Dan Perry
Impact in
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- Network Packet Processing and Optimization
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
- Advancements in Photolithography Techniques
Papers in
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- 3D IC and TSV technologies 7
- Electronic Packaging and Soldering Technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 3
- Advancements in Photolithography Techniques 3
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- Engineering Structural Analysis Methods 3
- Mechanical Failure Analysis and Simulation 2
- Advanced Welding Techniques Analysis 1
- Co-authors
- Michele Stucchi (2 shared papers)Guruprasad Katti (2 shared papers)Wim Dehaene (2 shared papers)Dimitrios Velenis (1 shared paper)Raymond J. McKenzie (1 shared paper)Yang Yu (2 shared papers)Michał Rakowski (2 shared papers)Nikolaos Minas (3 shared papers)
- Journals
- IEEE Transactions on Semiconductor Manufacturing (2 papers)IEEE Solid-State Circuits Magazine (1 paper)The Journal of Strain Analysis for Engineering Design (1 paper)Lirias (KU Leuven) (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- BelgiumUnited KingdomUnited States
In The Last Decade
Dan Perry
12 papers receiving 89 citations
Peers
Comparison fields: 5 of 13
- Hardware and Architecture 14
- Electrical and Electronic Engineering 88
- Automotive Engineering 12
- Computer Networks and Communications 9
- Biomedical Engineering 15
Countries citing papers authored by Dan Perry
This map shows the geographic impact of Dan Perry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dan Perry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dan Perry more than expected).
Fields of papers citing papers by Dan Perry
This network shows the impact of papers produced by Dan Perry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dan Perry. The network helps show where Dan Perry may publish in the future.
Co-authors
The 25 scholars most cited alongside Dan Perry, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 21 | |
| 2 | 2012 | 20 | |
| 3 | 2010 | 15 | |
| 4 | 2004 | 10 | |
| 5 | 2012 | 7 | |
| 6 | 2010 | 6 | |
| 7 | 2011 | 4 | |
| 8 | 2009 | 4 | |
| 9 | 2007 | 4 | |
| 10 | 2014 | 2 | |
| 11 | 1977 | 1 | |
| 12 | 1975 | 1 | |
| 13 | 1975 | 0 |
About Dan Perry
Dan Perry is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Hardware and Architecture, Biomedical Engineering and Automotive Engineering, having authored 13 papers that have together received 95 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers), VLSI and Analog Circuit Testing (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Engineering Structural Analysis Methods (3 papers), Advancements in Photolithography Techniques (3 papers), Mechanical Failure Analysis and Simulation (2 papers) and Advanced Welding Techniques Analysis (1 paper). The work is most often cited by research in Hardware and Architecture (14 citations), Electrical and Electronic Engineering (88 citations), Automotive Engineering (12 citations), Computer Networks and Communications (9 citations) and Biomedical Engineering (15 citations). Dan Perry has collaborated with scholars based in Belgium, United Kingdom and United States. Frequent co-authors include Michele Stucchi, Guruprasad Katti, Wim Dehaene, Dimitrios Velenis, Raymond J. McKenzie, Yang Yu, Michał Rakowski, Nikolaos Minas, A. Mercha and Vladimir Cherman. Their work appears in journals such as IEEE Transactions on Semiconductor Manufacturing, IEEE Solid-State Circuits Magazine, The Journal of Strain Analysis for Engineering Design, Lirias (KU Leuven) and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.