Kuo‐Shu Kao
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- Electronic Packaging and Soldering Technologies 28
- 3D IC and TSV technologies 24
- Silicon Carbide Semiconductor Technologies 15
- Electromagnetic Compatibility and Noise Suppression 11
- Multilevel Inverters and Converters 2
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 6
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- Aluminum Alloys Composites Properties 3
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- Adhesion, Friction, and Surface Interactions 3
- Co-authors
- Tao‐Chih ChangChang‐Chun LeeJohn H. LauChau‐Jie ZhanTsung‐Fu YangYulan LuTai‐Hong ChenMing‐Jer Kao
- Journals
- Microelectronic Engineering (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Journal of Electronic Packaging (3 papers)
- Partner nations
- TaiwanUnited StatesNetherlands
In The Last Decade
Kuo‐Shu Kao
36 papers receiving 324 citations
Peers
Comparison fields: 5 of 25
- Electrical and Electronic Engineering 311
- Automotive Engineering 58
- Mechanical Engineering 81
- Electronic, Optical and Magnetic Materials 27
- Biomedical Engineering 44
Countries citing papers authored by Kuo‐Shu Kao
This map shows the geographic impact of Kuo‐Shu Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kuo‐Shu Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kuo‐Shu Kao more than expected).
Fields of papers citing papers by Kuo‐Shu Kao
This network shows the impact of papers produced by Kuo‐Shu Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kuo‐Shu Kao. The network helps show where Kuo‐Shu Kao may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Kuo‐Shu Kao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2024 | 12 | |
| 3 | 2024 | 0 | |
| 4 | 2023 | 1 | |
| 5 | 2023 | 3 | |
| 6 | 2018 | 0 | |
| 7 | 2015 | 1 | |
| 8 | 2015 | 4 | |
| 9 | 2013 | 13 | |
| 10 | 2013 | 6 | |
| 11 | 2012 | 5 | |
| 12 | 2012 | 7 | |
| 13 | 2012 | 12 | |
| 14 | 2012 | 14 | |
| 15 | 2012 | 13 | |
| 16 | 2011 | 5 | |
| 17 | 2011 | 32 | |
| 18 | 2010 | 2 | |
| 19 | 2007 | 2 | |
| 20 | 2007 | 5 |
About Kuo‐Shu Kao
Kuo‐Shu Kao is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Earth-Surface Processes and Mechanics of Materials, having authored 42 papers that have together received 333 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (24 papers), Silicon Carbide Semiconductor Technologies (15 papers), Electromagnetic Compatibility and Noise Suppression (11 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Adhesion, Friction, and Surface Interactions (3 papers), Aluminum Alloys Composites Properties (3 papers) and Multilevel Inverters and Converters (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (311 citations), Automotive Engineering (58 citations), Mechanical Engineering (81 citations), Electronic, Optical and Magnetic Materials (27 citations) and Biomedical Engineering (44 citations). Kuo‐Shu Kao has collaborated with scholars based in Taiwan, United States and Netherlands. Frequent co-authors include Tao‐Chih Chang, Chang‐Chun Lee, John H. Lau, Chau‐Jie Zhan, Tsung‐Fu Yang, Yulan Lu, Tai‐Hong Chen, Ming‐Jer Kao, Yu-Min Lin and Tung‐Han Chuang. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, IEEE Transactions on Power Electronics and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.