S. Thijs
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- Electrostatic Discharge in Electronics 79
- Semiconductor materials and devices 55
- Advancements in Semiconductor Devices and Circuit Design 27
- Radio Frequency Integrated Circuit Design 26
- Integrated Circuits and Semiconductor Failure Analysis 25
- Electromagnetic Compatibility and Noise Suppression 24
- 3D IC and TSV technologies 7
- Advanced Semiconductor Detectors and Materials 6
- Co-authors
- D. LintenG. GroesenekenPiet WambacqMirko ScholzM. NatarajanA. MerchaS. DecoutereWutthinan Jeamsaksiri
- Journals
- IEEE Transactions on Device and Materials Reliability (4 papers)IEEE Transactions on Electron Devices (4 papers)Microelectronics Reliability (4 papers)
- Partner nations
- BelgiumUnited StatesFrance
In The Last Decade
S. Thijs
95 papers receiving 994 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 994
- Hardware and Architecture 25
- Biomedical Engineering 108
- Condensed Matter Physics 27
- Bioengineering 10
Countries citing papers authored by S. Thijs
This map shows the geographic impact of S. Thijs's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Thijs with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Thijs more than expected).
Fields of papers citing papers by S. Thijs
This network shows the impact of papers produced by S. Thijs. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Thijs. The network helps show where S. Thijs may publish in the future.
Co-authorship network
The 25 scholars most cited alongside S. Thijs, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2023 | 2 | |
| 3 | 2023 | 1 | |
| 4 | 2023 | 1 | |
| 5 | 2022 | 2 | |
| 6 | Exploring ESD challenges in sub-20-nm bulk FinFET CMOS technology nodes | 2013 | 8 |
| 7 | ESD protection devices placed inside keep-out zone (KOZ) of through Silicon Via (TSV) in 3D stacked integrated circuits | 2012 | 12 |
| 8 | Mixed-mode simulations for power-on ESD analysis | 2012 | 5 |
| 9 | ESD characterization of high mobility SiGe Quantum Well and Ge devices for future CMOS scaling | 2012 | 5 |
| 10 | On gated diodes for ESD protection in bulk FinFET CMOS technology | 2011 | 15 |
| 11 | A SCR-based ESD protection for MEMS — Merits and challenges | 2011 | 0 |
| 12 | CDM protection for millimeter-wave circuits | 2011 | 3 |
| 13 | 2010 | 6 | |
| 14 | HBM parameter extraction and Transient Safe Operating Area | 2010 | 2 |
| 15 | Behavior of RF MEMS switches under ESD stress | 2010 | 5 |
| 16 | SCCF — System to component level correlation factor | 2010 | 12 |
| 17 | ESD reliability issues in microelectromechanical systems (MEMS): A case study on micromirrors | 2008 | 6 |
| 18 | 2007 | 2 | |
| 19 | Implementation of Inductor Based ESD Protection for 5.5 GHz LNA in 90 nm RF CMOS - Concepts, Constraints and Solutions | 2004 | 2 |
| 20 | Co-design methodology to provide high ESD protection levels in the advanced RF circuits | 2003 | 8 |
About S. Thijs
S. Thijs is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Hardware and Architecture, Ceramics and Composites and Biophysics, having authored 100 papers that have together received 1.0k indexed citations. Recurring topics across this work include Electrostatic Discharge in Electronics (79 papers), Semiconductor materials and devices (55 papers), Advancements in Semiconductor Devices and Circuit Design (27 papers), Radio Frequency Integrated Circuit Design (26 papers), Integrated Circuits and Semiconductor Failure Analysis (25 papers), Electromagnetic Compatibility and Noise Suppression (24 papers), 3D IC and TSV technologies (7 papers) and Advanced Semiconductor Detectors and Materials (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (994 citations), Hardware and Architecture (25 citations), Biomedical Engineering (108 citations), Condensed Matter Physics (27 citations) and Bioengineering (10 citations). S. Thijs has collaborated with scholars based in Belgium, United States and France. Frequent co-authors include D. Linten, G. Groeseneken, Piet Wambacq, Mirko Scholz, M. Natarajan, A. Mercha, S. Decoutere, Wutthinan Jeamsaksiri, Dimitri Linten and S. Jenei. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Electron Devices, Microelectronics Reliability, IEEE Journal of Solid-State Circuits and Journal of the Society for Information Display.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.