David Tarng
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- Electronic Packaging and Soldering Technologies 41
- 3D IC and TSV technologies 37
- Electromagnetic Compatibility and Noise Suppression 4
- Electrodeposition and Electroless Coatings 3
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- Copper Interconnects and Reliability 9
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- Advanced Surface Polishing Techniques 4
- Nanofabrication and Lithography Techniques 4
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- Heat Transfer and Optimization 3
- Co-authors
- Meng-Kai ShihC.-P HungYung‐Sheng LinKwang‐Lung LinChien-Lung LiangChin‐Li KaoChih-Pin HungDao-Long Chen
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsHardware and Architecture
In The Last Decade
David Tarng
47 papers receiving 381 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 353
- Electronic, Optical and Magnetic Materials 103
- Hardware and Architecture 16
- Automotive Engineering 28
- Industrial and Manufacturing Engineering 22
Countries citing papers authored by David Tarng
This map shows the geographic impact of David Tarng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Tarng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Tarng more than expected).
Fields of papers citing papers by David Tarng
This network shows the impact of papers produced by David Tarng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Tarng. The network helps show where David Tarng may publish in the future.
Co-authorship network
The 25 scholars most cited alongside David Tarng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2022 | 3 | |
| 3 | 2022 | 1 | |
| 4 | 2022 | 6 | |
| 5 | 2021 | 25 | |
| 6 | 2021 | 3 | |
| 7 | 2021 | 6 | |
| 8 | 2021 | 5 | |
| 9 | 2020 | 1 | |
| 10 | 2020 | 4 | |
| 11 | 2019 | 25 | |
| 12 | 2019 | 12 | |
| 13 | 2019 | 3 | |
| 14 | 2019 | 2 | |
| 15 | 2018 | 1 | |
| 16 | 2018 | 3 | |
| 17 | 2018 | 16 | |
| 18 | 2017 | 2 | |
| 19 | 2017 | 5 | |
| 20 | 2017 | 6 |
About David Tarng
David Tarng is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Industrial and Manufacturing Engineering and Mechanics of Materials, having authored 50 papers that have together received 407 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (37 papers), Copper Interconnects and Reliability (9 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Advanced Surface Polishing Techniques (4 papers), Nanofabrication and Lithography Techniques (4 papers), Heat Transfer and Optimization (3 papers) and Electrodeposition and Electroless Coatings (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (353 citations), Electronic, Optical and Magnetic Materials (103 citations), Hardware and Architecture (16 citations), Automotive Engineering (28 citations) and Industrial and Manufacturing Engineering (22 citations). David Tarng has collaborated with scholars based in Taiwan and Japan. Frequent co-authors include Meng-Kai Shih, C.-P Hung, Yung‐Sheng Lin, Kwang‐Lung Lin, Chien-Lung Liang, Chin‐Li Kao, Chih-Pin Hung, Dao-Long Chen, Chen-Chao Wang and Wei‐Hong Lai. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Nanomaterials, Scripta Materialia and Materials Chemistry and Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.