Kenneth P. Rodbell

3.7k citations

109 papers · 2.8k indexed · h-index 27

Impact in

Electronic, Optical and Magnetic Materials top 2%
- Copper Interconnects and Reliability
Hardware and Architecture top 2%
- VLSI and Analog Circuit Testing

Papers in

Electronic, Optical and Magnetic Materials 50
- Copper Interconnects and Reliability 50
Electrical and Electronic Engineering 94
- Semiconductor materials and devices 54
- Radiation Effects in Electronics 41
- Integrated Circuits and Semiconductor Failure Analysis 20
- Electronic Packaging and Soldering Technologies 17

Co-authors: D. B. Knorr Michael S. Gordon David F. Heidel D. P. Tracy C.‐K. Hu Kelvin G. Lynn Marc H. Weber Henry H. K. Tang
Journals: IEEE Transactions on Nuclear Science (27 papers)Applied Physics Letters (12 papers)Journal of Applied Physics (11 papers)IBM Journal of Research and Development (5 papers)Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms (4 papers)
Partner nations: United States Netherlands Canada

In The Last Decade

Kenneth P. Rodbell

108 papers receiving 2.7k citations

Peers

Countries citing papers authored by Kenneth P. Rodbell

Since Specialization

Citations

This map shows the geographic impact of Kenneth P. Rodbell's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kenneth P. Rodbell with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kenneth P. Rodbell more than expected).

Fields of papers citing papers by Kenneth P. Rodbell

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kenneth P. Rodbell. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kenneth P. Rodbell. The network helps show where Kenneth P. Rodbell may publish in the future.

Co-authors

The 25 scholars most cited alongside Kenneth P. Rodbell, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Kenneth P. Rodbell Line = papers co-authored together Kenneth P. Rodbell links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Quasiparticle tunneling as a probe of Josephson junction barrier and capacitor material in superconducting qubits npj Quantum Information ·Cihan Kurter, Conal E. Murray, R. T. Gordon, B. B. Wymore, Martin Sandberg, R. M. Shelby, Andrew Eddins, Vivekananda P. Adiga, A. D. K. Finck, Elmer Ccopa Rivera, Adam Stabile, Bryan Trimm, Brent A. Wacaser, Karthik Balakrishnan, A. Pyzyna, J.W. Sleight, Matthias Steffen, Kenneth P. Rodbell	2022	20
2	Environmental radiation impact on lifetimes and quasiparticle tunneling rates of fixed-frequency transmon qubits Applied Physics Letters ·R. T. Gordon, Conal E. Murray, Cihan Kurter, Martin Sandberg, Shawn A. Hall, Karthik Balakrishnan, R. M. Shelby, Brent A. Wacaser, Adam Stabile, J.W. Sleight, Markus Brink, Mary Beth Rothwell, Kenneth P. Rodbell, Oliver Dial, Matthias Steffen	2022	37
3	Low-Energy Protons—Where and Why “Rare Events” Matter IEEE Transactions on Nuclear Science ·Kenneth P. Rodbell	2020	11
4	Low Energy Proton SEUs in 32-nm SOI SRAMs at Low Vdd IEEE Transactions on Nuclear Science ·Kenneth P. Rodbell, Michael S. Gordon, Kevin Stawiasz, Phil Oldiges, K. Lilja, Marek Turowski	2017	11
5	Measurements of radioactive contaminants in semiconductor materials Semiconductor Science and Technology ·Michael S. Gordon, Kenneth P. Rodbell, Conal E. Murray, Brendan D. McNally	2016	6
6	Total-ionizing-dose radiation response of 32 nm partially and 45 nm fully-depleted SOI devices Nadia Rezzak, En Xia Zhang, Dennis R. Ball, Michael L. Alles, T. D. Loveless, Ronald D. Schrimpf, Kenneth P. Rodbell	2012	17
7	32 and 45 nm Radiation-Hardened-by-Design (RHBD) SOI Latches IEEE Transactions on Nuclear Science ·Kenneth P. Rodbell, David F. Heidel, Jonathan A. Pellish, Paul W. Marshall, Henry H. K. Tang, Conal E. Murray, Kenneth A. LaBel, Michael S. Gordon, Kevin Stawiasz, James R. Schwank, Melanie D. Berg, Hak Kim, M. Friendlich, Anthony M. Phan, C.M. Seidleck	2011	51
8	Hardness assurance testing for proton direct ionization effects James R. Schwank, M.R. Shaneyfelt, Véronique Ferlet-Cavrois, P.E. Dodd, E. W. Blackmore, Jonathan A. Pellish, Kenneth P. Rodbell, David F. Heidel, Paul W. Marshall, Kenneth A. LaBel, Pascale Gouker, Nelson Tam, Richard Wong, Shi-Jie Wen, Robert A. Reed, Scott M. Dalton, Scot E. Swanson	2011	4
9	Impact of Spacecraft Shielding on Direct Ionization Soft Error Rates NASA STI Repository (National Aeronautics and Space Administration) ·Jonathan A. Pellish, M.A. Xapsos, C. Stauffer, Thomas Jordan, Ray Ladbury, Timothy R. Oldham, Paul W. Marshall, David F. Heidel, Kenneth P. Rodbell	2010	1
10	Modeling of Alpha-Induced Single Event Upsets for 45 nm Node SOI Devices Using Realistic C4 and 3D Circuit Geometries IEEE Transactions on Nuclear Science ·Henry H. K. Tang, Conal E. Murray, Giovanni Fiorenza, Kenneth P. Rodbell, David F. Heidel	2009	4
11	Reliability of Cu Interconnects with Ta Implant Jeff Gambino, T. Sullivan, F. Chen, J. Gill, S. Mongeon, Ellen Adams, Jay Burnham, Kenneth P. Rodbell	2007	2
12	Low-Energy Proton-Induced Single-Event-Upsets in 65 nm Node, Silicon-on-Insulator, Latches and Memory Cells IEEE Transactions on Nuclear Science ·Kenneth P. Rodbell, David F. Heidel, Henry H. K. Tang, Michael S. Gordon, Phil Oldiges, Conal E. Murray	2007	151
13	Several issues regarding the nanopore structure in low-dielectric-constant films detected by positron annihilation lifetime spectroscopy Radiation Physics and Chemistry ·Cailin Wang, Marc H. Weber, Kelvin G. Lynn, Kenneth P. Rodbell	2003	1
14	Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu Journal of materials research/Pratt's guide to venture capital sources ·G. Lucadamo, Katayun Barmak, Kenneth P. Rodbell	2001	6
15	Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching Thin Solid Films ·R. G. Filippi, M. Gribelyuk, Thomas Joseph, Terence Kane, T. Sullivan, L. A. Clevenger, G. Costrini, Jeff Gambino, R. C. Iggulden, E. Kiewra, X. J. Ning, R.V.S.S.N. Ravikumar, R. Schnabel, G. Stojakovic, Serge Weber, L. Gignac, C.‐K. Hu, D.L. Rath, Kenneth P. Rodbell	2001	5
16	Study of Positronium in Low-k Dielectric Films by Means of 2D-Angular Correlation Experiments at a High-Intensity Slow-Positron Beam Materials science forum ·Th. Gessmann, Mihail P. Petkov, Marc H. Weber, Kelvin G. Lynn, Kenneth P. Rodbell, P. Asoka‐Kumar, W. Stoeffl, R. H. Howell	2001	8
17	Stress and phase changes in a low-thermal-expansion Al-3at.%Ge alloy film on oxidized silicon wafers Materials Chemistry and Physics ·K. N. Tu, Kenneth P. Rodbell, S. R. Herd, D. J. Mikalsen	1993	2
18	Effects of Film Texture on Electromigration Lifetime Predictions MRS Proceedings ·D. B. Knorr, Kenneth P. Rodbell	1992	9
19	A Comparison Between Noise Measurements and Conventional Electromigration Reliability Testing Reliability physics ·J.G. Cottle, T.M. Chen, Kenneth P. Rodbell	1988	2
20	Nuclear reaction analysis for hydrogen in nonvacuum environments Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms ·K.M. Horn, W. A. Lanford, Kenneth P. Rodbell, P. J. Ficalora	1987	6

About Kenneth P. Rodbell

Kenneth P. Rodbell is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Hardware and Architecture, Radiation and Mechanics of Materials, having authored 109 papers that have together received 2.8k indexed citations. Recurring topics across this work include Semiconductor materials and devices (54 papers), Copper Interconnects and Reliability (50 papers), Radiation Effects in Electronics (41 papers), Integrated Circuits and Semiconductor Failure Analysis (20 papers), Electronic Packaging and Soldering Technologies (17 papers), Semiconductor materials and interfaces (12 papers), Metal and Thin Film Mechanics (12 papers) and Muon and positron interactions and applications (11 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (1.1k citations), Hardware and Architecture (323 citations), Radiation (337 citations), Electrical and Electronic Engineering (2.2k citations) and Mechanics of Materials (601 citations). Kenneth P. Rodbell has collaborated with scholars based in United States, Netherlands and Canada. Frequent co-authors include D. B. Knorr, Michael S. Gordon, David F. Heidel, D. P. Tracy, C.‐K. Hu, Kelvin G. Lynn, Marc H. Weber, Henry H. K. Tang, Mihail P. Petkov and C. Cabral. Their work appears in journals such as IEEE Transactions on Nuclear Science, Applied Physics Letters, Journal of Applied Physics, IBM Journal of Research and Development and Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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