K. Petrarca

451 total citations
6 papers, 212 citations indexed

About

K. Petrarca is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Aerospace Engineering. According to data from OpenAlex, K. Petrarca has authored 6 papers receiving a total of 212 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Electrical and Electronic Engineering, 2 papers in Electronic, Optical and Magnetic Materials and 1 paper in Aerospace Engineering. Recurrent topics in K. Petrarca's work include Semiconductor materials and devices (5 papers), 3D IC and TSV technologies (3 papers) and Copper Interconnects and Reliability (2 papers). K. Petrarca is often cited by papers focused on Semiconductor materials and devices (5 papers), 3D IC and TSV technologies (3 papers) and Copper Interconnects and Reliability (2 papers). K. Petrarca collaborates with scholars based in United States. K. Petrarca's co-authors include C. Kothandaraman, T. Kanarsky, Cornelia Tsang, Timothy D. Sullivan, H.‐S. Philip Wong, H. Chen, J. A. Ott, D. Lacey, F. Chen and M. Ieong and has published in prestigious journals such as .

In The Last Decade

K. Petrarca

6 papers receiving 204 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
K. Petrarca United States	5	210	43	11	8	8	6	212
Sang‐Woong Yoon United States	11	321 1.5×	52 1.2×	26 2.4×	5 0.6×	10 1.3×	48	348
Said Rami United States	7	206 1.0×	27 0.6×	13 1.2×	7 0.9×	10 1.3×	21	225
Arka Dutta India	12	361 1.7×	57 1.3×	8 0.7×	7 0.9×	12 1.5×	38	404
Jie Fang Italy	8	310 1.5×	82 1.9×	5 0.5×	5 0.6×	19 2.4×	16	322
Tzu-Jin Yeh Taiwan	10	309 1.5×	24 0.6×	18 1.6×	15 1.9×	3 0.4×	26	315
R. Volant United States	10	401 1.9×	65 1.5×	20 1.8×	13 1.6×	7 0.9×	21	403
A. Andreini Italy	9	270 1.3×	21 0.5×	3 0.3×	7 0.9×	4 0.5×	38	276
A. Bryant United States	11	329 1.6×	54 1.3×	9 0.8×	2 0.3×	12 1.5×	21	332
Xuemei Xi United States	10	382 1.8×	49 1.1×	14 1.3×	3 0.4×	11 1.4×	35	400
D. Henry France	5	61 0.3×	16 0.4×	13 1.2×	5 0.6×	4 0.5×	7	72

Countries citing papers authored by K. Petrarca

Since Specialization

Citations

This map shows the geographic impact of K. Petrarca's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Petrarca with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Petrarca more than expected).

Fields of papers citing papers by K. Petrarca

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. Petrarca. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Petrarca. The network helps show where K. Petrarca may publish in the future.

Co-authorship network of co-authors of K. Petrarca

This figure shows the co-authorship network connecting the top 25 collaborators of K. Petrarca. A scholar is included among the top collaborators of K. Petrarca based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. Petrarca. K. Petrarca is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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6 of 6 papers shown

1.

Kothandaraman, C., Sidney Cohen, C. Parks, et al.. (2014). Through silicon via (TSV) effects on devices in close proximity - the role of mobile ion penetration - characterization and mitigation. 14.6.1–14.6.3. 5 indexed citations

2.

Kothandaraman, C., John Safran, John Golz, et al.. (2012). Copper through silicon via (TSV) for 3D integration. 2B.1.1–2B.1.4. 6 indexed citations

3.

Landers, W., C. Kothandaraman, Paul Andry, et al.. (2011). 3D copper TSV integration, testing and reliability. 52. 7.1.1–7.1.4. 91 indexed citations

4.

Wu, Rui, C. Ellis, Michael J. Palmer, et al.. (2008). System-in-package for extreme environments. 2044–2050. 9 indexed citations

5.

Dalton, T., Nicholas Fuller, Catherine B. Labelle, et al.. (2004). Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing. 154–156. 1 indexed citations

6.

Rim, K., J. O. Chu, H. Chen, et al.. (2003). Characteristics and device design of sub-100 nm strained Si N- and PMOSFETs. 98–99. 100 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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