Koen De Munck

601 total citations
39 papers, 448 citations indexed

About

Koen De Munck is a scholar working on Electrical and Electronic Engineering, Instrumentation and Biomedical Engineering. According to data from OpenAlex, Koen De Munck has authored 39 papers receiving a total of 448 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 9 papers in Instrumentation and 8 papers in Biomedical Engineering. Recurrent topics in Koen De Munck's work include CCD and CMOS Imaging Sensors (20 papers), Advanced Optical Sensing Technologies (9 papers) and 3D IC and TSV technologies (9 papers). Koen De Munck is often cited by papers focused on CCD and CMOS Imaging Sensors (20 papers), Advanced Optical Sensing Technologies (9 papers) and 3D IC and TSV technologies (9 papers). Koen De Munck collaborates with scholars based in Belgium, Netherlands and Italy. Koen De Munck's co-authors include Piet De Moor, Deniz Sabuncuoglu Tezcan, Bart Swinnen, Chris Van Hoof, Wouter Ruythooren, Lieve Bogaerts, Jan Vaes, Eric Beyne, Zs. Tôkei and Serguei Stoukatch and has published in prestigious journals such as Sensors, IEEE Transactions on Electron Devices and Japanese Journal of Applied Physics.

In The Last Decade

Koen De Munck

35 papers receiving 427 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Koen De Munck Belgium	11	384	105	48	46	45	39	448
Vyshnavi Suntharalingam United States	10	500 1.3×	68 0.6×	53 1.1×	54 1.2×	40 0.9×	44	566
Y. Sugimoto Japan	12	347 0.9×	129 1.2×	34 0.7×	88 1.9×	8 0.2×	88	463
C.L. Britton United States	12	240 0.6×	116 1.1×	3 0.1×	82 1.8×	18 0.4×	43	402
T. Wakano Japan	8	304 0.8×	47 0.4×	8 0.2×	4 0.1×	145 3.2×	9	522
S.C. Witczak United States	21	1.6k 4.2×	19 0.2×	29 0.6×	15 0.3×	3 0.1×	36	1.6k
Ziqiang Cai United States	11	160 0.4×	96 0.9×	29 0.6×	21 0.5×	2 0.0×	22	323
Hang Yuan China	12	312 0.8×	55 0.5×	2 0.0×	17 0.4×	24 0.5×	51	491
Olivier Marcelot France	12	342 0.9×	37 0.4×	1 0.0×	50 1.1×	100 2.2×	46	399
Ulrike Fuchs Germany	8	222 0.6×	133 1.3×	3 0.1×	41 0.9×	8 0.2×	44	475

Countries citing papers authored by Koen De Munck

Since Specialization

Citations

This map shows the geographic impact of Koen De Munck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Koen De Munck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Koen De Munck more than expected).

Fields of papers citing papers by Koen De Munck

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Koen De Munck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Koen De Munck. The network helps show where Koen De Munck may publish in the future.

Co-authorship network of co-authors of Koen De Munck

This figure shows the co-authorship network connecting the top 25 collaborators of Koen De Munck. A scholar is included among the top collaborators of Koen De Munck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Koen De Munck. Koen De Munck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Bello, David San Segundo, et al.. (2024). An Integration Time Prediction Based Algorithm for Wide Dynamic Range 3D-Stacked Image Sensors. Lirias (KU Leuven). 209–212.

Munck, Koen De, et al.. (2024). Backside-Illuminated 4-T Pinned Avalanche Photodiode Pixel for Readout Noise-Limited Applications. IISS online library.

Munck, Koen De, et al.. (2024). Backside Illuminated Hybrid FPA achieving Low Cross-Talk combined with High QE. IISS online library.

Munck, Koen De, et al.. (2022). A Backside-Illuminated Charge-Focusing Silicon SPAD With Enhanced Near-Infrared Sensitivity. IEEE Transactions on Electron Devices. 69(3). 1129–1136. 15 indexed citations

Teixeira, Ricardo Cotrin, Koen De Munck, Piet De Moor, et al.. (2020). Stress Analysis on Ultra Thin Ground Wafers. Journal of Integrated Circuits and Systems. 3(2). 83–89. 2 indexed citations

Suzuki, S., et al.. (2018). An Adaptive Frame Image Sensor with Fine-Grained Power Management for Ultra-Low Power Internet of Things Application. 33 12. 58–61. 1 indexed citations

Moor, Piet De, L. Haspeslagh, P. Boulenc, et al.. (2014). Enhanced time delay integration imaging using embedded CCD in CMOS technology. 4.6.1–4.6.4. 16 indexed citations

Munck, Koen De, et al.. (2012). First Demonstration of Hybrid CMOS Imagers With Simultaneous Very Low Crosstalk and High-Broadband Quantum Efficiency. IEEE Transactions on Electron Devices. 59(10). 2723–2726. 2 indexed citations

Rahman, M., et al.. (2011). Backside illuminated CMOS image sensors optimized by modeling and simulation. Optical and Quantum Electronics. 42(11-13). 691–698. 3 indexed citations

10.

Vos, Joeri De, Koen De Munck, Wen Qi Zhang, et al.. (2011). Hybrid Backside Illuminated CMOS Imager for High-End Applications. ECS Transactions. 35(30). 53–63. 1 indexed citations

11.

Vos, Joeri De, et al.. (2011). On the processing aspects of high performance hybrid backside illuminated CMOS imagers. Journal of Micromechanics and Microengineering. 21(7). 74006–74006. 2 indexed citations

12.

Vos, Joeri De, Anne Jourdain, W. Zhang, et al.. (2011). High density 20μm pitch CuSn microbump process for high-end 3D applications. 17 indexed citations

13.

Vos, Joeri De, Anne Jourdain, Wen Qi Zhang, et al.. (2011). The Road towards Fully Hybrid CMOS Imager Sensors.. IMAPSource Proceedings. 2011(1). 173–180. 2 indexed citations

14.

Vos, Joeri De, Koen De Munck, Wen Qi Zhang, et al.. (2010). Processing aspects to achieve high-end hybrid backside illuminated imagers. IMAPSource Proceedings. 2010(1). 372–377. 1 indexed citations

15.

Munck, Koen De, et al.. (2008). Backside illuminated thinned CMOS image sensors for space imaging. 1429–1432. 9 indexed citations

16.

Munck, Koen De, T. Chiarella, Piet De Moor, Bart Swinnen, & Chris Van Hoof. (2008). Influence of Extreme Thinning on 130-nm Standard CMOS Devices for 3-D Integration. IEEE Electron Device Letters. 29(4). 322–324. 11 indexed citations

17.

Munck, Koen De, Deniz Sabuncuoglu Tezcan, Wouter Ruythooren, et al.. (2008). Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation. 129–131. 9 indexed citations

18.

Teixeira, Ricardo Cotrin, Koen De Munck, Kris Baert, et al.. (2007). Thickness Characterization of Ultra Thin Wafers on Carrier. 50. 238–241. 6 indexed citations

19.

Swinnen, Bart, Wouter Ruythooren, Piet De Moor, et al.. (2006). 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &#x003BC;m pitch through-Si vias. 1–4. 161 indexed citations

20.

Munck, Koen De, Piet De Moor, Deniz Sabuncuoglu Tezcan, et al.. (2005). 3D Interconnect technology for space applications. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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