Jonghyun Cho

2.0k total citations · 1 hit paper
86 papers, 1.6k citations indexed

About

Jonghyun Cho is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Aerospace Engineering. According to data from OpenAlex, Jonghyun Cho has authored 86 papers receiving a total of 1.6k indexed citations (citations by other indexed papers that have themselves been cited), including 86 papers in Electrical and Electronic Engineering, 7 papers in Automotive Engineering and 6 papers in Aerospace Engineering. Recurrent topics in Jonghyun Cho's work include 3D IC and TSV technologies (71 papers), Electromagnetic Compatibility and Noise Suppression (50 papers) and Electronic Packaging and Soldering Technologies (26 papers). Jonghyun Cho is often cited by papers focused on 3D IC and TSV technologies (71 papers), Electromagnetic Compatibility and Noise Suppression (50 papers) and Electronic Packaging and Soldering Technologies (26 papers). Jonghyun Cho collaborates with scholars based in South Korea, United States and Italy. Jonghyun Cho's co-authors include Joungho Kim, Joohee Kim, Jun So Pak, Kunwoo Park, Hyungdong Lee, Taigon Song, Heegon Kim, Junho Lee, Junho Lee and Kiyeong Kim and has published in prestigious journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Instrumentation and Measurement and IEEE Transactions on Electromagnetic Compatibility.

In The Last Decade

Jonghyun Cho

84 papers receiving 1.6k citations

Hit Papers

High-Frequency Scalable Electrical Model and Analysis of ... 2011 2026 2016 2021 2011 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
    2011 373 citations Joohee Kim, Jun So Pak et al. IEEE Transactions on Components Packaging and Manufacturing Technology profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jonghyun Cho South Korea 18 1.6k 139 116 108 107 86 1.6k
Jun So Pak South Korea 18 1.5k 0.9× 103 0.7× 103 0.9× 93 0.9× 106 1.0× 77 1.5k
Taigon Song South Korea 16 1.3k 0.8× 123 0.9× 99 0.9× 82 0.8× 138 1.3× 58 1.3k
Guruprasad Katti Belgium 13 1.0k 0.6× 90 0.6× 140 1.2× 105 1.0× 95 0.9× 27 1.1k
Kaladhar Radhakrishnan United States 17 909 0.6× 92 0.7× 125 1.1× 36 0.3× 54 0.5× 61 1.0k
Douglas Yu Taiwan 19 1.1k 0.7× 93 0.7× 138 1.2× 17 0.2× 78 0.7× 58 1.2k
Fabrice Paillet United States 14 834 0.5× 43 0.3× 200 1.7× 131 1.2× 48 0.4× 21 1.0k
Michael J. Hill United States 14 664 0.4× 41 0.3× 90 0.8× 33 0.3× 31 0.3× 36 729
C.W. Surovic United States 13 1.1k 0.7× 24 0.2× 92 0.8× 63 0.6× 69 0.6× 38 1.1k
S.J. Souri United States 10 1.4k 0.9× 89 0.6× 153 1.3× 65 0.6× 278 2.6× 13 1.4k
Sri M. Sri-Jayantha United States 8 672 0.4× 85 0.6× 109 0.9× 71 0.7× 42 0.4× 14 776

Countries citing papers authored by Jonghyun Cho

Since Specialization
Citations

This map shows the geographic impact of Jonghyun Cho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jonghyun Cho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jonghyun Cho more than expected).

Fields of papers citing papers by Jonghyun Cho

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jonghyun Cho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jonghyun Cho. The network helps show where Jonghyun Cho may publish in the future.

Co-authorship network of co-authors of Jonghyun Cho

This figure shows the co-authorship network connecting the top 25 collaborators of Jonghyun Cho. A scholar is included among the top collaborators of Jonghyun Cho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jonghyun Cho. Jonghyun Cho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Heegon, et al.. (2019). Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer. IEEE Transactions on Electromagnetic Compatibility. 62(3). 880–893. 5 indexed citations
2.
Connor, Samuel, Dale Becker, Matteo Cocchini, et al.. (2019). Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design. IEEE Transactions on Electromagnetic Compatibility. 62(4). 1266–1277. 13 indexed citations
3.
Cho, Jonghyun, et al.. (2019). Accurate Rectifier Characterization and Improved Modeling of Constant Power Load Wireless Power Transfer Systems. IEEE Transactions on Power Electronics. 35(8). 7840–7852. 15 indexed citations
4.
Cao, Ying, Jonghyun Cho, Samuel Connor, et al.. (2017). Inductance Extraction for PCB Prelayout Power Integrity Using PMSR Method. IEEE Transactions on Electromagnetic Compatibility. 59(4). 1339–1346. 23 indexed citations
5.
Li, Er‐Ping, Ying Cao, Hanzhi Ma, et al.. (2017). The efficient equivalent model for decoupling capacitors of power distribution network. 57. 1–3. 1 indexed citations
6.
Kim, Youngwoo, Jonghyun Cho, Jinwook Song, et al.. (2016). Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer. 1856–1861. 2 indexed citations
7.
Kim, Youngwoo, Jonghyun Cho, Kiyeong Kim, et al.. (2015). Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer. 738–743. 21 indexed citations
8.
9.
Kim, Jihye, Youngwoo Kim, Jonghyun Cho, et al.. (2015). Noise coupling modeling and analysis of through glass via(TGV). TS8.34.1–TS8.34.5. 4 indexed citations
10.
Kim, Jihye, Youngwoo Kim, Jonghyun Cho, et al.. (2015). Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC. 254–259. 17 indexed citations
11.
Cho, Jonghyun, Man‐Ho Lee, D. Jung, et al.. (2014). Through silicon via (TSV) noise coupling effects on RF LC-VCO in 3D IC. 53–56. 3 indexed citations
12.
Kim, Youngwoo, Jonghyun Cho, Kiyeong Kim, et al.. (2014). Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 1–4. 4 indexed citations
13.
Kim, Joohee, Jonghyun Cho, Joungho Kim, et al.. (2014). High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(4). 697–707. 49 indexed citations
14.
Cho, Jonghyun & Joungho Kim. (2013). Signal integrity design of TSV and interposer in 3D-IC. 1–4. 2 indexed citations
15.
Kim, Heegon, Jonghyun Cho, D. Jung, et al.. (2013). Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. 5–9. 3 indexed citations
16.
Bae, Bumhee, Yujeong Shim, Jonghyun Cho, & Joungho Kim. (2011). Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package. 1–4. 2 indexed citations
17.
Pak, Jun So, Jonghyun Cho, Joohee Kim, et al.. (2011). GHz EMI Characteristics of 3D Stacked Chip PDN with Through Silicon Via (TSV) Connections. Journal of electromagnetic engineering and science. 11(4). 282–289. 1 indexed citations
18.
Cho, Jonghyun, Eakhwan Song, Ki-Hyun Yoon, et al.. (2011). Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(2). 220–233. 134 indexed citations
19.
Kim, Joohee, Jonghyun Cho, & Joungho Kim. (2010). TSV modeling and noise coupling in 3D IC. 1–6. 29 indexed citations
20.
Cho, Jonghyun, Eakhwan Song, Jun So Pak, et al.. (2009). Active circuit to through silicon via (TSV) noise coupling. 97–100. 36 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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