David Tarng

574 total citations
50 papers, 407 citations indexed

About

David Tarng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, David Tarng has authored 50 papers receiving a total of 407 indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 9 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in David Tarng's work include Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (37 papers) and Copper Interconnects and Reliability (9 papers). David Tarng is often cited by papers focused on Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (37 papers) and Copper Interconnects and Reliability (9 papers). David Tarng collaborates with scholars based in Taiwan and Japan. David Tarng's co-authors include Meng-Kai Shih, C.-P Hung, Yung‐Sheng Lin, Kwang‐Lung Lin, Chien-Lung Liang, Chin‐Li Kao, Chih-Pin Hung, Dao-Long Chen, Chen-Chao Wang and Wei‐Hong Lai and has published in prestigious journals such as Scripta Materialia, Materials Chemistry and Physics and Nanomaterials.

In The Last Decade

David Tarng

47 papers receiving 381 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David Tarng Taiwan 13 353 103 70 62 46 50 407
Chin‐Li Kao Taiwan 12 435 1.2× 88 0.9× 81 1.2× 61 1.0× 39 0.8× 40 496
David Ho Singapore 12 583 1.7× 94 0.9× 70 1.0× 113 1.8× 34 0.7× 47 632
Vasarla Nagendra Sekhar Singapore 11 417 1.2× 50 0.5× 51 0.7× 80 1.3× 30 0.7× 64 456
Ser Choong Chong Singapore 12 446 1.3× 46 0.4× 58 0.8× 99 1.6× 35 0.8× 96 488
H. Frémont France 12 365 1.0× 42 0.4× 129 1.8× 62 1.0× 73 1.6× 68 424
Chai Tai Chong Singapore 10 422 1.2× 67 0.7× 46 0.7× 78 1.3× 43 0.9× 50 463
Cheng-Ta Ko Taiwan 15 597 1.7× 93 0.9× 56 0.8× 136 2.2× 35 0.8× 68 640
Lixi Wan China 12 494 1.4× 65 0.6× 55 0.8× 119 1.9× 24 0.5× 137 612
R. Kahle Germany 13 312 0.9× 36 0.3× 50 0.7× 63 1.0× 44 1.0× 35 372
Si Chen China 12 337 1.0× 50 0.5× 117 1.7× 89 1.4× 34 0.7× 83 415

Countries citing papers authored by David Tarng

Since Specialization
Citations

This map shows the geographic impact of David Tarng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Tarng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Tarng more than expected).

Fields of papers citing papers by David Tarng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David Tarng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Tarng. The network helps show where David Tarng may publish in the future.

Co-authorship network of co-authors of David Tarng

This figure shows the co-authorship network connecting the top 25 collaborators of David Tarng. A scholar is included among the top collaborators of David Tarng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David Tarng. David Tarng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lai, Wei‐Hong, et al.. (2024). Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application. IMAPSource Proceedings. 2021(DPC).
2.
Lee, Yu‐Chin, Chia‐Yu Chen, Kuo‐Shen Chen, et al.. (2022). Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1068–1073. 3 indexed citations
3.
Chiu, Tz-Cheng, et al.. (2022). Development and Application of the Moisture-Dependent Viscoelastic Model of Polyimide in Hygro-Thermo-Mechanical Analysis of Fan-Out Interconnect. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 746–753. 1 indexed citations
4.
Chen, Dao-Long, et al.. (2022). Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet Integration. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1074–1079. 6 indexed citations
5.
Shih, Meng-Kai, et al.. (2021). FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(4). 690–696. 25 indexed citations
6.
Hwang, Sheng‐Jye, Yuyang Chang, Huei‐Huang Lee, et al.. (2021). Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(1). 174–184. 3 indexed citations
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9.
Chen, He, et al.. (2020). System Thermal Analysis of RF SiP Module in Smartphone. 165–167. 1 indexed citations
10.
Tsai, Μ. Y., et al.. (2020). Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test. IEEE Transactions on Device and Materials Reliability. 20(2). 442–451. 4 indexed citations
11.
Shih, Meng-Kai, et al.. (2019). Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(9). 1765–1775. 25 indexed citations
12.
Tsai, Μ. Y., et al.. (2019). Evaluation of Three-Point Bending Strength of Thin Silicon Die With a Consideration of Geometric Nonlinearity. IEEE Transactions on Device and Materials Reliability. 19(4). 615–621. 12 indexed citations
13.
Chen, Dao-Long, et al.. (2019). Material and Structure Design Optimization for Panel-Level Fan-Out Packaging. 1710–1715. 3 indexed citations
14.
Tarng, David, et al.. (2019). New Developments of Copper Plating Technology for Embedded Power Chip Packages Challenges. 66. 1426–1431. 2 indexed citations
15.
Song, Jenn‐Ming, et al.. (2018). Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging. Sensors and Materials. 30(12). 2889–2889. 1 indexed citations
16.
Wang, Minghan, et al.. (2018). Substrate Shrinkage Effect on Warpage Evaluation for High Bandwidth Package on Package. 131. 5–9. 3 indexed citations
17.
18.
Song, Jenn‐Ming, et al.. (2017). Low temperature direct Cu bonding for MEMS packaging. 57–60. 2 indexed citations
19.
Shih, Meng-Kai, et al.. (2017). Parameters study of thermomechanical reliability of board-level fan-out package. 66–70. 5 indexed citations
20.
Shih, Meng-Kai, et al.. (2017). High Thermal Performance Package with Anisotropic Thermal Conductive Material. 1348–1354. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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