T. Sullivan
- Civil and Structural Engineering top 10%
- Geophysics top 10%
- Electrical and Electronic Engineering
- Biomedical Engineering
- Mechanics of Materials
- Co-authors
- Norman AbrahamsonJ.B. SavyRichard C. QuittmeyerRobert YoungsJames CaseyJohn W. WhitneyJ. C. SteppKevin J. Coppersmith
- Topics
- Copper Interconnects and Reliability (5 papers)Electronic Packaging and Soldering Technologies (5 papers)Semiconductor materials and devices (4 papers)
- Partner nations
- United StatesCanadaGermany
In The Last Decade
T. Sullivan
11 papers receiving 188 citations
Peers
Comparison fields: 5 of 33
- Civil and Structural Engineering 112
- Geophysics 84
- Electrical and Electronic Engineering 52
- Biomedical Engineering 24
- Mechanics of Materials 21
Countries citing papers authored by T. Sullivan
This map shows the geographic impact of T. Sullivan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Sullivan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Sullivan more than expected).
Fields of papers citing papers by T. Sullivan
This network shows the impact of papers produced by T. Sullivan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Sullivan. The network helps show where T. Sullivan may publish in the future.
Co-authorship network of co-authors of T. Sullivan
This figure shows the co-authorship network connecting the top 25 collaborators of T. Sullivan. A scholar is included among the top collaborators of T. Sullivan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Sullivan. T. Sullivan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 1 | |
| 3 | 3 | |
| 4 | 32 | |
| 5 | 5 | |
| 6 | 1 | |
| 7 | 129 | |
| 8 | 5 | |
| 9 | 4 | |
| 10 | 0 | |
| 11 | Waste package reliability | 1 |
| 12 | 24 |
About T. Sullivan
T. Sullivan is a scholar working on Electronic, Optical and Magnetic Materials, Ceramics and Composites and Hardware and Architecture, having authored 12 papers that have together received 207 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Semiconductor materials and devices (4 papers). The work is most often cited by research in Geophysics (84 citations), Civil and Structural Engineering (112 citations) and Statistics, Probability and Uncertainty (15 citations). T. Sullivan has collaborated with scholars based in United States, Canada and Germany. Frequent co-authors include Norman Abrahamson, J.B. Savy, Richard C. Quittmeyer, Robert Youngs, James Casey, John W. Whitney, J. C. Stepp, Kevin J. Coppersmith, Gabriel R. Toro and Ivan G. Wong. Their work appears in journals such as Thin Solid Films, International Journal of Plasticity and Earthquake Spectra.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.