T. Sullivan

738 total citations
12 papers, 207 citations indexed

About

T. Sullivan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Civil and Structural Engineering. According to data from OpenAlex, T. Sullivan has authored 12 papers receiving a total of 207 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Civil and Structural Engineering. Recurrent topics in T. Sullivan's work include Copper Interconnects and Reliability (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Semiconductor materials and devices (4 papers). T. Sullivan is often cited by papers focused on Copper Interconnects and Reliability (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Semiconductor materials and devices (4 papers). T. Sullivan collaborates with scholars based in United States, Canada and Germany. T. Sullivan's co-authors include Norman Abrahamson, J.B. Savy, Richard C. Quittmeyer, Robert Youngs, James Casey, John W. Whitney, J. C. Stepp, Kevin J. Coppersmith, Gabriel R. Toro and Ivan G. Wong and has published in prestigious journals such as Thin Solid Films, International Journal of Plasticity and Earthquake Spectra.

In The Last Decade

T. Sullivan

11 papers receiving 188 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T. Sullivan United States	5	112	84	52	24	21	12	207
Romain Sousa Portugal	11	362 3.2×	23 0.3×	85 1.6×	6 0.3×	8 0.4×	32	466
Jae-Kwang Ahn South Korea	10	108 1.0×	139 1.7×	8 0.2×	4 0.2×	31 1.5×	36	287
Xin Zhong Germany	12	23 0.2×	284 3.4×	10 0.2×	28 1.2×	120 5.7×	32	408
Junfeng Pan China	6	89 0.8×	32 0.4×	50 1.0×	14 0.6×	354 16.9×	14	423
Y. J. Wang United States	4	73 0.7×	68 0.8×	29 0.6×	84 3.5×	331 15.8×	6	377
B. Froelich France	9	45 0.4×	90 1.1×	8 0.2×	32 1.3×	70 3.3×	26	357
S. Dey India	13	54 0.5×	126 1.5×	40 0.8×	22 0.9×	321 15.3×	21	386
G. Moreau France	12	137 1.2×	9 0.1×	415 8.0×	20 0.8×	21 1.0×	35	523
V. K. Sharma India	16	130 1.2×	121 1.4×	22 0.4×	34 1.4×	418 19.9×	25	474
Zhigang Shao China	12	9 0.1×	322 3.8×	66 1.3×	23 1.0×	12 0.6×	32	420

Countries citing papers authored by T. Sullivan

Since Specialization

Citations

This map shows the geographic impact of T. Sullivan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Sullivan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Sullivan more than expected).

Fields of papers citing papers by T. Sullivan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Sullivan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Sullivan. The network helps show where T. Sullivan may publish in the future.

Co-authorship network of co-authors of T. Sullivan

This figure shows the co-authorship network connecting the top 25 collaborators of T. Sullivan. A scholar is included among the top collaborators of T. Sullivan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Sullivan. T. Sullivan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

12 of 12 papers shown

1.

Gambino, Jeff, et al.. (2007). Reliability of Cu Interconnects with Ta Implant. 81. 22–24. 2 indexed citations

2.

Aubel, Oliver, et al.. (2006). Practical considerations for Wafer-Level Electromigration Monitoring in high volume production. 105–110. 1 indexed citations

3.

Hook, Terence B., et al.. (2006). Charging Damage and Product Impact in a Bulk CMOS Technology. 1–4. 3 indexed citations

4.

Nordquist, Christopher, et al.. (2006). A DC to 10-GHz 6-b RF MEMS time delay circuit. IEEE Microwave and Wireless Components Letters. 16(5). 305–307. 32 indexed citations

5.

Sullivan, T., et al.. (2003). Electromigration study of Al and Cu metallization using WLR isothermal method. 327–335. 5 indexed citations

6.

Borucki, L., R. Mann, G. L. Miles, J. Slinkman, & T. Sullivan. (2003). A model for titanium silicide film growth. 348–351. 1 indexed citations

7.

Stepp, J. C., Ivan G. Wong, John W. Whitney, et al.. (2001). Probabilistic Seismic Hazard Analyses for Ground Motions and Fault Displacement at Yucca Mountain, Nevada. Earthquake Spectra. 17(1). 113–151. 129 indexed citations

8.

Filippi, R. G., M. Gribelyuk, T. Sullivan, et al.. (2001). Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching. Thin Solid Films. 388(1-2). 303–314. 5 indexed citations

9.

Hu, Chunhua, D. C. Edelstein, Cyprian Uzoh, & T. Sullivan. (1996). Comparison of electromigration in submicron Al(Cu) and Cu thin film lines. AIP conference proceedings. 373. 153–168. 4 indexed citations

10.

Li, Che‐Yu, et al.. (1991). Microhardness of Thin SIO₂ Films On Silicon.. MRS Proceedings. 226.

11.

Sullivan, T., et al.. (1986). Waste package reliability. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 1 indexed citations

12.

Casey, James & T. Sullivan. (1985). Pressure dependency, strength-differential effect, and plastic volume expansion in metals. International Journal of Plasticity. 1(1). 39–61. 24 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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