Robert Patti

834 total citations · 1 hit paper
21 papers, 625 citations indexed

About

Robert Patti is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Hardware and Architecture. According to data from OpenAlex, Robert Patti has authored 21 papers receiving a total of 625 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 2 papers in Hardware and Architecture. Recurrent topics in Robert Patti's work include 3D IC and TSV technologies (11 papers), Photonic and Optical Devices (7 papers) and Semiconductor Lasers and Optical Devices (6 papers). Robert Patti is often cited by papers focused on 3D IC and TSV technologies (11 papers), Photonic and Optical Devices (7 papers) and Semiconductor Lasers and Optical Devices (6 papers). Robert Patti collaborates with scholars based in United States, Singapore and China. Robert Patti's co-authors include Bharan Giridhar, Roshan Weerasekera, Ronald Dreslinski, Chaitali Chakrabarti, Trevor Mudge, David Blaauw, Batara Surya, En‐Xiao Liu, P. Maj and S. Holm and has published in prestigious journals such as Proceedings of the IEEE, IEEE Transactions on Electron Devices and Journal of Lightwave Technology.

In The Last Decade

Robert Patti

17 papers receiving 599 citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

2006 458 citations Robert Patti Proceedings of the IEEE profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Robert Patti United States	7	563	129	117	66	58	21	625
Sheng‐Chih Lin United States	12	473 0.8×	143 1.1×	201 1.7×	15 0.2×	22 0.4×	28	607
Didier Lattard France	12	302 0.5×	191 1.5×	151 1.3×	20 0.3×	38 0.7×	49	395
Koji Sakui Japan	12	959 1.7×	236 1.8×	86 0.7×	27 0.4×	562 9.7×	68	1.0k
Dimitri Linten Belgium	20	1.4k 2.4×	28 0.2×	108 0.9×	9 0.1×	84 1.4×	154	1.4k
Syed M. Alam United States	13	489 0.9×	80 0.6×	78 0.7×	41 0.6×	25 0.4×	30	537
Dinesh Pamunuwa United Kingdom	16	857 1.5×	263 2.0×	182 1.6×	42 0.6×	110 1.9×	68	945
Mohammad Mojarradi United States	13	506 0.9×	26 0.2×	35 0.3×	71 1.1×	123 2.1×	86	597
Sangwoo Pae South Korea	19	1.0k 1.8×	28 0.2×	111 0.9×	7 0.1×	37 0.6×	108	1.1k
Manu Perumkunnil Belgium	11	321 0.6×	76 0.6×	77 0.7×	6 0.1×	39 0.7×	42	407
G. Cellere Italy	23	1.2k 2.1×	159 1.2×	43 0.4×	5 0.1×	48 0.8×	79	1.2k

Countries citing papers authored by Robert Patti

Since Specialization

Citations

This map shows the geographic impact of Robert Patti's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Patti with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Patti more than expected).

Fields of papers citing papers by Robert Patti

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Robert Patti. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Patti. The network helps show where Robert Patti may publish in the future.

Co-authorship network of co-authors of Robert Patti

This figure shows the co-authorship network connecting the top 25 collaborators of Robert Patti. A scholar is included among the top collaborators of Robert Patti based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Robert Patti. Robert Patti is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Kumar, Ankur, Il-Min Yi, D.B. Scott, et al.. (2024). Energy-Efficient Optical Transceiver Circuits Enabled by 3D Heterogeneous Integration. 1–2. 1 indexed citations

2.

Zhang, Yu, Ankur Kumar, Il-Min Yi, et al.. (2023). A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET. 1–2. 1 indexed citations

3.

Kumar, Ankur, Il-Min Yi, Yu Zhang, et al.. (2023). A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit. M3I.4–M3I.4. 3 indexed citations

4.

Kumar, Ankur, Il-Min Yi, D.B. Scott, et al.. (2023). A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits. Journal of Lightwave Technology. 41(21). 6741–6755. 20 indexed citations

5.

Zhang, Yu, Ankur Kumar, Il-Min Yi, et al.. (2023). A 25-Gb/s 3-D Direct Bond Silicon Photonic Receiver in 12-nm FinFET. IEEE Solid-State Circuits Letters. 7. 34–37. 3 indexed citations

6.

Kumar, Ankur, Il-Min Yi, D.B. Scott, et al.. (2023). A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit. 1–3. 3 indexed citations

7.

Lipa, S., et al.. (2022). Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30(9). 1230–1243. 5 indexed citations

8.

Patti, Robert, et al.. (2019). Design, Fabrication, and Testing of a Liquid Cooling Platform for High Power 3D-ICs. 4 indexed citations

9.

Urteaga, Miguel, Jonathan Roderick, Petra Rowell, et al.. (2018). Si/InP Heterogeneous Integration Techniques from the Wafer-Scale (Hybrid Wafer Bonding) to the Discrete Transistor (Micro-Transfer Printing). 1–4. 7 indexed citations

10.

Hong, Jaesub, Brian Allen, J. E. Grindlay, et al.. (2017). Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays. 29–29. 4 indexed citations

11.

Deptuch, G., G. Carini, P.M. Enquist, et al.. (2015). Fully 3-D Integrated Pixel Detectors for X-Rays. IEEE Transactions on Electron Devices. 63(1). 205–214. 24 indexed citations

12.

Patti, Robert. (2014). 2.5D and 3D Integration Technology Update. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(DPC). 1–35.

13.

Giridhar, Bharan, Ronald Dreslinski, Robert Patti, et al.. (2013). Exploring DRAM organizations for energy-efficient and resilient exascale memories. 1–12. 47 indexed citations

14.

Patti, Robert. (2012). 3D integrated circuits: Designing in a new dimension: Designer track. International Conference on Computer Aided Design. 274–274.

15.

Weerasekera, Roshan, et al.. (2012). Through-Silicon Interposer (TSI) co-design optimization for high performance systems. Bristol Research (University of Bristol). 13. 93–98. 6 indexed citations

16.

Patti, Robert. (2012). New Advances in 3D/2.5D Integration. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(DPC). 2135–2167.

17.

Weerasekera, Roshan, et al.. (2012). Interconnect design and analysis for Through Silicon Interposers (TSIs). Bristol Research (University of Bristol). 1–6. 27 indexed citations

18.

Patti, Robert. (2011). Advances in 3D integrated circuits. 79–80.

19.

Patti, Robert. (2010). Advances in 3D Memory and Logic Devices. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 502–538. 1 indexed citations

20.

Patti, Robert. (2006). Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs. Proceedings of the IEEE. 94(6). 1214–1224. 458 indexed citations breakdown →

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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