David F. Heidel
- Hardware and Architecture top 2%
- VLSI and Analog Circuit Testing 14
- Physical Unclonable Functions (PUFs) and Hardware Security 5
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- Radiation Effects in Electronics 28
- Integrated Circuits and Semiconductor Failure Analysis 21
- Semiconductor materials and devices 20
- Advancements in Semiconductor Devices and Circuit Design 13
- Low-power high-performance VLSI design 8
- Electromagnetic Compatibility and Noise Suppression 4
- Radiation top 5%
- Nuclear and High Energy Physics top 10%
- Condensed Matter Physics top 10%
David F. Heidel
51 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 43
- Hardware and Architecture 379
- Electrical and Electronic Engineering 1.0k
- Radiation 145
- Nuclear and High Energy Physics 83
- Condensed Matter Physics 65
Countries citing papers authored by David F. Heidel
This map shows the geographic impact of David F. Heidel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David F. Heidel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David F. Heidel more than expected).
Fields of papers citing papers by David F. Heidel
This network shows the impact of papers produced by David F. Heidel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David F. Heidel. The network helps show where David F. Heidel may publish in the future.
Co-authorship network
The 25 scholars most cited alongside David F. Heidel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 51 | |
| 2 | 2011 | 4 | |
| 3 | Impact of Spacecraft Shielding on Direct Ionization Soft Error Rates | 2010 | 1 |
| 4 | 2010 | 13 | |
| 5 | 2009 | 4 | |
| 6 | 2007 | 7 | |
| 7 | 2007 | 151 | |
| 8 | 2005 | 25 | |
| 9 | 2003 | 5 | |
| 10 | 2003 | 4 | |
| 11 | 2003 | 22 | |
| 12 | 2002 | 1 | |
| 13 | 2002 | 30 | |
| 14 | 2000 | 25 | |
| 15 | 1999 | 26 | |
| 16 | 1991 | 3 | |
| 17 | 1983 | 2 | |
| 18 | 1982 | 1 | |
| 19 | 1981 | 6 | |
| 20 | 1978 | 4 |
About David F. Heidel
David F. Heidel is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Radiation, having authored 54 papers that have together received 1.2k indexed citations. Recurring topics across this work include Radiation Effects in Electronics (28 papers), Integrated Circuits and Semiconductor Failure Analysis (21 papers), Semiconductor materials and devices (20 papers), VLSI and Analog Circuit Testing (14 papers), Advancements in Semiconductor Devices and Circuit Design (13 papers), Low-power high-performance VLSI design (8 papers), Physical Unclonable Functions (PUFs) and Hardware Security (5 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). The work is most often cited by research in Hardware and Architecture (379 citations), Electrical and Electronic Engineering (1.0k citations) and Radiation (145 citations). David F. Heidel has collaborated with scholars based in United States, Netherlands and Canada. Frequent co-authors include Kenneth P. Rodbell, Michael S. Gordon, Henry H. K. Tang, Phil Oldiges, Conal E. Murray, Paul W. Marshall, K.A. Jenkins, Kenneth A. LaBel, James R. Schwank and M.R. Shaneyfelt.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.