Dionysios Manessis
About
In The Last Decade
Dionysios Manessis
60 papers receiving 485 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 418
- Mechanical Engineering 128
- Biomedical Engineering 85
- Aerospace Engineering 73
- Electronic, Optical and Magnetic Materials 67
Countries citing papers authored by Dionysios Manessis
This map shows the geographic impact of Dionysios Manessis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dionysios Manessis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dionysios Manessis more than expected).
Fields of papers citing papers by Dionysios Manessis
This network shows the impact of papers produced by Dionysios Manessis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dionysios Manessis. The network helps show where Dionysios Manessis may publish in the future.
Co-authorship network of co-authors of Dionysios Manessis
This figure shows the co-authorship network connecting the top 25 collaborators of Dionysios Manessis. A scholar is included among the top collaborators of Dionysios Manessis based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dionysios Manessis. Dionysios Manessis is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 30 | |
| 2 | 21 | |
| 3 | 6 | |
| 4 | Development of advanced power modules for electric vehicle applications | 3 |
| 5 | 1 | |
| 6 | 3 | |
| 7 | Power modules with embedded components | 9 |
| 8 | Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration | 4 |
| 9 | Modular microelectronics by System-in-Packages with embedded components | 1 |
| 10 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages | 2 |
| 11 | Non-destructive X-Ray mapping of strain & warpage of die in packaged chips | 3 |
| 12 | Advancements in bumping technologies for flip chip and WLCSP packaging | 1 |
| 13 | 0 | |
| 14 | 36 | |
| 15 | 1 | |
| 16 | Stretchable conductor technology for elastic electronic systems | 3 |
| 17 | 7 | |
| 18 | 11 | |
| 19 | 3 | |
| 20 | Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping | 3 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.