Lixi Wan
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Semiconductor Lasers and Optical Devices
- Radio Frequency Integrated Circuit Design
- Photonic and Optical Devices
Papers in
-
- 3D IC and TSV technologies 66
- Electromagnetic Compatibility and Noise Suppression 44
- Electronic Packaging and Soldering Technologies 43
- Semiconductor Lasers and Optical Devices 27
- Photonic and Optical Devices 18
- Microwave Engineering and Waveguides 13
- Radio Frequency Integrated Circuit Design 12
- Electrostatic Discharge in Electronics 10
- Co-authors
- Daquan YuLiqiang CaoMadhavan SwaminathanRao TummalaFengze HouDaniel GuidottiP.M. RajD. Balaraman
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Microwave and Optical Technology Letters (2 papers)Microsystem Technologies (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Microelectronics Reliability (2 papers)
- Partner nations
- ChinaUnited StatesHong Kong
In The Last Decade
Lixi Wan
121 papers receiving 575 citations
Peers
Comparison fields: 5 of 48
- Electrical and Electronic Engineering 494
- Electronic, Optical and Magnetic Materials 65
- Biomedical Engineering 119
- Polymers and Plastics 37
- Aerospace Engineering 63
Countries citing papers authored by Lixi Wan
This map shows the geographic impact of Lixi Wan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lixi Wan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lixi Wan more than expected).
Fields of papers citing papers by Lixi Wan
This network shows the impact of papers produced by Lixi Wan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lixi Wan. The network helps show where Lixi Wan may publish in the future.
Co-authors
The 25 scholars most cited alongside Lixi Wan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | Synthesis of ZnO nanowires by solvothermal method and fabrication of ZnO nanowires film via microfiltration method | 2014 | 1 |
| 3 | 2014 | 1 | |
| 4 | 2013 | 7 | |
| 5 | 2013 | 4 | |
| 6 | Review on the Thermal Mechanical Reliability of TSV Structures | 2012 | 8 |
| 7 | 2012 | 0 | |
| 8 | 2012 | 1 | |
| 9 | 2011 | 0 | |
| 10 | 2011 | 0 | |
| 11 | 2011 | 6 | |
| 12 | 2009 | 0 | |
| 13 | 2009 | 6 | |
| 14 | 2008 | 1 | |
| 15 | 2007 | 1 | |
| 16 | 2007 | 11 | |
| 17 | 2007 | 14 | |
| 18 | 2005 | 8 | |
| 19 | 2005 | 24 | |
| 20 | 2004 | 3 |
About Lixi Wan
Lixi Wan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Automotive Engineering, Polymers and Plastics and Biomedical Engineering, having authored 137 papers that have together received 612 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (66 papers), Electromagnetic Compatibility and Noise Suppression (44 papers), Electronic Packaging and Soldering Technologies (43 papers), Semiconductor Lasers and Optical Devices (27 papers), Photonic and Optical Devices (18 papers), Microwave Engineering and Waveguides (13 papers), Radio Frequency Integrated Circuit Design (12 papers) and Electrostatic Discharge in Electronics (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (494 citations), Electronic, Optical and Magnetic Materials (65 citations), Biomedical Engineering (119 citations), Polymers and Plastics (37 citations) and Aerospace Engineering (63 citations). Lixi Wan has collaborated with scholars based in China, United States and Hong Kong. Frequent co-authors include Daquan Yu, Liqiang Cao, Madhavan Swaminathan, Rao Tummala, Fengze Hou, Daniel Guidotti, P.M. Raj, D. Balaraman, Weiping Jing and Peisheng Liu. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microwave and Optical Technology Letters, Microsystem Technologies, IEEE Transactions on Components and Packaging Technologies and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.