Yu-Min Lin

894 citations

68 papers · 649 indexed · h-index 15

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced Photonic Communication Systems
- Optical Network Technologies
- Advanced Optical Network Technologies
Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies

Papers in

Automotive Engineering 15
- Additive Manufacturing and 3D Printing Technologies 15
Electrical and Electronic Engineering 67
- Electronic Packaging and Soldering Technologies 41
- 3D IC and TSV technologies 41
- Optical Network Technologies 22
- Advanced Photonic Communication Systems 20
- Advanced Optical Network Technologies 12
- Semiconductor Lasers and Optical Devices 5

Co-authors: Po-Lung Tien M.C. Yuang Chau‐Jie Zhan Tao‐Chih Chang Steven Lee Jason Chen Tai‐Hong Chen John H. Lau
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Microelectronic Engineering (3 papers)IEEE Photonics Technology Letters (3 papers)IEEE Journal on Selected Areas in Communications (2 papers)Journal of Lightwave Technology (2 papers)
Partner nations: Taiwan United States Netherlands

In The Last Decade

Yu-Min Lin

66 papers receiving 606 citations

Peers

Countries citing papers authored by Yu-Min Lin

Since Specialization

Citations

This map shows the geographic impact of Yu-Min Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yu-Min Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yu-Min Lin more than expected).

Fields of papers citing papers by Yu-Min Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yu-Min Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yu-Min Lin. The network helps show where Yu-Min Lin may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Yu-Min Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Yu-Min Lin Line = papers co-authored together Yu-Min Lin links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Process-induced warpage and stress estimation of through glass via embedded interposer carrier with ring-type framework Microelectronics Reliability ·Pei‐Chen Huang, Yu-Min Lin, Shanzhou Ma, Chang‐Chun Lee	2022	4
2	Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test Microelectronic Engineering ·Chang‐Chun Lee, Yu-Min Lin, Hou‐Chun Liu, 学明严, Yuan‐Cheng Huang, Tao‐Chih Chang	2021	13
3	An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications Yu-Min Lin, Sun Shuzhou, Chunmin Wang, Chia‐Hsin Lee, Shin‐Yi Huang, พนมไพร อาภรณ์รัตน์, Tao‐Chih Chang, Natalie Negron, Cheng-Ta Ko, Yuhua Chen, Nizar Caraka Trihanasia, Xiao Liu, Arturo Pinedo Macedo, Kuan‐Neng Chen	2019	14
4	3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV) IEEE Journal of the Electron Devices Society ·Wen-Wei Shen, Ming‐Jer Kao, Kuan‐Neng Chen, Yu-Min Lin, 賢一奥山, Hâna Chaïr, Tao‐Chih Chang, Wei‐Chung Lo, Chien‐Chung Lin, Yung-Fa Chou, Ding-Ming Kwai	2018	11
5	A TXV-less Packaging Platform for the Era of IoTs IMAPSource Proceedings ·Jeremy Appleton, Yu-Min Lin, František Turek, Tao‐Chih Chang, Wei‐Chung Lo, M Jurkowski, Henry Yang, شهرزاد پارسا, Yuhua Chen, Ra-Min Tain	2015	1
6	Process integration of 3D stacking for backside illuminated image sensor Yuan Fuping, Cheng-Ta Ko, Hsiang‐Hung Chang, Amanda Dantas Martins, Mariela Lopez-Valencia, 真典佐藤, Wen‐Li Tsai, Wen-Wei Shen, Jen Chun Wang, Yu-Min Lin, Wei‐Chung Lo	2014	2
7	Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration R P Buinevicius, Chau‐Jie Zhan, John H. Lau, Merab Beraia, Amanda Dantas Martins, San Martin Le, Yuan Fuping, Shangwei Chen, Laura Rincon Frutos, Yu Chong-Xi, Yu-Min Lin, Kuo‐Shu Kao, Cheng-Ta Ko, B. Jenkins, GA Pietersz, Ming‐Jer Kao	2012	5
8	Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections Yu-Min Lin, Chau‐Jie Zhan, Kuo‐Shu Kao, Yu Chong-Xi, B. Thornton, Y L Fan, Laura Rincon Frutos, Ameiss Ap, 秦杉, John H. Lau, B. Jenkins	2012	7
9	Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking Yu-Min Lin, Chau‐Jie Zhan, Eliana Naty Guzman Valencia, John H. Lau, Tai‐Hong Chen, GA Pietersz, Ming‐Jer Kao, Tian Tian, K. N. Tu	2011	37
10	Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding Tao‐Chih Chang, Yeong-Jin Lee, Kuo‐Shu Kao, Martina Schönbein, R P Buinevicius, Ameiss Ap, Laura Rincon Frutos, Yu Chong-Xi, شهرزاد پارسا, Grazyna Milinska, Yu-Min Lin, Tai‐Hong Chen, 夏彦渡瀬, Jakob Honigsman, Wei‐Chung Lo	2011	5
11	A 40-Gb/s OFDM PON System Based on 10-GHz EAM and 10-GHz Direct-Detection PIN IEEE Photonics Technology Letters ·Hsing-Yu Chen, F. Llacuna, Dar-Zu Hsu, M.C. Yuang, Jyehong Chen, Yu-Min Lin, Po-Lung Tien, Steven Lee, Gerda Scheidgen-Kleyboldt, Weiyuan Li, 伸一郎島, U. V. Shilpa	2011	17
12	Plasma Amyloid-� Peptides and Homocysteine in Depression in the Homebound Elderly North American Journal of Medicine and Science ·Wei Qiao Qiu, Xiaoyan Sun, Mkaya Mwamburi, Hideaki Takaku, Varsha Harikumar, E Nardin, Yu-Min Lin, Liyan Qiao, Paul Summergrad, Marshal F. Folstein, Irwin H. Rosenberg	2010	2
13	A novel optical access network architecture supporting seamless integration of RoF and OFDMA signals European Conference on Optical Communication ·Yu-Min Lin, Po-Lung Tien, M.C. Yuang, Steven Lee, Jason Chen, Garry D. Willett, 一男天野, U. V. Shilpa, 伸一郎島	2009	5
14	A Novel Optical-Header Processing and Access Control System for a Packet-Switched WDM Metro Ring Network Journal of Lightwave Technology ·M.C. Yuang, Yu-Min Lin, Antonio Castro Viejo	2009	5
15	A Novel OFDMA-PON Architecture toward Seamless Broadband and Wireless Integration Po-Lung Tien, Yu-Min Lin, M.C. Yuang	2009	13
16	Optical direct-detection OFDM signal generation for radio-over-fiber link using frequency doubling scheme with carrier suppression Optics Express ·Chun-Ting Lin, Yu-Min Lin, Jason Chen, Michiel Esvelt, 금교영, Peng‐Chun Peng, Sien Chi	2008	50
17	HOPSMAN: An Experimental Testbed System for a 10-Gb/s Optical Packet-Switched WDM Metro Ring Network IEEE Communications Magazine ·M.C. Yuang, А. Дроздова, Xiang TaiYou, Po-Lung Tien, Jason Chen, Chia-Chien Wei, Yu-Min Lin, Steven Lee, Carolina Buitrago Salazar	2008	19
18	Optical coarse packet-switched IP-over-WDM network (OPSINET): technologies and experiments IEEE Journal on Selected Areas in Communications ·M.C. Yuang, Steven Lee, Po-Lung Tien, Yu-Min Lin, U. V. Shilpa, Kalkan Rifat, Е. Н. Горелик	2006	10
19	Superimposed ASK label in a 10 Gbps multi-hop all-optical label swapping system Optical Fiber Communication Conference ·Yu-Min Lin, M.C. Yuang, San‐Liang Lee, W.I. Way	2004	5
20	Feasibility study of transporting wireless CDMA signals over HFC networks Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Yu-Min Lin, W.I. Way	1998	2

About Yu-Min Lin

Yu-Min Lin is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Biomedical Engineering, having authored 68 papers that have together received 649 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (41 papers), Optical Network Technologies (22 papers), Advanced Photonic Communication Systems (20 papers), Additive Manufacturing and 3D Printing Technologies (15 papers), Advanced Optical Network Technologies (12 papers), Semiconductor Lasers and Optical Devices (5 papers) and Advanced Welding Techniques Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (621 citations), Automotive Engineering (73 citations), Electronic, Optical and Magnetic Materials (76 citations), Atomic and Molecular Physics, and Optics (61 citations) and Mechanical Engineering (53 citations). Yu-Min Lin has collaborated with scholars based in Taiwan, United States and Netherlands. Frequent co-authors include Po-Lung Tien, M.C. Yuang, Chau‐Jie Zhan, Tao‐Chih Chang, Steven Lee, Jason Chen, Tai‐Hong Chen, John H. Lau, Kuan‐Neng Chen and Shin‐Yi Huang. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronic Engineering, IEEE Photonics Technology Letters, IEEE Journal on Selected Areas in Communications and Journal of Lightwave Technology.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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