Dan Perry

631 total citations
13 papers, 94 citations indexed

About

Dan Perry is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Hardware and Architecture. According to data from OpenAlex, Dan Perry has authored 13 papers receiving a total of 94 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Hardware and Architecture. Recurrent topics in Dan Perry's work include 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Advancements in Photolithography Techniques (3 papers). Dan Perry is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Advancements in Photolithography Techniques (3 papers). Dan Perry collaborates with scholars based in Belgium, United Kingdom and United States. Dan Perry's co-authors include Guruprasad Katti, Michele Stucchi, Wim Dehaene, Dimitrios Velenis, Raymond J. McKenzie, C. Torregiani, Michał Rakowski, Vladimir Cherman, A. Mercha and Nikolaos Minas and has published in prestigious journals such as IEEE Transactions on Semiconductor Manufacturing, The Journal of Strain Analysis for Engineering Design and IEEE Solid-State Circuits Magazine.

In The Last Decade

Dan Perry

12 papers receiving 88 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dan Perry Belgium 6 87 15 14 12 9 13 94
A. Andreini Italy 9 270 3.1× 21 1.4× 10 0.7× 4 0.3× 3 0.3× 38 276
G. Hatcher United States 5 278 3.2× 37 2.5× 6 0.4× 10 0.8× 4 0.4× 5 282
Jiefeng Lin China 5 126 1.4× 8 0.5× 20 1.4× 3 0.3× 5 0.6× 6 128
P. Galbiati Italy 11 360 4.1× 49 3.3× 10 0.7× 6 0.5× 9 1.0× 20 367
Surej Ravikumar United States 6 159 1.8× 46 3.1× 5 0.4× 8 0.7× 6 0.7× 14 180
M. Weybright United States 4 144 1.7× 8 0.5× 28 2.0× 2 0.2× 4 0.4× 10 147
Damien Croain France 5 109 1.3× 24 1.6× 20 1.4× 2 0.2× 3 0.3× 9 112
Hun-Hsien Chang Taiwan 6 241 2.8× 12 0.8× 7 0.5× 7 0.6× 1 0.1× 14 241
Martin Ostermayr Germany 8 194 2.2× 25 1.7× 41 2.9× 3 0.3× 4 0.4× 14 196
Dawei Bi China 10 398 4.6× 12 0.8× 22 1.6× 4 0.3× 3 0.3× 76 417

Countries citing papers authored by Dan Perry

Since Specialization
Citations

This map shows the geographic impact of Dan Perry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dan Perry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dan Perry more than expected).

Fields of papers citing papers by Dan Perry

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dan Perry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dan Perry. The network helps show where Dan Perry may publish in the future.

Co-authorship network of co-authors of Dan Perry

This figure shows the co-authorship network connecting the top 25 collaborators of Dan Perry. A scholar is included among the top collaborators of Dan Perry based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dan Perry. Dan Perry is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
2.
Stucchi, Michele, Dan Perry, Guruprasad Katti, Wim Dehaene, & Dimitrios Velenis. (2012). Test Structures for Characterization of Through-Silicon Vias. IEEE Transactions on Semiconductor Manufacturing. 25(3). 355–364. 20 indexed citations
3.
Minas, Nikolaos, Geert Van der Plas, Herman Oprins, et al.. (2012). Design of Test Structures for the Characterization of Thermal–Mechanical Stress in 3D-Stacked IC. IEEE Transactions on Semiconductor Manufacturing. 25(3). 365–371. 6 indexed citations
4.
5.
Limaye, Paresh, A. Mercha, Herman Oprins, et al.. (2010). Design issues and cosiderations for low-cost 3D TSV IC technology. Lirias (KU Leuven). 148–149. 6 indexed citations
6.
Stucchi, Michele, Dan Perry, Guruprasad Katti, & Wim Dehaene. (2010). Test structures for characterization of through silicon vias. 130–134. 21 indexed citations
7.
Minas, Nikolaos, Geert Van der Plas, Herman Oprins, et al.. (2010). Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design. 140–144. 15 indexed citations
8.
Radojcic, Riko, et al.. (2009). Design for manufacturability for fabless manufactuers. IEEE Solid-State Circuits Magazine. 1(3). 24–33. 4 indexed citations
9.
Perry, Dan, et al.. (2007). Model-based approach for design verification and co-optimization of catastrophic and parametric-related defects due to systematic manufacturing variations. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6521. 65210E–65210E. 4 indexed citations
10.
McKenzie, Raymond J., et al.. (2004). Advanced ternary CAM circuits on 0.13 μm logic process technology. 465–468. 10 indexed citations
11.
Fessler, H & Dan Perry. (1977). Leakage characteristics of flanged pipe joints. The Journal of Strain Analysis for Engineering Design. 12(1). 29–36. 1 indexed citations
12.
Fessler, H & Dan Perry. (1975). Behaviour of brazed pipe flanges with separate clamping rings. Journal of Strain Analysis. 10(2). 71–76. 1 indexed citations
13.
Fessler, H & Dan Perry. (1975). Stresses in high-pressure taper-hub flanges with recesses for nut facings. Journal of Strain Analysis. 10(2). 119–128.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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