D. Lacey

611 citations

14 papers · 282 indexed · h-index 8

Impact in

Electrical and Electronic Engineering
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Ferroelectric and Negative Capacitance Devices
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
- Silicon Carbide Semiconductor Technologies
Atomic and Molecular Physics, and Optics

Papers in

Electrical and Electronic Engineering 13
- Semiconductor materials and devices 6
- Semiconductor Lasers and Optical Devices 5
- Advancements in Semiconductor Devices and Circuit Design 4
- Photonic and Optical Devices 3
- Ferroelectric and Negative Capacitance Devices 3
Industrial and Manufacturing Engineering 2
- Manufacturing Process and Optimization 2

Co-authors: Agnese Callegari Vijay Narayanan Martin M. Frank T. Kanarsky H.‐S. Philip Wong H. Chen A. Mocuta Steven J. Koester
Journals: Journal of Lightwave Technology (1 paper)IEEE Electron Device Letters (1 paper)Solid-State Electronics (1 paper)Applied Physics Letters (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (1 paper)
Partner nations: United States Switzerland

In The Last Decade

D. Lacey

12 papers receiving 268 citations

Peers

Countries citing papers authored by D. Lacey

Since Specialization

Citations

This map shows the geographic impact of D. Lacey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Lacey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Lacey more than expected).

Fields of papers citing papers by D. Lacey

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Lacey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Lacey. The network helps show where D. Lacey may publish in the future.

Co-authors

The 25 scholars most cited alongside D. Lacey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with D. Lacey Line = papers co-authored together D. Lacey links everyone, so they are left out of the graph.

All Works

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14 of 14 papers shown

#	Work
1	Understanding mobility mechanisms in extremely scaled HfO<inf>2</inf> (EOT 0.42 nm) using remote interfacial layer scavenging technique and V<inf>t</inf>-tuning dipoles with gate-first process Takashi Ando, Martin M. Frank, Kwang‐Il Choi, Changhwan Choi, J. Bruley, Marinus Hopstaken, M. Copel, K.H.T, A. Kerber, Agnese Callegari, D. Lacey, S. Brown, Qingyun Yang, Vijay Narayanan	2009	57
2	Process optimization for high electron mobility in nMOSFETs with aggressively scaled HfO/sub 2//metal stacks IEEE Electron Device Letters ·Vijay Narayanan, K. Maitra, B.P. Linder, Vamsi Paruchuri, E. P. Gusev, P. Jamison, Martin M. Frank, M. Steen, Berkay Günes, John Arnold, R. Carruthers, D. Lacey, E. Cartier	2006	35
3	Interface engineering for enhanced electron mobilities in W/HfO/sub 2/ gate stacks Agnese Callegari, P. Jamison, E. Cartier, Sufi Zafar, Evgeni Gusev, Vijay Narayanan, C. D’Emic, D. Lacey, 大森馨子, R. Jammy, M. Gribelyuk, J. Shepard, Wanda Andreoni, A. Curioni, Carlo A. Pignedoli	2005	19
4	Flip-chip, Self-aligned, Optoelectronic Transceiver Module K.P. Jackson, E.B. Flint, Zhihao Xie, D. Lacey, J.M. Trewhella, P. Buchmann, C. Harder, P. Vettiger	2005	0
5	Characteristics and device design of sub-100 nm strained Si N- and PMOSFETs K. Rim, J. O. Chu, H. Chen, K.A. Jenkins, T. Kanarsky, Yuko Kishi, A. Mocuta, Huilong Zhu, R. Roy, J. Newbury, J. A. Ott, K. Petrarca, P. M. Mooney, D. Lacey, Steven J. Koester, K. Chan, D. Boyd, M. Ieong, H.‐S. Philip Wong	2003	100
6	A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components K.P. Jackson, E.B. Flint, Zhihao Xie, D. Lacey, J.M. Trewhella, Thomas R. Caulfield, H.-J. Kahlert	2003	1
7	Thermal stability of polycrystalline silicon/metal oxide interfaces Applied Physics Letters ·Agnese Callegari, R. S. Nehete, T. Zabel, D. Lacey, M. Gribelyuk, P. Jamison	2002	3
8	Low-cost fabrication of optical subassemblies M. S. Cohen, G. W. Johnson, J.M. Trewhella, D. Lacey, Modest M. Oprysko, Nematolah Jaafari, Xiaoming Li, A. Abdelbaky Ahmed, Mark D. Peterson, Ali Salem Lalani	2002	8
9	Lithographically fabricated fiber guides for optical subassemblies M. S. Cohen, Sarhan M. Musa, EIKICHI ITOUJI, Jeffrey D. Gelorme, D.M. Kuchta, D. Lacey, J. Rosner, James L. Speidell	2002	4
10	Low-cost fabrication of optical subassemblies IEEE Transactions on Components Packaging and Manufacturing Technology Part B ·M. S. Cohen, G. W. Johnson, J.M. Trewhella, D. Lacey, Modest M. Oprysko, Nematolah Jaafari, Xiaoming Li, A. Abdelbaky Ahmed, Mark D. Peterson, Ali Salem Lalani	1997	13
11	A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology Journal of Lightwave Technology ·K.P. Jackson, E.B. Flint, Zhihao Xie, D. Lacey, Young Kwark, J.M. Trewhella, Thomas R. Caulfield, P. Buchmann, C. Harder, P. Vettiger	1994	26
12	Compact planar-processed package for multichannel, fiber-optic computer interconnects K.P. Jackson, E.B. Flint, Zhihao Xie, D. Lacey, J.M. Trewhella, Thomas R. Caulfield, H.-J. Kahlert	1992	1
13	Temperature Stability of AuGeNi Ohmic Contacts to GaAs European Solid-State Device Research Conference ·Agnese Callegari, Masanori Murakami, John M. Baker, Yih-Cheng Shih, D. Lacey	1987	2
14	Electrical and thermal stability of AuGeNi ohmic contacts to GaAs fabricated with in situ RF sputter cleaning Solid-State Electronics ·Agnese Callegari, D. Lacey, E. T-S. Pan	1986	13

About D. Lacey

D. Lacey is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Atomic and Molecular Physics, and Optics, Biomedical Engineering and Mechanical Engineering, having authored 14 papers that have together received 282 indexed citations. Recurring topics across this work include Semiconductor materials and devices (6 papers), Semiconductor Lasers and Optical Devices (5 papers), Advanced Surface Polishing Techniques (4 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Photonic and Optical Devices (3 papers), Semiconductor Quantum Structures and Devices (3 papers), Ferroelectric and Negative Capacitance Devices (3 papers) and Manufacturing Process and Optimization (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (278 citations), Atomic and Molecular Physics, and Optics (30 citations), Biomedical Engineering (37 citations), Structural Biology (1 citation) and Materials Chemistry (21 citations). D. Lacey has collaborated with scholars based in United States and Switzerland. Frequent co-authors include Agnese Callegari, Vijay Narayanan, Martin M. Frank, T. Kanarsky, H.‐S. Philip Wong, H. Chen, A. Mocuta, Steven J. Koester, P. M. Mooney and J. O. Chu. Their work appears in journals such as Journal of Lightwave Technology, IEEE Electron Device Letters, Solid-State Electronics, Applied Physics Letters and IEEE Transactions on Components Packaging and Manufacturing Technology Part B.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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