C. T. Wang
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing 2
-
- 3D IC and TSV technologies 12
- Semiconductor materials and devices 5
- Electronic Packaging and Soldering Technologies 4
- Electromagnetic Compatibility and Noise Suppression 3
- Integrated Circuits and Semiconductor Failure Analysis 2
- Advanced Memory and Neural Computing 2
-
- Copper Interconnects and Reliability 2
- Co-authors
- Douglas YuW.C. ChiouS. Y. HouK. C. TingChristine ChiuCheng‐Hsien WuChung-Hao TsaiChung-Hsien Tsai
- Journals
- IEEE Transactions on Electron Devices (2 papers)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)
- Partner nations
- Taiwan
In The Last Decade
C. T. Wang
12 papers receiving 357 citations
Peers
Comparison fields: 5 of 30
- Hardware and Architecture 48
- Electrical and Electronic Engineering 338
- Automotive Engineering 31
- Electronic, Optical and Magnetic Materials 37
- Computer Networks and Communications 32
Countries citing papers authored by C. T. Wang
This map shows the geographic impact of C. T. Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. T. Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. T. Wang more than expected).
Fields of papers citing papers by C. T. Wang
This network shows the impact of papers produced by C. T. Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. T. Wang. The network helps show where C. T. Wang may publish in the future.
Co-authorship network
The 22 scholars most cited alongside C. T. Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 2 | |
| 2 | 2022 | 17 | |
| 3 | 2021 | 55 | |
| 4 | 2021 | 19 | |
| 5 | 2020 | 18 | |
| 6 | 2020 | 34 | |
| 7 | 2020 | 33 | |
| 8 | 2020 | 0 | |
| 9 | 2020 | 12 | |
| 10 | 2019 | 5 | |
| 11 | 2017 | 22 | |
| 12 | 2017 | 139 | |
| 13 | 2013 | 23 |
About C. T. Wang
C. T. Wang is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Aerospace Engineering and Infectious Diseases, having authored 13 papers that have together received 379 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (12 papers), Semiconductor materials and devices (5 papers), Electronic Packaging and Soldering Technologies (4 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Copper Interconnects and Reliability (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), VLSI and Analog Circuit Testing (2 papers) and Advanced Memory and Neural Computing (2 papers). The work is most often cited by research in Hardware and Architecture (48 citations), Electrical and Electronic Engineering (338 citations), Automotive Engineering (31 citations), Electronic, Optical and Magnetic Materials (37 citations) and Computer Networks and Communications (32 citations). C. T. Wang has collaborated with scholars based in Taiwan. Frequent co-authors include Douglas Yu, W.C. Chiou, S. Y. Hou, K. C. Ting, Christine Chiu, Cheng‐Hsien Wu, Chung-Hao Tsai, Chung-Hsien Tsai, Chin‐Wei Lu and E.B. Liao. Their work appears in journals such as IEEE Transactions on Electron Devices and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.