Yu-Min Lin

894 total citations
68 papers, 649 citations indexed

About

Yu-Min Lin is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanical Engineering. According to data from OpenAlex, Yu-Min Lin has authored 68 papers receiving a total of 649 indexed citations (citations by other indexed papers that have themselves been cited), including 67 papers in Electrical and Electronic Engineering, 15 papers in Automotive Engineering and 8 papers in Mechanical Engineering. Recurrent topics in Yu-Min Lin's work include Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (41 papers) and Optical Network Technologies (22 papers). Yu-Min Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (41 papers) and Optical Network Technologies (22 papers). Yu-Min Lin collaborates with scholars based in Taiwan, United States and Netherlands. Yu-Min Lin's co-authors include Po-Lung Tien, M.C. Yuang, Chau‐Jie Zhan, Tao‐Chih Chang, Steven Lee, Jason Chen, Tai‐Hong Chen, John H. Lau, Kuan‐Neng Chen and Shin‐Yi Huang and has published in prestigious journals such as Optics Express, IEEE Journal on Selected Areas in Communications and IEEE Communications Magazine.

In The Last Decade

Yu-Min Lin

66 papers receiving 606 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Yu-Min Lin Taiwan	15	621	76	73	61	55	68	649
Soon Wee Ho Singapore	15	674 1.1×	61 0.8×	74 1.0×	66 1.1×	115 2.1×	55	736
Scott Pozder United States	14	580 0.9×	71 0.9×	102 1.4×	26 0.4×	51 0.9×	25	607
Maaike M. Visser Taklo Norway	14	526 0.8×	47 0.6×	45 0.6×	55 0.9×	150 2.7×	54	603
David Ho Singapore	12	583 0.9×	94 1.2×	32 0.4×	27 0.4×	113 2.1×	47	632
Kwang-Yoo Byun South Korea	8	711 1.1×	64 0.8×	61 0.8×	78 1.3×	84 1.5×	18	736
Suk-Kyu Ryu United States	10	762 1.2×	80 1.1×	112 1.5×	72 1.2×	210 3.8×	17	787
John Glaser United States	17	978 1.6×	71 0.9×	45 0.6×	70 1.1×	41 0.7×	50	1.1k
Min-Suk Suh South Korea	9	684 1.1×	47 0.6×	43 0.6×	81 1.3×	57 1.0×	20	709
W.C. Chiou Taiwan	11	467 0.8×	49 0.6×	50 0.7×	16 0.3×	75 1.4×	22	517
R. Yu United States	6	370 0.6×	59 0.8×	47 0.6×	61 1.0×	88 1.6×	10	403

Countries citing papers authored by Yu-Min Lin

Since Specialization

Citations

This map shows the geographic impact of Yu-Min Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yu-Min Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yu-Min Lin more than expected).

Fields of papers citing papers by Yu-Min Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yu-Min Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yu-Min Lin. The network helps show where Yu-Min Lin may publish in the future.

Co-authorship network of co-authors of Yu-Min Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Yu-Min Lin. A scholar is included among the top collaborators of Yu-Min Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yu-Min Lin. Yu-Min Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Huang, Pei‐Chen, et al.. (2022). Process-induced warpage and stress estimation of through glass via embedded interposer carrier with ring-type framework. Microelectronics Reliability. 129. 114476–114476. 4 indexed citations

Lee, Chang‐Chun, et al.. (2021). Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test. Microelectronic Engineering. 244-246. 111572–111572. 13 indexed citations

Lin, Yu-Min, Chunmin Wang, Chia‐Hsin Lee, et al.. (2019). An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications. 1463–1469. 14 indexed citations

Shen, Wen-Wei, Ming‐Jer Kao, Kuan‐Neng Chen, et al.. (2018). 3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV). IEEE Journal of the Electron Devices Society. 6. 396–402. 11 indexed citations

Lin, Yu-Min, Tao‐Chih Chang, Wei‐Chung Lo, et al.. (2015). A TXV-less Packaging Platform for the Era of IoTs. IMAPSource Proceedings. 2015(1). 1–5. 1 indexed citations

Ko, Cheng-Ta, Hsiang‐Hung Chang, Wen‐Li Tsai, et al.. (2014). Process integration of 3D stacking for backside illuminated image sensor. 82–85. 2 indexed citations

Zhan, Chau‐Jie, John H. Lau, Shangwei Chen, et al.. (2012). Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration. 636–640. 5 indexed citations

Lin, Yu-Min, et al.. (2012). Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections. 7 indexed citations

Lin, Yu-Min, Chau‐Jie Zhan, John H. Lau, et al.. (2011). Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking. 351–357. 37 indexed citations

10.

Chang, Tao‐Chih, et al.. (2011). Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding. 43. 419–422. 5 indexed citations

11.

Chen, Hsing-Yu, Dar-Zu Hsu, M.C. Yuang, et al.. (2011). A 40-Gb/s OFDM PON System Based on 10-GHz EAM and 10-GHz Direct-Detection PIN. IEEE Photonics Technology Letters. 24(1). 85–87. 17 indexed citations

12.

Qiu, Wei Qiao, Xiaoyan Sun, Mkaya Mwamburi, et al.. (2010). Plasma Amyloid-� Peptides and Homocysteine in Depression in the Homebound Elderly. North American Journal of Medicine and Science. 3(2). 61–61. 2 indexed citations

13.

Lin, Yu-Min, et al.. (2009). A novel optical access network architecture supporting seamless integration of RoF and OFDMA signals. European Conference on Optical Communication. 1–2. 5 indexed citations

14.

Yuang, M.C., et al.. (2009). A Novel Optical-Header Processing and Access Control System for a Packet-Switched WDM Metro Ring Network. Journal of Lightwave Technology. 27(21). 4907–4915. 5 indexed citations

15.

Tien, Po-Lung, Yu-Min Lin, & M.C. Yuang. (2009). A Novel OFDMA-PON Architecture toward Seamless Broadband and Wireless Integration. OMV2–OMV2. 13 indexed citations

16.

Lin, Chun-Ting, et al.. (2008). Optical direct-detection OFDM signal generation for radio-over-fiber link using frequency doubling scheme with carrier suppression. Optics Express. 16(9). 6056–6056. 50 indexed citations

17.

Yuang, M.C., Po-Lung Tien, Jason Chen, et al.. (2008). HOPSMAN: An Experimental Testbed System for a 10-Gb/s Optical Packet-Switched WDM Metro Ring Network. IEEE Communications Magazine. 46(7). 158–166. 19 indexed citations

18.

Yuang, M.C., et al.. (2006). Optical coarse packet-switched IP-over-WDM network (OPSINET): technologies and experiments. IEEE Journal on Selected Areas in Communications. 24(8). 117–127. 10 indexed citations

19.

Lin, Yu-Min, M.C. Yuang, San‐Liang Lee, & W.I. Way. (2004). Superimposed ASK label in a 10 Gbps multi-hop all-optical label swapping system. Optical Fiber Communication Conference. 1. 662–664. 5 indexed citations

20.

Lin, Yu-Min & W.I. Way. (1998). Feasibility study of transporting wireless CDMA signals over HFC networks. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3420. 30–30. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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