H. Reichl

8.5k total citations
472 papers, 6.4k citations indexed

About

H. Reichl is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, H. Reichl has authored 472 papers receiving a total of 6.4k indexed citations (citations by other indexed papers that have themselves been cited), including 406 papers in Electrical and Electronic Engineering, 88 papers in Mechanical Engineering and 48 papers in Mechanics of Materials. Recurrent topics in H. Reichl's work include 3D IC and TSV technologies (235 papers), Electronic Packaging and Soldering Technologies (227 papers) and Electromagnetic Compatibility and Noise Suppression (70 papers). H. Reichl is often cited by papers focused on 3D IC and TSV technologies (235 papers), Electronic Packaging and Soldering Technologies (227 papers) and Electromagnetic Compatibility and Noise Suppression (70 papers). H. Reichl collaborates with scholars based in Germany, United States and South Korea. H. Reichl's co-authors include R. Aschenbrenner, Andreas Ostmann, Stephan Guttowski, B. Michel, Ivan Ndip, Bernhard Wunderle, W. John, Michael J. Topper, Andreas Schubert and E. Zakel and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

H. Reichl

444 papers receiving 6.0k citations

Peers

Countries citing papers authored by H. Reichl

Since Specialization

Citations

This map shows the geographic impact of H. Reichl's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Reichl with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Reichl more than expected).

Fields of papers citing papers by H. Reichl

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Reichl. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Reichl. The network helps show where H. Reichl may publish in the future.

Co-authorship network of co-authors of H. Reichl

This figure shows the co-authorship network connecting the top 25 collaborators of H. Reichl. A scholar is included among the top collaborators of H. Reichl based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Reichl. H. Reichl is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work	Indexed citations
1	Modeling and minimizing the inductance of bond wire interconnects 2013 ·Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Ivan Ndip, (unknown), Stephan Guttowski, H. Reichl, Klaus‐Dieter Lang, Heino Henke	15
2	SENESCOPE: A design tool for cost optimization of wireless sensor nodes 2009 ·Information Processing in Sensor Networks ·(unknown), (unknown), (unknown), Stephan Guttowski, H. Reichl	0
3	Modeling and quantification of conventional and coax-TSVs for RF applications 2009 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Ivan Ndip, Brian Curran, Stephan Guttowski, H. Reichl	25
4	On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines 2009 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Ivan Ndip, (unknown), Stephan Guttowski, H. Reichl	2
5	Modeling and comparison of patch antenna configurations for 77 GHz radar applications 2009 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Ivan Ndip, (unknown), Stephan Guttowski, H. Reichl	2
6	Advancements in bumping technologies for flip chip and WLCSP packaging 2009 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Dionysios Manessis, (unknown), Andreas Ostmann, H. Reichl	1
7	Cost-Driven Design of Smart Micro Systems 2008 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), (unknown), Stephan Guttowski, H. Reichl	2
8	Technologies for 3D wafer level heterogeneous integration 2008 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·M. J. Wolf, Peter Ramm, Armin Klumpp, H. Reichl	33
9	Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV. 2006 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), (unknown), Eckart Hoene, Stephan Guttowski, W. John, H. Reichl	3
10	Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder 2006 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Matthias Hütter, Hermann Oppermann, (unknown), (unknown), H. Reichl	18
11	Vorhersage von magnetischen Kopplungen in Filterschaltungen. 2006 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), Eckart Hoene, Stephan Guttowski, W. John, H. Reichl	2
12	Closed-form network representations of frequency-dependent RLGC parameters: Research Articles 2005 ·International Journal of Circuit Theory and Applications ·A. Ege Engin, Wolfgang Mathis, W. John, (unknown), H. Reichl	0
13	Modular systems for sensor integration 2002 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Matthias Klein, Hermann Oppermann, R. Aschenbrenner, H. Reichl	2
14	Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping 2002 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Dionysios Manessis, (unknown), (unknown), Andreas Ostmann, R. Aschenbrenner, H. Reichl	3
15	Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages 2000 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Michael J. Topper, (unknown), (unknown), Christof Landesberger, O. Ehrmann, H. Reichl	6
16	High density pixel detector module using flip chip and thin film technology 2000 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·J.K. Wolf, (unknown), (unknown), Michael J. Topper, (unknown), (unknown), N. Wermes, O. Ehrmann, H. Reichl	0
17	Characteristics of fritting contacts utilized for micromachined wafer probe cards 2000 ·Review of Scientific Instruments ·Toshihiro Itoh, Tadatomo Suga, (unknown), (unknown), O. Ehrmann, H. Reichl	15
18	Advanced Flip Chip Technologies 1999 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Hermann Oppermann, R. Aschenbrenner, H. Reichl	2
19	Reliability of Electroless Nickel for High Temperature Applications 1999 ·(unknown), (unknown), Hermann Oppermann, R. Aschenbrenner, H. Reichl	10
20	Chip size package - the option of choice for miniaturized medical devices 1998 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Michael J. Topper, (unknown), (unknown), (unknown), (unknown), (unknown), V. Bader, (unknown), (unknown), (unknown), O. Ehrmann, H. Reichl	5

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact