Huma Ashraf

712 total citations
27 papers, 541 citations indexed

About

Huma Ashraf is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Huma Ashraf has authored 27 papers receiving a total of 541 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Huma Ashraf's work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (5 papers) and Semiconductor materials and devices (5 papers). Huma Ashraf is often cited by papers focused on 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (5 papers) and Semiconductor materials and devices (5 papers). Huma Ashraf collaborates with scholars based in United Kingdom, Belgium and United States. Huma Ashraf's co-authors include Jy Bhardwaj, Owen James Guy, James C. Birchall, Benedetta Gualeni, Olivia Howells, Sanjiv Sharma, Anne Jourdain, Dave Thomas, Eric Beyne and Joeri De Vos and has published in prestigious journals such as Lab on a Chip, European Journal of Pharmaceutics and Biopharmaceutics and Journal of Microelectromechanical Systems.

In The Last Decade

Huma Ashraf

23 papers receiving 495 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Huma Ashraf United Kingdom 11 305 185 168 82 56 27 541
K. B. Vinayakumar Portugal 12 165 0.5× 238 1.3× 170 1.0× 90 1.1× 34 0.6× 39 555
Seung‐Joon Paik South Korea 10 150 0.5× 187 1.0× 211 1.3× 88 1.1× 44 0.8× 27 456
Björn Samel Sweden 10 143 0.5× 184 1.0× 99 0.6× 51 0.6× 27 0.5× 19 355
Sommawan Khumpuang Japan 11 209 0.7× 191 1.0× 74 0.4× 27 0.3× 33 0.6× 50 371
Qingzhi Wu China 10 169 0.6× 79 0.4× 132 0.8× 50 0.6× 29 0.5× 22 356
M. Možek Slovenia 11 246 0.8× 258 1.4× 60 0.4× 28 0.3× 57 1.0× 44 444
John D. Brazzle United States 11 189 0.6× 353 1.9× 143 0.9× 39 0.5× 65 1.2× 24 650
Jungkwun Kim United States 15 485 1.6× 269 1.5× 56 0.3× 32 0.4× 137 2.4× 83 748
J. O'Brien Ireland 8 191 0.6× 192 1.0× 59 0.4× 23 0.3× 48 0.9× 15 383
Neil Mitchell United Kingdom 8 167 0.5× 64 0.3× 108 0.6× 51 0.6× 28 0.5× 23 419

Countries citing papers authored by Huma Ashraf

Since Specialization
Citations

This map shows the geographic impact of Huma Ashraf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huma Ashraf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huma Ashraf more than expected).

Fields of papers citing papers by Huma Ashraf

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Huma Ashraf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huma Ashraf. The network helps show where Huma Ashraf may publish in the future.

Co-authorship network of co-authors of Huma Ashraf

This figure shows the co-authorship network connecting the top 25 collaborators of Huma Ashraf. A scholar is included among the top collaborators of Huma Ashraf based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Huma Ashraf. Huma Ashraf is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Jiang, Xinyu, et al.. (2024). Advances in High-Aspect-Ratio Deep Reactive Ion Etching of 4H-Silicon Carbide Wafers. Journal of Microelectromechanical Systems. 33(6). 776–784. 2 indexed citations
2.
Mitchell, Jacob J., et al.. (2024). Demonstrating SiC <i>In Situ</i> Rounded Trench Processing Technologies for Future Power Trench MOSFET Applications. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 359. 163–170.
3.
Cao, Zhongming, et al.. (2024). Assessing Plasma-Etched InP Laser Facet Quality. IEEE Photonics Technology Letters. 36(11). 745–748.
4.
Ashraf, Huma, et al.. (2023). Molecular Screening of Bioactive Compounds of Garlic for Therapeutic Effects against COVID-19. Biomedicines. 11(2). 643–643. 4 indexed citations
6.
Howells, Olivia, Benedetta Gualeni, James C. Birchall, et al.. (2021). Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process. European Journal of Pharmaceutics and Biopharmaceutics. 171. 19–28. 68 indexed citations
7.
Suhard, Samuel, Koen Kennes, Pieter Bex, et al.. (2021). Demonstration of a collective hybrid die-to-wafer integration using glass carrier. 2064–2070. 14 indexed citations
8.
Howells, Olivia, et al.. (2020). Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery. Lab on a Chip. 20(15). 2788–2795. 99 indexed citations
9.
Jourdain, Anne, Filip Schleicher, Joeri De Vos, et al.. (2020). Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration. 42–48. 40 indexed citations
10.
Rassoul, Nouredine, Anne Jourdain, Joeri De Vos, et al.. (2018). RIE dynamics for extreme wafer thinning applications. Microelectronic Engineering. 192. 30–37. 12 indexed citations
11.
Jourdain, Anne, Joeri De Vos, Nouredine Rassoul, et al.. (2018). Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications. 8 indexed citations
12.
Thomas, Dave, et al.. (2016). (Invited) Deep Silicon Etching - Increasingly Relevant >20 Years on!. ECS Transactions. 72(19). 9–22. 2 indexed citations
13.
Jourdain, Anne, Joeri De Vos, Fumihiro Inoue, et al.. (2016). Extreme wafer thinning optimization for via-last applications. 1–5. 15 indexed citations
15.
Liu, Yufei, et al.. (2013). Advanced deep reactive‐ion etching technology for hollow microneedles for transdermal blood sampling and drug delivery. IET Nanobiotechnology. 7(2). 59–62. 18 indexed citations
16.
Ashraf, Huma, et al.. (2013). Advances in Back-side Via Etching of SiC for GaN Device Applications. 6 indexed citations
18.
Pickering, Christopher, et al.. (2003). Performance enhancement and evaluation of deep dry etching on a production cluster platform. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4979. 34–34. 3 indexed citations
19.
Ashraf, Huma, Jy Bhardwaj, A. Hynes, et al.. (2000). <title>Etching 200-mm diameter SCALPEL masks with the ASE process</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7 indexed citations
20.
Bhardwaj, Jy & Huma Ashraf. (1995). <title>Advanced silicon etching using high-density plasmas</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2639. 224–233. 172 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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