo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei‐Chung Lo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei‐Chung Lo more than expected).
Fields of papers citing papers by Wei‐Chung Lo
This network shows the impact of papers produced by Wei‐Chung Lo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei‐Chung Lo. The network helps show where Wei‐Chung Lo may publish in the future.
Co-authorship network of co-authors of Wei‐Chung Lo
This figure shows the co-authorship network connecting the top 25 collaborators of Wei‐Chung Lo. A scholar is included among the top collaborators of Wei‐Chung Lo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei‐Chung Lo. Wei‐Chung Lo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 11 | |
| 7 | 91 | |
| 8 | 0 | |
| 9 | 16 | |
| 10 | 0 | |
| 11 | 20 | |
| 12 | 34 | |
| 13 | 11 | |
| 14 | 15 | |
| 15 | 7 | |
| 16 | 5 | |
| 17 | 34 | |
| 18 | TSV and 3D wafer bonding technologies for advanced stacking system and application at ITRI | 7 |
| 19 | 12 | |
| 20 | 13 |
About Wei‐Chung Lo
Wei‐Chung Lo is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Hardware and Architecture, having authored 92 papers that have together received 1.3k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (55 papers), Electronic Packaging and Soldering Technologies (46 papers) and Ferroelectric and Negative Capacitance Devices (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (915 citations), Electronic, Optical and Magnetic Materials (209 citations) and Hardware and Architecture (68 citations). Wei‐Chung Lo has collaborated with scholars based in Taiwan, United States and Hong Kong. Frequent co-authors include Shie‐Ming Peng, Chi‐Ming Che, Gene‐Hsiang Lee, Shyh-Shyuan Sheu, Hong Xiao, Dan Li, Chih-Chieh Wang, Jin‐Ming Chen, John H. K. Yip and Cheng-Ta Ko. Their work appears in journals such as Applied Physics Letters, Chemical Communications and Inorganic Chemistry.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.