Rahul Agarwal

673 total citations
32 papers, 492 citations indexed

About

Rahul Agarwal is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, Rahul Agarwal has authored 32 papers receiving a total of 492 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Biomedical Engineering, 10 papers in Electrical and Electronic Engineering and 9 papers in Mechanical Engineering. Recurrent topics in Rahul Agarwal's work include 3D IC and TSV technologies (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers) and Cavitation Phenomena in Pumps (4 papers). Rahul Agarwal is often cited by papers focused on 3D IC and TSV technologies (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers) and Cavitation Phenomena in Pumps (4 papers). Rahul Agarwal collaborates with scholars based in United States, India and Belgium. Rahul Agarwal's co-authors include Gautam Biswas, Abhiram Hens, Pega Hrnjak, Raja Swaminathan, John Wuu, Gerald L. Morrison, Patrick Cheng, Arnab Sarkar, Suman Chakraborty and A. A. Mohamad and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Advances in Colloid and Interface Science and Biosensors and Bioelectronics.

In The Last Decade

Rahul Agarwal

30 papers receiving 467 citations

Peers

Countries citing papers authored by Rahul Agarwal

Since Specialization

Citations

This map shows the geographic impact of Rahul Agarwal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rahul Agarwal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rahul Agarwal more than expected).

Fields of papers citing papers by Rahul Agarwal

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Rahul Agarwal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rahul Agarwal. The network helps show where Rahul Agarwal may publish in the future.

Co-authorship network of co-authors of Rahul Agarwal

This figure shows the co-authorship network connecting the top 25 collaborators of Rahul Agarwal. A scholar is included among the top collaborators of Rahul Agarwal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rahul Agarwal. Rahul Agarwal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Gallium-based liquid metals as smart responsive materials: Morphological forms and stimuli characterization 2024 ·Advances in Colloid and Interface Science ·Rahul Agarwal, A. A. Mohamad	12
2	Mechanical Behavior of 3D-Printed Schwarz Diamond-Structured Scaffolds for Tissue Engineering Applications 2024 ·Strength of Materials ·Rahul Agarwal, Sanjay V. Malhotra, Vishal Gupta, Vivek Jain	1
3	Analytics with blood on hybrid paper-rotating disc device 2022 ·Sensors and Actuators Reports ·Rahul Agarwal, Suman Chakraborty	4
4	3D V-Cache: the Implementation of a Hybrid-Bonded 64MB Stacked Cache for a 7nm x86-64 CPU 2022 ·2022 IEEE International Solid- State Circuits Conference (ISSCC) ·John Wuu, Rahul Agarwal, (unknown), (unknown), Brett C. Johnson, Dave Johnson, (unknown), Raja Swaminathan, (unknown), Samuel Naffziger	48
5	A Comparative Study on Performance Validation of Ring Oscillator for UWB & Low Power 2022 ·Rahul Agarwal, Manish Kumar	1
6	3D Packaging for Heterogeneous Integration 2022 ·2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·Rahul Agarwal, Patrick Cheng, (unknown), (unknown), Raja Swaminathan, John Wuu, (unknown)	61
7	A portable rotating disc as blood rheometer 2019 ·Biomicrofluidics ·Rahul Agarwal, Arnab Sarkar, (unknown), (unknown)	7
8	A portable spinning disc for complete blood count (CBC) 2019 ·Biosensors and Bioelectronics ·Rahul Agarwal, Arnab Sarkar, Arka Bhowmik, Devdeep Mukherjee, Suman Chakraborty	24
9	INVESTIGATION ON THERMOHYDRAULIC CHARACTERISTICS OF Al2O3 BASED NANOFLUIDS IN MICROCHANNELS 2019 ·JP Journal of Heat and Mass Transfer ·(unknown), Rahul Agarwal, Raja Sekhar Dondapati, (unknown)	0
10	Development of Modified Affinity Law for Centrifugal Pump to Predict the Effect of Viscosity 2018 ·Journal of Energy Resources Technology ·Gerald L. Morrison, (unknown), Rahul Agarwal, (unknown)	31
11	Computational Evaluation of Thermal and Hydraulic Characteristics of Flat-Plate Solar Collector for Different Glazing Material 2018 ·Materials Today Proceedings ·(unknown), (unknown), Rahul Agarwal, (unknown), Raja Sekhar Dondapati	6
12	CFD ANALYSIS OF EFFECT OF VISCOSITY AND RPM ON AN ELECTRICAL SUBMERSIBLE PUMP 2017 ·OakTrust (Texas A&M University Libraries) ·Rahul Agarwal	1
13	Evaluation of Effect of Viscosity on an Electrical Submersible Pump 2017 ·Gerald L. Morrison, (unknown), Rahul Agarwal, (unknown)	4
14	Condensation in two phase and desuperheating zone for R1234ze(E), R134a and R32 in horizontal smooth tubes 2014 ·International Journal of Refrigeration ·Rahul Agarwal, Pega Hrnjak	41
15	Nanoscale study of boiling and evaporation in a liquid Ar film on a Pt heater using molecular dynamics simulation 2014 ·International Journal of Heat and Mass Transfer ·Abhiram Hens, Rahul Agarwal, Gautam Biswas	151
16	Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding 2010 ·Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ·(unknown), Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Riet Labie, Alain Phommahaxay, Philippe Soussan	2
17	Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions 2010 ·Geert Van der Plas, S. Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, A. Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, (unknown), (unknown), M. Dehan, (unknown), Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal	12
18	Diamond bit cutting for processing high topography wafers 2009 ·Rahul Agarwal, Nga Pham, (unknown), A. H. Andrei, Wouter Ruythooren, (unknown), Philippe Soussan	13
19	INFLUENCE OF AGGREGATE SHAPE AND SIZE AND BINDER MODULUS ON FLEXIBLE CONCRETE 1973 ·Rahul Agarwal, (unknown)	1
20	Strain factors in flexible concrete 1972 ·Materials and Structures ·Rahul Agarwal, (unknown)	1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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