Huma Ashraf

712 citations

27 papers · 541 indexed · h-index 11

Impact in

Pharmaceutical Science top 2%
- Advancements in Transdermal Drug Delivery
Dermatology top 5%
- Dermatology and Skin Diseases

Papers in ⓘ

Pharmaceutical Science 3
Electrical and Electronic Engineering 20
- 3D IC and TSV technologies 9
- Semiconductor materials and devices 5
- Electronic Packaging and Soldering Technologies 5
- Thin-Film Transistor Technologies 4
- Advancements in Photolithography Techniques 4

Co-authors: Jy Bhardwaj (2 shared papers)Owen James Guy (6 shared papers)James C. Birchall (2 shared papers)Benedetta Gualeni (2 shared papers)Olivia Howells (2 shared papers)Sanjiv Sharma (1 shared paper)Eric Beyne (7 shared papers)Dave Thomas (7 shared papers)
Journals: Microelectronic Engineering (2 papers)IET Nanobiotechnology (1 paper)Journal of Microelectromechanical Systems (1 paper)European Journal of Pharmaceutics and Biopharmaceutics (1 paper)Lab on a Chip (1 paper)
Partner nations: United Kingdom Belgium United States

In The Last Decade

Huma Ashraf

23 papers receiving 495 citations

Peers

Countries citing papers authored by Huma Ashraf

Since Specialization

Citations

This map shows the geographic impact of Huma Ashraf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huma Ashraf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huma Ashraf more than expected).

Fields of papers citing papers by Huma Ashraf

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Huma Ashraf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huma Ashraf. The network helps show where Huma Ashraf may publish in the future.

Co-authors

The 25 scholars most cited alongside Huma Ashraf, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Huma Ashraf Line = papers co-authored together Huma Ashraf links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	<title>Advanced silicon etching using high-density plasmas</title> Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Jy Bhardwaj, Huma Ashraf	1995	172
2	Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery Lab on a Chip ·Chris Bolton, Olivia Howells, G.J. Blayney, Pey F. Eng, James C. Birchall, Benedetta Gualeni, Kerry Roberts, Huma Ashraf, Owen James Guy	2020	99
3	Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process European Journal of Pharmaceutics and Biopharmaceutics ·Olivia Howells, G.J. Blayney, Benedetta Gualeni, James C. Birchall, Pey F. Eng, Huma Ashraf, Sanjiv Sharma, Owen James Guy	2021	68
4	Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration Anne Jourdain, Filip Schleicher, Joeri De Vos, Michele Stucchi, Emmanuel Chery, Andy Miller, Gerald Beyer, Geert Van der Plas, Edward Walsby, Kerry Roberts, Huma Ashraf, Dave Thomas, Eric Beyne	2020	40
5	Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications Journal of Physics Conference Series ·Ha-Duong Ngo, André Hiess, V. Seidemann, Daniel Studzinski, Martín Lange, J. Leib, Dzafir Shariff, Huma Ashraf, Mike Steel, Lilian Atabo, Jon Reast	2006	20
6	Advanced deep reactive‐ion etching technology for hollow microneedles for transdermal blood sampling and drug delivery IET Nanobiotechnology ·Yufei Liu, P. F. Eng, Owen James Guy, Kerry Roberts, Huma Ashraf, Nick Knight	2013	18
7	Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking Fumihiro Inoue, Anne Jourdain, Joeri De Vos, Erik Sleeckx, Eric Beyne, Jash Patel, Oliver Ansell, Huma Ashraf, Janet Hopkins, Dave Thomas, Akira Uedono	2016	18
8	Extreme wafer thinning optimization for via-last applications Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth June Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas	2016	15
9	Demonstration of a collective hybrid die-to-wafer integration using glass carrier Samuel Suhard, Koen Kennes, Pieter Bex, Anne Jourdain, Lieve Teugels, Edward Walsby, Chris Bolton, Jash Patel, Huma Ashraf, Richard Barnett, Ferenc Fodor, Alain Phommahaxay, D. La Tulipe, Gerald Beyer, Eric Beyne	2021	14
10	Refractive index graded anti-reflection coating for solar cells based on low cost reclaimed silicon Microelectronic Engineering ·Yufei Liu, Owen James Guy, Jash Patel, Huma Ashraf, Nick Knight	2013	13
11	RIE dynamics for extreme wafer thinning applications Microelectronic Engineering ·Nouredine Rassoul, Anne Jourdain, Nina Tutunjyan, Joeri De Vos, Stefano Sardo, Fumihiro Inoue, Daniele Piumi, Gerald Beyer, Andy Miller, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansel, Huma Ashraf, Janet Hopkins, Dave Thomas	2018	12
12	Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications Anne Jourdain, Joeri De Vos, Nouredine Rassoul, Houman Zahedmanesh, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Huma Ashraf, Dave Thomas, Shifang Li, Timothy Chang, S. Hiebert, M. Stoerring, Andrew Cross	2018	8
13	<title>Etching 200-mm diameter SCALPEL masks with the ASE process</title> Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Ian Ronald Johnston, Huma Ashraf, Jy Bhardwaj, Janet Hopkins, A. Hynes, Glenn Nicholls, Serrita A. McAuley, S. Hall, Lilian Atabo, Gregory R. Bogart, A. Kornblit, Anthony E. Novembre	2000	7
14	Advances in Back-side Via Etching of SiC for GaN Device Applications Anthony Barker, Kevin G. Riddell, Huma Ashraf, Dave Thomas, Chia‐Hao Chen, Yi-Feng Wei, I-Te Cho, W. Wohlmuth	2013	6
15	Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications IMAPSource Proceedings ·Piotr Mackowiak, Rachid Abdallah, Martin Wilke, Jash Patel, Huma Ashraf, Keith Buchanan, Klaus‐Dieter Lang, Martin Schneider‐Ramelow, Ha-Duong Ngo	2018	6
16	Easy to fill sloped vias for interconnects applications improved control of silicon tapered etch profile Stephane Heraud, Carolyn Short, Huma Ashraf	2009	5
17	Molecular Screening of Bioactive Compounds of Garlic for Therapeutic Effects against COVID-19 Biomedicines ·Huma Ashraf, Erum Dilshad, Tayyaba Afsar, Ali Almajwal, Huma Shafique, Suhail Razak	2023	4
18	WAFER-LEVEL HIGH-ASPECT-RATIO DEEP REACTIVE ION ETCHING OF 4H-SILICON CARBIDE ON INSULATOR SUBSTRATES Ardalan Lotfi, Micheal Hardin, Zhenming Liu, A. C. Wood, Chris Bolton, Kevin G. Riddell, Huma Ashraf, Joanne S. Carpenter, Farrokh Ayazi	2022	4
19	Performance enhancement and evaluation of deep dry etching on a production cluster platform Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Mark E. McNie, Christopher Pickering, Alexandra L. Rickard, Iain M. Young, Janet Hopkins, Huma Ashraf, Serrita A. McAuley, Glenn Nicholls, Richard Barnett, F. Roozeboom, A.L.A.M. Kemmeren, Eric van den Heuvel, Jan T. Verhoeven, Colin Gormley, P. Schina, Corrado Di Luciano, Jyrki Kiihamäki	2003	3
20	Advances in High-Aspect-Ratio Deep Reactive Ion Etching of 4H-Silicon Carbide Wafers Journal of Microelectromechanical Systems ·N. Li, Zhenming Liu, Ardalan Lotfi, Xinyu Jiang, Emma Long, Shubham Sahasrabudhe, Chris Bolton, Huma Ashraf, Farrokh Ayazi	2024	2

About Huma Ashraf

Huma Ashraf is a scholar working on Pharmaceutical Science, Electrical and Electronic Engineering, Dermatology, Pharmacology and Electronic, Optical and Magnetic Materials, having authored 27 papers that have together received 541 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Semiconductor materials and devices (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Copper Interconnects and Reliability (4 papers), Thin-Film Transistor Technologies (4 papers), Advanced Surface Polishing Techniques (4 papers), Advancements in Photolithography Techniques (4 papers) and Dermatology and Skin Diseases (3 papers). The work is most often cited by research in Pharmaceutical Science (168 citations), Dermatology (82 citations), Electrical and Electronic Engineering (305 citations), Biomedical Engineering (185 citations) and Surfaces, Coatings and Films (22 citations). Huma Ashraf has collaborated with scholars based in United Kingdom, Belgium and United States. Frequent co-authors include Jy Bhardwaj, Owen James Guy, James C. Birchall, Benedetta Gualeni, Olivia Howells, Sanjiv Sharma, Eric Beyne, Dave Thomas, Anne Jourdain and Joeri De Vos. Their work appears in journals such as Microelectronic Engineering, IET Nanobiotechnology, Journal of Microelectromechanical Systems, European Journal of Pharmaceutics and Biopharmaceutics and Lab on a Chip.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact