C. T. Wang

570 total citations
13 papers, 379 citations indexed

About

C. T. Wang is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, C. T. Wang has authored 13 papers receiving a total of 379 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 3 papers in Hardware and Architecture and 2 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in C. T. Wang's work include 3D IC and TSV technologies (12 papers), Semiconductor materials and devices (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). C. T. Wang is often cited by papers focused on 3D IC and TSV technologies (12 papers), Semiconductor materials and devices (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). C. T. Wang collaborates with scholars based in Taiwan. C. T. Wang's co-authors include Douglas Yu, W.C. Chiou, S. Y. Hou, K. C. Ting, Christine Chiu, Cheng‐Hsien Wu, Chung-Hao Tsai, Chung-Hsien Tsai, Chin‐Wei Lu and E.B. Liao and has published in prestigious journals such as IEEE Transactions on Electron Devices and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

In The Last Decade

C. T. Wang

12 papers receiving 357 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. T. Wang Taiwan	10	338	62	48	37	32	13	379
W.C. Chiou Taiwan	11	467 1.4×	75 1.2×	60 1.3×	49 1.3×	37 1.2×	22	517
R. Yu United States	6	370 1.1×	88 1.4×	24 0.5×	59 1.6×	26 0.8×	10	403
S. Y. Hou Taiwan	11	343 1.0×	52 0.8×	55 1.1×	41 1.1×	35 1.1×	20	395
Suresh Ramalingam United States	13	513 1.5×	117 1.9×	60 1.3×	50 1.4×	30 0.9×	38	563
Yoichiro Kurita Japan	9	374 1.1×	67 1.1×	18 0.4×	37 1.0×	21 0.7×	32	387
Riko Radojcic United States	11	282 0.8×	38 0.6×	38 0.8×	13 0.4×	43 1.3×	45	312
P. Coudrain France	12	423 1.3×	69 1.1×	31 0.6×	62 1.7×	31 1.0×	46	487
Chong Ser Choong Singapore	10	340 1.0×	64 1.0×	28 0.6×	48 1.3×	7 0.2×	47	375
M. J. Interrante United States	6	463 1.4×	71 1.1×	27 0.6×	52 1.4×	33 1.0×	7	487
M. Matsuo Japan	8	270 0.8×	53 0.9×	25 0.5×	25 0.7×	13 0.4×	21	284

Countries citing papers authored by C. T. Wang

Since Specialization

Citations

This map shows the geographic impact of C. T. Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. T. Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. T. Wang more than expected).

Fields of papers citing papers by C. T. Wang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. T. Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. T. Wang. The network helps show where C. T. Wang may publish in the future.

Co-authorship network of co-authors of C. T. Wang

This figure shows the co-authorship network connecting the top 25 collaborators of C. T. Wang. A scholar is included among the top collaborators of C. T. Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. T. Wang. C. T. Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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13 of 13 papers shown

1.

Liang, Yaru, et al.. (2023). Reliability Performance on Fine-Pitch SoIC™ Bond. 783–787. 2 indexed citations

2.

Wang, C. T., et al.. (2022). High Performance and Energy Efficient Computing with Advanced SoIC™ Scaling. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1090–1094. 17 indexed citations

3.

Lu, Chin‐Wei, Christine Chiu, K. C. Ting, et al.. (2021). Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2. 101–104. 55 indexed citations

4.

Tai, Shih-Peng, et al.. (2021). InFO_oS (Integrated Fan-Out on Substrate) Technology for Advanced Chiplet Integration. 130–135. 19 indexed citations

5.

Tsai, Chung-Hsien, et al.. (2020). Design and Analysis of Logic-HBM2E Power Delivery System on CoWoS^® Platform with Deep Trench Capacitor. 380–385. 18 indexed citations

6.

Tsai, Chung-Hao, et al.. (2020). Low Temperature SoIC Bonding and Stacking Technology for 12-/16-Hi High Bandwidth Memory (HBM). IEEE Transactions on Electron Devices. 67(12). 5343–5348. 34 indexed citations

7.

Liao, E.B., et al.. (2020). SoIC for Low-Temperature, Multi-Layer 3D Memory Integration. 855–860. 33 indexed citations

8.

Wang, C. T., et al.. (2020). Immersion in Memory Compute (ImMC) Technology. 1–2.

9.

Ko, T., et al.. (2020). Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology. 1120–1125. 12 indexed citations

10.

Tsai, Chien‐Hsiung, et al.. (2019). Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits. 25.3.1–25.3.4. 5 indexed citations

11.

Ting, K. C., Tianjun Yu, C. T. Wang, et al.. (2017). Wafer level integration of an advanced logic-memory system through 2^nd generation CoWoS® technology. T54–T55. 22 indexed citations

12.

Hou, S. Y., Christine Chiu, K. C. Ting, et al.. (2017). Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology. IEEE Transactions on Electron Devices. 64(10). 4071–4077. 139 indexed citations

13.

Lai, Wei‐Chih, Harry Chuang, Chung-Hao Tsai, et al.. (2013). 300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application. 13.4.1–13.4.4. 23 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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