Yingtao Ding
Impact in
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- 3D IC and TSV technologies
- Advanced Memory and Neural Computing
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Signal Processing top 5%
- Direction-of-Arrival Estimation Techniques
- Speech and Audio Processing
Papers in
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- 3D IC and TSV technologies 38
- Electronic Packaging and Soldering Technologies 23
- Advanced MEMS and NEMS Technologies 14
- Semiconductor materials and devices 14
- Advanced Memory and Neural Computing 11
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- Metamaterials and Metasurfaces Applications 8
Yingtao Ding
87 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 58
- Electrical and Electronic Engineering 784
- Signal Processing 110
- Electronic, Optical and Magnetic Materials 173
- Aerospace Engineering 159
- Cellular and Molecular Neuroscience 117
Countries citing papers authored by Yingtao Ding
This map shows the geographic impact of Yingtao Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yingtao Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yingtao Ding more than expected).
Fields of papers citing papers by Yingtao Ding
This network shows the impact of papers produced by Yingtao Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yingtao Ding. The network helps show where Yingtao Ding may publish in the future.
Co-authors
The 25 scholars most cited alongside Yingtao Ding, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 0 | |
| 3 | 2025 | 0 | |
| 4 | 2025 | 0 | |
| 5 | 2025 | 1 | |
| 6 | 2024 | 1 | |
| 7 | 2024 | 1 | |
| 8 | 2024 | 0 | |
| 9 | 2024 | 4 | |
| 10 | 2024 | 1 | |
| 11 | 2023 | 5 | |
| 12 | 2023 | 0 | |
| 13 | 2022 | 71 | |
| 14 | 2022 | 3 | |
| 15 | 2021 | 25 | |
| 16 | 2021 | 28 | |
| 17 | 2021 | 77 | |
| 18 | 2021 | 46 | |
| 19 | 2018 | 16 | |
| 20 | 2016 | 6 |
About Yingtao Ding
Yingtao Ding is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Signal Processing and Instrumentation, having authored 98 papers that have together received 1.1k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (38 papers), Electronic Packaging and Soldering Technologies (23 papers), Advanced MEMS and NEMS Technologies (14 papers), Semiconductor materials and devices (14 papers), Advanced Memory and Neural Computing (11 papers), 2D Materials and Applications (10 papers), Metamaterials and Metasurfaces Applications (8 papers) and Advanced Antenna and Metasurface Technologies (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (784 citations), Signal Processing (110 citations), Electronic, Optical and Magnetic Materials (173 citations), Aerospace Engineering (159 citations) and Cellular and Molecular Neuroscience (117 citations). Yingtao Ding has collaborated with scholars based in China, United States and Denmark. Frequent co-authors include Zhiming Chen, Yilin Sun, Dan Xie, Huikai Xie, Yangyang Yan, Shiwei Ren, Fei Ding, Lei Xiao, Yadong Deng and Sergey I. Bozhevolnyi. Their work appears in journals such as IEEE Electron Device Letters, Microsystems & Nanoengineering, Science China Technological Sciences, Nano Research and Sensors.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.