Jun So Pak
Impact in
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- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
- Hardware and Architecture top 5%
Papers in
-
- 3D IC and TSV technologies 62
- Electromagnetic Compatibility and Noise Suppression 48
- Electronic Packaging and Soldering Technologies 24
- Semiconductor materials and devices 19
- Electrostatic Discharge in Electronics 8
- Electromagnetic Compatibility and Measurements 7
- Integrated Circuits and Semiconductor Failure Analysis 7
- Co-authors
- Joungho Kim (67 shared papers)Jonghyun Cho (31 shared papers)Kunwoo Park (29 shared papers)Joohee Kim (31 shared papers)Hyungdong Lee (24 shared papers)Taigon Song (7 shared papers)Junho Lee (14 shared papers)Eakhwan Song (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)IEEE Transactions on Advanced Packaging (4 papers)IEEE Transactions on Electromagnetic Compatibility (3 papers)IEEE Microwave and Wireless Components Letters (2 papers)Journal of electromagnetic engineering and science (1 paper)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Jun So Pak
76 papers receiving 1.6k citations
Jun So Pak's Hit Papers
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 1.6k
- Hardware and Architecture 88
- Automotive Engineering 118
- Computer Networks and Communications 113
- Aerospace Engineering 116
Countries citing papers authored by Jun So Pak
This map shows the geographic impact of Jun So Pak's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jun So Pak with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jun So Pak more than expected).
Fields of papers citing papers by Jun So Pak
This network shows the impact of papers produced by Jun So Pak. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jun So Pak. The network helps show where Jun So Pak may publish in the future.
Co-authors
The 25 scholars most cited alongside Jun So Pak, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 83 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Hit paper breakdown → | 2011 | 409 |
| 2 | 2011 | 142 | |
| 3 | 2011 | 108 | |
| 4 | 2007 | 87 | |
| 5 | 2010 | 79 | |
| 6 | 2006 | 58 | |
| 7 | 2014 | 56 | |
| 8 | 2012 | 47 | |
| 9 | 2010 | 41 | |
| 10 | 2009 | 40 | |
| 11 | 2011 | 31 | |
| 12 | 2013 | 26 | |
| 13 | 2010 | 24 | |
| 14 | 2007 | 23 | |
| 15 | 2010 | 23 | |
| 16 | 2014 | 23 | |
| 17 | 2010 | 19 | |
| 18 | 2008 | 17 | |
| 19 | 2013 | 17 | |
| 20 | 2003 | 16 |
About Jun So Pak
Jun So Pak is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Aerospace Engineering, Electronic, Optical and Magnetic Materials and Computer Networks and Communications, having authored 83 papers that have together received 1.6k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (62 papers), Electromagnetic Compatibility and Noise Suppression (48 papers), Electronic Packaging and Soldering Technologies (24 papers), Semiconductor materials and devices (19 papers), Electrostatic Discharge in Electronics (8 papers), Electromagnetic Compatibility and Measurements (7 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers) and Advanced Antenna and Metasurface Technologies (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.6k citations), Hardware and Architecture (88 citations), Automotive Engineering (118 citations), Computer Networks and Communications (113 citations) and Aerospace Engineering (116 citations). Jun So Pak has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Joungho Kim, Jonghyun Cho, Kunwoo Park, Joohee Kim, Hyungdong Lee, Taigon Song, Junho Lee, Eakhwan Song, Heegon Kim and Junho Lee. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, IEEE Transactions on Electromagnetic Compatibility, IEEE Microwave and Wireless Components Letters and Journal of electromagnetic engineering and science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.