Chia‐Wei Chiang

461 total citations
22 papers, 384 citations indexed

About

Chia‐Wei Chiang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Chia‐Wei Chiang has authored 22 papers receiving a total of 384 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 6 papers in Automotive Engineering. Recurrent topics in Chia‐Wei Chiang's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). Chia‐Wei Chiang is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). Chia‐Wei Chiang collaborates with scholars based in Taiwan, United States and Czechia. Chia‐Wei Chiang's co-authors include Yang‐Fang Chen, Golam Haider, Huan‐Tsung Chang, Yi‐Rou Liou, Chi‐Te Liang, W. D. Tan, Prathik Roy, Wei‐Heng Shih, Ying‐Chih Lai and Rini Ravindranath and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Advanced Functional Materials.

In The Last Decade

Chia‐Wei Chiang

21 papers receiving 368 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chia‐Wei Chiang Taiwan 8 195 155 133 46 38 22 384
Cheolheon Park South Korea 6 147 0.8× 125 0.8× 221 1.7× 10 0.2× 24 0.6× 14 484
Lily Nari Kim South Korea 5 98 0.5× 98 0.6× 188 1.4× 8 0.2× 20 0.5× 6 387
Aydin Sabouri United Kingdom 12 436 2.2× 38 0.2× 346 2.6× 10 0.2× 117 3.1× 16 653
Kosuke Suzuki Japan 9 112 0.6× 89 0.6× 150 1.1× 4 0.1× 45 1.2× 38 375
Yina Chang Hong Kong 5 68 0.3× 70 0.5× 289 2.2× 5 0.1× 41 1.1× 7 433
Zhishan Hou China 11 179 0.9× 53 0.3× 242 1.8× 4 0.1× 95 2.5× 34 439
Po-Han Chen Taiwan 11 388 2.0× 82 0.5× 188 1.4× 5 0.1× 165 4.3× 20 473
Yuanrui Li China 10 202 1.0× 80 0.5× 121 0.9× 3 0.1× 65 1.7× 24 415
Ting Bu China 11 143 0.7× 13 0.1× 134 1.0× 18 0.4× 35 0.9× 25 332
Jonathan Trisno Singapore 6 105 0.5× 51 0.3× 201 1.5× 8 0.2× 219 5.8× 10 433

Countries citing papers authored by Chia‐Wei Chiang

Since Specialization
Citations

This map shows the geographic impact of Chia‐Wei Chiang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chia‐Wei Chiang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chia‐Wei Chiang more than expected).

Fields of papers citing papers by Chia‐Wei Chiang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chia‐Wei Chiang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chia‐Wei Chiang. The network helps show where Chia‐Wei Chiang may publish in the future.

Co-authorship network of co-authors of Chia‐Wei Chiang

This figure shows the co-authorship network connecting the top 25 collaborators of Chia‐Wei Chiang. A scholar is included among the top collaborators of Chia‐Wei Chiang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chia‐Wei Chiang. Chia‐Wei Chiang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chen, Yi‐Chien, et al.. (2022). P‐27: A Novel PWM Driving Pixel Circuit with Metal‐Oxide TFTs for MicroLED Displays. SID Symposium Digest of Technical Papers. 53(1). 1137–1140. 7 indexed citations
2.
Chiang, Chia‐Wei, et al.. (2021). Silicon Nanowire Field-Effect Transistor as Label-Free Detection of Hepatitis B Virus Proteins with Opposite Net Charges. Biosensors. 11(11). 442–442. 7 indexed citations
3.
Haider, Golam, Yen‐Hsiang Wang, Farjana J. Sonia, et al.. (2020). Rippled Metallic‐Nanowire/Graphene/Semiconductor Nanostack for a Gate‐Tunable Ultrahigh‐Performance Stretchable Phototransistor. Advanced Optical Materials. 8(19). 6 indexed citations
4.
5.
Lin, Dung‐Ying & Chia‐Wei Chiang. (2017). The Storage Space Allocation Problem at a Container Terminal. Maritime Policy & Management. 44(6). 685–704. 1 indexed citations
6.
Hsu, Cheng-Chih, Hang Chen, Chia‐Wei Chiang, & Yu‐Wei Chang. (2017). Dual displacement resolution encoder by integrating single holographic grating sensor and heterodyne interferometry. Optics Express. 25(24). 30189–30189. 27 indexed citations
7.
Lin, Shih-Yao, et al.. (2017). Stretchable random lasers with tunable coherent loops. LTh3F.3–LTh3F.3. 1 indexed citations
8.
Chiang, Chia‐Wei, et al.. (2016). Tunneling-injection in vertical quasi-2D heterojunctions enabled efficient and adjustable optoelectronic conversion. Scientific Reports. 6(1). 31475–31475. 3 indexed citations
9.
Lee, Alvin Kai-Xing, Xiao Liu, Wen-Wei Shen, et al.. (2016). Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging. IMAPSource Proceedings. 2016(1). 190–195. 3 indexed citations
10.
Lin, Shih-Yao, et al.. (2015). Stretchable Random Lasers with Tunable Coherent Loops. ACS Nano. 9(12). 12436–12441. 53 indexed citations
11.
Haider, Golam, Prathik Roy, Chia‐Wei Chiang, et al.. (2015). Electrical‐Polarization‐Induced Ultrahigh Responsivity Photodetectors Based on Graphene and Graphene Quantum Dots. Advanced Functional Materials. 26(4). 620–628. 103 indexed citations
12.
Chiang, Chia‐Wei, Golam Haider, Yi‐Rou Liou, et al.. (2015). Highly Stretchable and Sensitive Photodetectors Based on Hybrid Graphene and Graphene Quantum Dots. ACS Applied Materials & Interfaces. 8(1). 466–471. 75 indexed citations
13.
14.
Ger, Tzong-Rong, et al.. (2013). Cell Patterning Using Magnetic Concentric Rectangular Thin Films for Biochip Application. IEEE Transactions on Magnetics. 49(7). 3496–3499. 5 indexed citations
15.
Chiang, Chia‐Wei, et al.. (2013). Nanostructured Biosensor of Cobalt Line Array on Permalloy Film. IEEE Transactions on Magnetics. 49(7). 4040–4043. 1 indexed citations
16.
Chang, Hwan‐You, et al.. (2013). TSV-less BSI-CIS wafer-level package and stacked CIS module. 323–326. 3 indexed citations
17.
Chang, Hwan‐You, et al.. (2012). Thin wafer handling process evaluation for 3DIC integration. 76–79.
18.
Fu, Han, et al.. (2012). Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 139. 1–4. 10 indexed citations
19.
Chang, Hwan‐You, John H. Lau, Wei‐Chi Tsai, et al.. (2011). Thin Wafer Handling of 300mm Wafer for 3D IC Integration. IMAPSource Proceedings. 2011(1). 202–207. 6 indexed citations
20.
Tsai, Wei‐Chi, Hwan‐You Chang, Chi‐Hsien Chien, et al.. (2011). How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?. 989–998. 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026