Jun So Pak

2.0k total citations · 1 hit paper
77 papers, 1.5k citations indexed

About

Jun So Pak is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Computer Networks and Communications. According to data from OpenAlex, Jun So Pak has authored 77 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 76 papers in Electrical and Electronic Engineering, 6 papers in Aerospace Engineering and 4 papers in Computer Networks and Communications. Recurrent topics in Jun So Pak's work include 3D IC and TSV technologies (56 papers), Electromagnetic Compatibility and Noise Suppression (45 papers) and Electronic Packaging and Soldering Technologies (21 papers). Jun So Pak is often cited by papers focused on 3D IC and TSV technologies (56 papers), Electromagnetic Compatibility and Noise Suppression (45 papers) and Electronic Packaging and Soldering Technologies (21 papers). Jun So Pak collaborates with scholars based in South Korea, United States and Japan. Jun So Pak's co-authors include Joungho Kim, Jonghyun Cho, Kunwoo Park, Joohee Kim, Hyungdong Lee, Taigon Song, Junho Lee, Eakhwan Song, Heegon Kim and Kiyeong Kim and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Electromagnetic Compatibility.

In The Last Decade

Jun So Pak

72 papers receiving 1.5k citations

Hit Papers

High-Frequency Scalable Electrical Model and Analysis of ... 2011 2026 2016 2021 2011 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
    2011 373 citations Joohee Kim, Jun So Pak et al. IEEE Transactions on Components Packaging and Manufacturing Technology profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jun So Pak South Korea 18 1.5k 112 106 103 103 77 1.5k
Jonghyun Cho South Korea 18 1.6k 1.1× 81 0.7× 107 1.0× 139 1.3× 116 1.1× 86 1.6k
Taigon Song South Korea 16 1.3k 0.8× 39 0.3× 138 1.3× 123 1.2× 99 1.0× 58 1.3k
Fabrice Paillet United States 14 834 0.6× 35 0.3× 48 0.5× 43 0.4× 200 1.9× 21 1.0k
Guruprasad Katti Belgium 13 1.0k 0.7× 14 0.1× 95 0.9× 90 0.9× 140 1.4× 27 1.1k
Michael J. Hill United States 14 664 0.4× 94 0.8× 31 0.3× 41 0.4× 90 0.9× 36 729
S.J. Souri United States 10 1.4k 0.9× 18 0.2× 278 2.6× 89 0.9× 153 1.5× 13 1.4k
N. Sillon France 19 895 0.6× 12 0.1× 52 0.5× 179 1.7× 234 2.3× 71 968
C.W. Surovic United States 13 1.1k 0.7× 29 0.3× 69 0.7× 24 0.2× 92 0.9× 38 1.1k
Peter Baltus Netherlands 23 1.5k 1.0× 196 1.8× 118 1.1× 12 0.1× 317 3.1× 146 1.6k
P. J. Liao Taiwan 12 579 0.4× 197 1.8× 66 0.6× 20 0.2× 71 0.7× 42 680

Countries citing papers authored by Jun So Pak

Since Specialization
Citations

This map shows the geographic impact of Jun So Pak's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jun So Pak with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jun So Pak more than expected).

Fields of papers citing papers by Jun So Pak

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jun So Pak. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jun So Pak. The network helps show where Jun So Pak may publish in the future.

Co-authorship network of co-authors of Jun So Pak

This figure shows the co-authorship network connecting the top 25 collaborators of Jun So Pak. A scholar is included among the top collaborators of Jun So Pak based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jun So Pak. Jun So Pak is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Kim, Heegon, Jonghyun Cho, Joohee Kim, et al.. (2014). A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(1). 28–39. 10 indexed citations
4.
Kim, Joohee, Jonghyun Cho, Joungho Kim, et al.. (2014). High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(4). 697–707. 49 indexed citations
5.
Kim, Kiyeong, Chulsoon Hwang, Kyoungchoul Koo, et al.. (2012). Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(12). 2057–2070. 45 indexed citations
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Cho, Changhyun, Jonghyun Cho, Myunghoi Kim, Joungho Kim, & Jun So Pak. (2012). Design and implementation of on-chip embedded current probe using magnetic field coupling in chip to chip wireless power transfer system. 249–252. 3 indexed citations
7.
Song, Eunseok, et al.. (2012). TSV-based decoupling capacitor schemes in 3D-IC. 1340–1344. 1 indexed citations
8.
Pak, Jun So, Jonghyun Cho, Joohee Kim, et al.. (2011). GHz EMI Characteristics of 3D Stacked Chip PDN with Through Silicon Via (TSV) Connections. Journal of electromagnetic engineering and science. 11(4). 282–289. 1 indexed citations
9.
Cho, Jonghyun, Eakhwan Song, Ki-Hyun Yoon, et al.. (2011). Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(2). 220–233. 134 indexed citations
10.
Kim, Hyungsoo, et al.. (2010). 3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB. 181–284.
11.
Cho, Jonghyun, Eakhwan Song, Jun So Pak, et al.. (2009). Active circuit to through silicon via (TSV) noise coupling. 97–100. 36 indexed citations
12.
Lee, Junwoo, et al.. (2008). Design of a Low-Noise UWB Transceiver SiP. IEEE Design & Test of Computers. 25(1). 18–28. 7 indexed citations
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Pak, Jun So, Jaemin Kim, Junho Lee, et al.. (2008). Sharing power distribution networks for enhanced power integrity by using Through-Silicon-Via. 9–12. 17 indexed citations
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Ryu, Chunghyun, Jiwoong Park, Jun So Pak, et al.. (2007). Suppression of Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Silicon Through-Via in a 3-D Stacked Chip Package. IEEE Microwave and Wireless Components Letters. 17(12). 855–857. 10 indexed citations
18.
Pak, Jun So, Hyungsoo Kim, Junwoo Lee, & Joungho Kim. (2007). Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model. IEEE Transactions on Advanced Packaging. 30(1). 73–85. 21 indexed citations
19.
Park, Jong‐Bae, Hyungsoo Kim, Jun So Pak, & Joungho Kim. (2006). Characterization of SSN coupling to signal via in multi-layer PCBs and packages. e86 b. 328–331. 3 indexed citations
20.
Pak, Jun So & Joungho Kim. (2003). 3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect. 18. 1017–1022. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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