David Ho

878 total citations
47 papers, 632 citations indexed

About

David Ho is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Automotive Engineering. According to data from OpenAlex, David Ho has authored 47 papers receiving a total of 632 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 5 papers in Hardware and Architecture and 4 papers in Automotive Engineering. Recurrent topics in David Ho's work include 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (26 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). David Ho is often cited by papers focused on 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (26 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). David Ho collaborates with scholars based in Singapore, Taiwan and United States. David Ho's co-authors include Fa Xing, Xiaowu Zhang, Chai Tai Chong, Chong Ser Choong, Batara Surya, Vempati Srinivasa Rao, Teck Guan Lim, Dim Lee Kwong, Songbai Zhang and Roshan Weerasekera and has published in prestigious journals such as Materials, Applied Physics Reviews and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

David Ho

47 papers receiving 597 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David Ho Singapore 12 583 113 94 70 36 47 632
Vasarla Nagendra Sekhar Singapore 11 417 0.7× 80 0.7× 50 0.5× 51 0.7× 18 0.5× 64 456
Soon Wee Ho Singapore 15 674 1.2× 115 1.0× 61 0.6× 72 1.0× 17 0.5× 55 736
Lixi Wan China 12 494 0.8× 119 1.1× 65 0.7× 55 0.8× 13 0.4× 137 612
Chai Tai Chong Singapore 10 422 0.7× 78 0.7× 67 0.7× 46 0.7× 20 0.6× 50 463
Chin‐Li Kao Taiwan 12 435 0.7× 61 0.5× 88 0.9× 81 1.2× 40 1.1× 40 496
L.W. Schaper United States 15 563 1.0× 117 1.0× 108 1.1× 62 0.9× 23 0.6× 64 669
Ser Choong Chong Singapore 12 446 0.8× 99 0.9× 46 0.5× 58 0.8× 15 0.4× 96 488
Chong Ser Choong Singapore 10 340 0.6× 64 0.6× 48 0.5× 36 0.5× 28 0.8× 47 375
Serguei Stoukatch Belgium 13 645 1.1× 234 2.1× 54 0.6× 90 1.3× 26 0.7× 54 787
Meng-Kai Shih Taiwan 12 418 0.7× 108 1.0× 29 0.3× 84 1.2× 45 1.3× 64 500

Countries citing papers authored by David Ho

Since Specialization
Citations

This map shows the geographic impact of David Ho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Ho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Ho more than expected).

Fields of papers citing papers by David Ho

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David Ho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Ho. The network helps show where David Ho may publish in the future.

Co-authorship network of co-authors of David Ho

This figure shows the co-authorship network connecting the top 25 collaborators of David Ho. A scholar is included among the top collaborators of David Ho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David Ho. David Ho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ho, David, Qing Shen, Bo Yang, et al.. (2023). In Situ Reactive Formation of Mixed Oxides in Additively Manufactured Cobalt Alloy. Materials. 16(10). 3707–3707. 2 indexed citations
2.
Ho, David, et al.. (2023). FO-EB-T Package Solution for High Performance Computing. 1038–1042. 2 indexed citations
3.
Chong, Chai Tai, et al.. (2021). Heterogeneous Integration with Embedded Fine Interconnect. 2216–2221. 9 indexed citations
4.
Ho, David, et al.. (2021). Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging. 226–230. 1 indexed citations
5.
Gourikutty, Sajay Bhuvanendran Nair, et al.. (2021). Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers. 37–41. 11 indexed citations
6.
Raju, Salahuddin, Don Disney, David Ho, et al.. (2020). Thin-Film Magnetic Inductors on Silicon for Integrated Power Converters. IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society. 2292–2295. 4 indexed citations
7.
Ho, David, et al.. (2020). Fan-Out Wafer Level Packaging Development Line. 440–444. 6 indexed citations
8.
Ho, David, et al.. (2020). 3D FOWLP Integration. 1728–1735. 3 indexed citations
9.
Ho, David, et al.. (2019). Innovative Flip Chip Package Solutions for Automotive Applications. 1432–1436. 4 indexed citations
10.
Ho, David, et al.. (2018). Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application. 331–336. 30 indexed citations
11.
Sekhar, Vasarla Nagendra, et al.. (2018). Laser Drilling of Thru Mold Vias (TMVs) for FOWLP Application. 940–943. 2 indexed citations
12.
Xing, Fa, David Ho, & T.C. Chai. (2018). Co-design for Extreme Large Package Solution with Embedded Fine Pitch Interposer (EFI) Technology. 1030–1038. 4 indexed citations
13.
Rao, Vempati Srinivasa, et al.. (2017). Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package. 615–622. 24 indexed citations
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Ho, David, et al.. (2014). Development of low profile fan out PoP solution with embedded passive. 1. 597–600. 3 indexed citations
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Yeap, Siew Bee, et al.. (2011). 135-GHz co-planar patch array on BCB/silicon with polymer-filled cavity. 344–347. 1 indexed citations
20.
Ho, David, et al.. (2011). Underfill characterization for multi-layer 3D-SiP stacked chip package. 462–468. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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Breakdown of academic impact, for papers by Vasarla Nagendra Sekhar Breakdown of academic impact, for papers by Soon Wee Ho Breakdown of academic impact, for papers by Lixi Wan Breakdown of academic impact, for papers by Chai Tai Chong Breakdown of academic impact, for papers by Chin‐Li Kao Breakdown of academic impact, for papers by L.W. Schaper Breakdown of academic impact, for papers by Ser Choong Chong Breakdown of academic impact, for papers by Chong Ser Choong Breakdown of academic impact, for papers by Serguei Stoukatch Breakdown of academic impact, for papers by Meng-Kai Shih
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