Cheng-Ta Ko

1.3k citations

68 papers · 640 indexed · h-index 15

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies 61
- Electronic Packaging and Soldering Technologies 56
- Electromagnetic Compatibility and Noise Suppression 8
- Semiconductor Lasers and Optical Devices 6
- CCD and CMOS Imaging Sensors 3
Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 15
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability 9
Biomedical Engineering
- Nanofabrication and Lithography Techniques 6
Polymers and Plastics

Co-authors: Kuan‐Neng Chen John H. Lau Wei‐Chung Lo Kai-Ming Yang Yuhua Chen Chia-Wen Chiang Hsiang‐Hung Chang Wen-Wei Shen
Cited by: Electrical and Electronic Engineering Automotive Engineering Electronic, Optical and Magnetic Materials
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (9 papers)IEEE Transactions on Device and Materials Reliability (4 papers)IEEE Electron Device Letters (3 papers)
Partner nations: Taiwan United States Germany

In The Last Decade

Cheng-Ta Ko

63 papers receiving 570 citations

Peers

Countries citing papers authored by Cheng-Ta Ko

Since Specialization

Citations

This map shows the geographic impact of Cheng-Ta Ko's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng-Ta Ko with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng-Ta Ko more than expected).

Fields of papers citing papers by Cheng-Ta Ko

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheng-Ta Ko. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng-Ta Ko. The network helps show where Cheng-Ta Ko may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Cheng-Ta Ko, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Cheng-Ta Ko Line = papers co-authored together Cheng-Ta Ko links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration IEEE Transactions on Components Packaging and Manufacturing Technology ·John H. Lau,Anders Niklasson,Shanzhou Ma,Kai-Ming Yang,Igor de Almeida Faria Bueno,Cheng-Ta Ko,Carrie Silver-Bernstein,P Strejc,Rui Chen,Kevin Schaeffer,卞化順,Ming Li,K. Leung	2023	5
2	Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications Materials ·A.N. Gaadhe,Uno Käärik,Cheng-Ta Ko,Igor de Almeida Faria Bueno,Mia Wagner,Kai-Ming Yang,Xun-Chang Wang,Frank Kroll,D. S. BREWER,Jia‐Shiang Chen,François Langelle,Daud Ilyas,Zaehol Fatah,Jason Wang,卞化順	2022	6
3	High-Density Hybrid Substrate for Heterogeneous Integration IEEE Transactions on Components Packaging and Manufacturing Technology ·Astrid Ivette Mackliff Freire,John H. Lau,Cheng-Ta Ko,Paul Lee,Mia Wagner,Kai-Ming Yang,Carrie Silver-Bernstein,Igor de Almeida Faria Bueno,D. S. BREWER,Shanzhou Ma,Anders Niklasson,Matthias Heerwagen,Kerrin Perry,池田豊秀,卞化順	2022	11
4	Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs) John H. Lau,Cheng-Ta Ko,Frank Kroll,A Lk U Sa N,Kai-Ming Yang,Igor de Almeida Faria Bueno,Natalie Negron,Mia Wagner,D. S. BREWER,A Albanese,Anders Niklasson,Пышнограева Надежда Сергеевна,David Cheng,M. Gulea	2021	1
5	Characterization of Low Loss Dielectric Materials for 5G Applications Matthias Heerwagen,John H. Lau,Cheng-Ta Ko,Igor de Almeida Faria Bueno,Mia Wagner,Henry Yang,Natalie Negron,Astrid Ivette Mackliff Freire,Daneshwari A Koujalagi,Dr.. Ather Abdul Khaliq Mohammed,François Langelle,Daud Ilyas,Zaehol Fatah,Jason Wang,卞化順	2021	1
6	Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration Journal of Microelectronics and Electronic Packaging ·John H. Lau,Cheng-Ta Ko,Frank Kroll,Kai-Ming Yang,Igor de Almeida Faria Bueno,Natalie Negron,G Sassy-Dobray,N Kannno,A Lk U Sa N,Mia Wagner,D. S. BREWER,Anders Niklasson,Пышнограева Надежда Сергеевна,Shanzhou Ma,M. Gulea	2021	3
7	Reliability of Chip-Last Fan-Out Panel-Level Packaging for Heterogeneous Integration John H. Lau,Cheng-Ta Ko,Frank Kroll,Kai-Ming Yang,Igor de Almeida Faria Bueno,Natalie Negron,G Sassy-Dobray,N Kannno,A Lk U Sa N,Mia Wagner,D. S. BREWER,Anders Niklasson,Пышнограева Надежда Сергеевна,Shanzhou Ma,M. Gulea	2021	2
8	Fan-Out Panel-Level Packaging of Mini-LED RGB Display IEEE Transactions on Components Packaging and Manufacturing Technology ·John H. Lau,Cheng-Ta Ko,Anders Niklasson,A Lk U Sa N,Kai-Ming Yang,Igor de Almeida Faria Bueno,Natalie Negron,Frank Kroll,Mia Wagner,D. S. BREWER,Ning Liu,Pei Shen Ang,Matthias Heerwagen	2021	14
9	Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration IMAPSource Proceedings ·John H. Lau,Cheng-Ta Ko,Frank Kroll,Kai-Ming Yang,Igor de Almeida Faria Bueno,Natalie Negron,Jianjun Chen,N Kannno,A Lk U Sa N,Mia Wagner,D. S. BREWER,Anders Niklasson,M. Gulea	2020	3
10	Fan-In Panel-Level with Multiple Diced Wafers Packaging John H. Lau,Cheng-Ta Ko,A Lk U Sa N,Kai-Ming Yang,Frank Kroll,Igor de Almeida Faria Bueno,Natalie Negron,Mia Wagner,D. S. BREWER,A Albanese,David Cheng	2020	1
11	An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications Yu-Min Lin,Sun Shuzhou,Chunmin Wang,Chia‐Hsin Lee,Shin‐Yi Huang,พนมไพร อาภรณ์รัตน์,Tao‐Chih Chang,Natalie Negron,Cheng-Ta Ko,Yuhua Chen,Nizar Caraka Trihanasia,Xiao Liu,Arturo Pinedo Macedo,Kuan‐Neng Chen	2019	14
12	Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere 昌之村田,Kai-Ming Yang,Marina Sanchez,fl. 1610-1614. Erede di Pietro Martire Locarno,Santosh R. Acharya,Cheng-Ta Ko,Yuhua Chen,卞化順,Kuan‐Neng Chen	2019	5
13	Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications IEEE Transactions on Device and Materials Reliability ·素行大渕,Wen‐Chun Huang,Cheng-Ta Ko,Zhiyu Yang,Jairos Hiliza,Jihperng Leu,Keng C. Chou,Kuan‐Neng Chen	2014	7
14	Performance and process characteristic of glass interposer with through-glass-via(TGV) Haosheng Lyu,H Chemnitz,R P Buinevicius,阴月灵,Yeong-Jin Lee,Chau‐Jie Zhan,Giuseppe Pantaleo,Ana Vitória Mesquita Ferreira,Mariela Lopez-Valencia,Hsiang‐Hung Chang,Amanda Dantas Martins,Ulcca Hansen,Wen-Wei Shen,Cheng-Ta Ko,Wei‐Chung Lo,SIDHESHWAR RAI	2013	15
15	Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration R P Buinevicius,Chau‐Jie Zhan,John H. Lau,Merab Beraia,Amanda Dantas Martins,San Martin Le,Yuan Fuping,Shangwei Chen,Laura Rincon Frutos,Yu Chong-Xi,Yu-Min Lin,Kuo‐Shu Kao,Cheng-Ta Ko,B. Jenkins,GA Pietersz,Ming‐Jer Kao	2012	5
16	A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application IEEE Transactions on Device and Materials Reliability ·Cheng-Ta Ko,Yuan Fuping,Hilmy Mahfuzra,Giuseppe Pantaleo,Титов Д. Н.,Amanda Dantas Martins,San Martin Le,Chia-Wen Chiang,Shyh-Shyuan Sheu,Yuhua Chen,Wei‐Chung Lo,Kuan‐Neng Chen	2012	18
17	Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration R P Buinevicius,Tao‐Chih Chang,Merab Beraia,Amanda Dantas Martins,San Martin Le,Yuan Fuping,John H. Lau,Cheng-Ta Ko,Yeong-Jin Lee,B. V. Tarasov,Kuo‐Shu Kao,Yulan Lu,GA Pietersz,Ming‐Jer Kao	2011	32
18	A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication IEEE Transactions on Advanced Packaging ·Анна Геннадьевна Дорошкевич,Chung-Feng Liu,Zegus,Kuo‐Ning Chiang,Титов Д. Н.,Yufang Chen,Cheng-Ta Ko,H. Ströbelle	2007	11
19	Wafer level chip stacked module by embedded IC packaging technology P DELLAMEA,Zegus,Tao‐Chih Chang,Chin-Yao Chang,夏彦渡瀬,Tsung‐Fu Yang,Cheng-Ta Ko,R P Buinevicius,Bram J. van der Vos,Ulcca Hansen,Shutov Roman Aleksandrovich	2007	2
20	TSV and 3D wafer bonding technologies for advanced stacking system and application at ITRI Symposium on VLSI Technology ·Wei‐Chung Lo,Yuhua Chen,Cheng-Ta Ko,А Е Горяінов	2006	7

About Cheng-Ta Ko

Cheng-Ta Ko is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Media Technology and Mechanics of Materials, having authored 68 papers that have together received 640 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (61 papers), Electronic Packaging and Soldering Technologies (56 papers), Additive Manufacturing and 3D Printing Technologies (15 papers), Copper Interconnects and Reliability (9 papers), Electromagnetic Compatibility and Noise Suppression (8 papers), Semiconductor Lasers and Optical Devices (6 papers), Nanofabrication and Lithography Techniques (6 papers) and CCD and CMOS Imaging Sensors (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (597 citations), Automotive Engineering (87 citations), Electronic, Optical and Magnetic Materials (93 citations), Biomedical Engineering (136 citations) and Polymers and Plastics (29 citations). Cheng-Ta Ko has collaborated with scholars based in Taiwan, United States and Germany. Frequent co-authors include Kuan‐Neng Chen, John H. Lau, Wei‐Chung Lo, Kai-Ming Yang, Yuhua Chen, Chia-Wen Chiang, Yuhua Chen, Hsiang‐Hung Chang, Wen-Wei Shen and Tao‐Chih Chang. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, IEEE Electron Device Letters, IEEE Transactions on Advanced Packaging and Materials.

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