S. Nunes

541 total citations
16 papers, 417 citations indexed

About

S. Nunes is a scholar working on Electrical and Electronic Engineering, Polymers and Plastics and Materials Chemistry. According to data from OpenAlex, S. Nunes has authored 16 papers receiving a total of 417 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 7 papers in Polymers and Plastics and 6 papers in Materials Chemistry. Recurrent topics in S. Nunes's work include Synthesis and properties of polymers (7 papers), Copper Interconnects and Reliability (3 papers) and 3D IC and TSV technologies (3 papers). S. Nunes is often cited by papers focused on Synthesis and properties of polymers (7 papers), Copper Interconnects and Reliability (3 papers) and 3D IC and TSV technologies (3 papers). S. Nunes collaborates with scholars based in United States, Brazil and Portugal. S. Nunes's co-authors include J. Paraszczak, Da‐Yuan Shih, E. Galligan, F.J.G. Silva, R.D.S.G. Campilho, M. D. Banea, Lucas F. M. da Silva, John J. Ritsko, R. Flitsch and G.V. Kopcsay and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Applied Polymer Science.

In The Last Decade

S. Nunes

15 papers receiving 401 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. Nunes United States 7 256 129 73 71 57 16 417
Zhanjun Gao United States 11 63 0.2× 171 1.3× 14 0.2× 42 0.6× 25 0.4× 28 350
R. Tilgner Germany 12 195 0.8× 259 2.0× 26 0.4× 20 0.3× 17 0.3× 40 423
J. Renard France 15 37 0.1× 191 1.5× 48 0.7× 36 0.5× 28 0.5× 31 458
Zhi Gong China 10 186 0.7× 33 0.3× 28 0.4× 20 0.3× 34 0.6× 27 310
Philipp M. Nellen Switzerland 13 423 1.7× 31 0.2× 21 0.3× 22 0.3× 107 1.9× 48 576
Dongpyo Hong South Korea 9 98 0.4× 25 0.2× 43 0.6× 19 0.3× 74 1.3× 29 289
Fajun Yi China 15 63 0.2× 127 1.0× 20 0.3× 37 0.5× 36 0.6× 36 427
Soheil Saadat United States 9 84 0.3× 61 0.5× 63 0.9× 16 0.2× 223 3.9× 25 561
C. W. Nelson United States 6 153 0.6× 239 1.9× 16 0.2× 19 0.3× 22 0.4× 12 366

Countries citing papers authored by S. Nunes

Since Specialization
Citations

This map shows the geographic impact of S. Nunes's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Nunes with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Nunes more than expected).

Fields of papers citing papers by S. Nunes

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Nunes. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Nunes. The network helps show where S. Nunes may publish in the future.

Co-authorship network of co-authors of S. Nunes

This figure shows the co-authorship network connecting the top 25 collaborators of S. Nunes. A scholar is included among the top collaborators of S. Nunes based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Nunes. S. Nunes is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

16 of 16 papers shown
1.
Nunes, S., et al.. (2015). Comparative Failure Assessment of Single and Double Lap Joints with Varying Adhesive Systems. The Journal of Adhesion. 92(7-9). 610–634. 90 indexed citations
2.
Nunes, S.. (2004). IBM Research: Ultimate Source for New Businesses. Research-Technology Management. 47(2). 20–23. 2 indexed citations
3.
Shih, Da‐Yuan, C. Narayan, John E. Lewis, et al.. (2003). Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures. 1002–1014. 2 indexed citations
4.
Haring, R.A., S. Nunes, E. Galligan, et al.. (1995). Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures. Journal of materials research/Pratt's guide to venture capital sources. 10(4). 1028–1037. 2 indexed citations
5.
Shih, Da‐Yuan, J. Paraszczak, John E. Lewis, et al.. (1993). Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(1). 74–88. 2 indexed citations
6.
Goldblatt, R., S. Nunes, N. J. Chou, et al.. (1992). Characterization of water vapor plasma‐modified polyimide. Journal of Applied Polymer Science. 46(12). 2189–2202. 21 indexed citations
7.
Shih, Da‐Yuan, et al.. (1992). In‐plane solvent diffusion in a photosensitive polyimide. Journal of Applied Polymer Science. 46(7). 1291–1299. 1 indexed citations
8.
Shih, Da‐Yuan, N. Klymko, R. Flitsch, J. Paraszczak, & S. Nunes. (1991). Oxygen induced adhesion degradation at metal/polyimide interface. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 9(6). 2963–2974. 45 indexed citations
9.
Walker, G. F., et al.. (1991). Cu passivation: A method of inhibiting copper-polyamic acid interactions. Applied Physics Letters. 59(12). 1424–1426. 6 indexed citations
10.
Deutsch, A., G.V. Kopcsay, E. Galligan, et al.. (1991). <title>Electrical characteristics of lossy interconnections for high-performance computer applications</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1389. 161–176.
12.
Deutsch, A., G.V. Kopcsay, E. Galligan, et al.. (1990). High-speed signal propagation on lossy transmission lines. IBM Journal of Research and Development. 34(4). 601–615. 155 indexed citations
13.
Nunes, S., et al.. (1990). RBS analysis of Si diffusion in photoresist during silylation. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 45(1-4). 216–218. 1 indexed citations
14.
Galligan, E., et al.. (1990). In-plane solvent diffusion in a soluble polyimide lift-off structure. Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena. 8(5). 1038–1043. 5 indexed citations
15.
Galligan, E., et al.. (1990). The effect of solvent absorption on the electrical and dielectric properties of polyimide films. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 8(3). 1521–1528. 6 indexed citations
16.
Paraszczak, J., N. Klymko, R. Flitsch, et al.. (1989). A study of the chemical and physical interaction between copper and polyimide. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 7(3). 1402–1412. 37 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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