John Arnold

3.4k total citations
79 papers, 1.3k citations indexed

About

John Arnold is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, John Arnold has authored 79 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Electrical and Electronic Engineering, 23 papers in Biomedical Engineering and 19 papers in Mechanics of Materials. Recurrent topics in John Arnold's work include Advancements in Photolithography Techniques (29 papers), Copper Interconnects and Reliability (16 papers) and Semiconductor materials and devices (15 papers). John Arnold is often cited by papers focused on Advancements in Photolithography Techniques (29 papers), Copper Interconnects and Reliability (16 papers) and Semiconductor materials and devices (15 papers). John Arnold collaborates with scholars based in United States, United Kingdom and Japan. John Arnold's co-authors include Herbert H. Sawin, Jane P. Chang, Hyung–Shik Shin, Sue Alston, Feras Korkees, T. Dalton, Daniel Corliss, Mohamed Aqiel Dalvie, David C. Gray and Satoshi Hamaguchi and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

John Arnold

71 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
John Arnold United States 19 829 386 230 209 206 79 1.3k
Yanan Jiao China 20 410 0.5× 362 0.9× 297 1.3× 238 1.1× 262 1.3× 50 1.2k
Suli Xing China 22 168 0.2× 405 1.0× 284 1.2× 337 1.6× 337 1.6× 63 1.4k
Kaifeng Zhang China 22 248 0.3× 470 1.2× 171 0.7× 151 0.7× 608 3.0× 89 1.4k
W.P. Vellinga Netherlands 18 361 0.4× 340 0.9× 122 0.5× 106 0.5× 460 2.2× 47 1.1k
В. П. Сергеев Russia 16 377 0.5× 250 0.6× 148 0.6× 93 0.4× 386 1.9× 145 896
Vladimír Čech Czechia 18 182 0.2× 543 1.4× 142 0.6× 270 1.3× 422 2.0× 82 1.0k
Weining Lei China 15 412 0.5× 147 0.4× 253 1.1× 50 0.2× 349 1.7× 62 918
Jianfeng Zhou China 17 319 0.4× 284 0.7× 307 1.3× 234 1.1× 282 1.4× 37 1.0k
YunHo Kim South Korea 18 197 0.2× 371 1.0× 141 0.6× 382 1.8× 486 2.4× 63 1.0k
David Jauffrès France 23 112 0.1× 416 1.1× 182 0.8× 233 1.1× 389 1.9× 53 1.2k

Countries citing papers authored by John Arnold

Since Specialization
Citations

This map shows the geographic impact of John Arnold's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Arnold with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Arnold more than expected).

Fields of papers citing papers by John Arnold

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John Arnold. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Arnold. The network helps show where John Arnold may publish in the future.

Co-authorship network of co-authors of John Arnold

This figure shows the co-authorship network connecting the top 25 collaborators of John Arnold. A scholar is included among the top collaborators of John Arnold based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John Arnold. John Arnold is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Arnold, John, et al.. (2021). 3D printed polylactic acid - hemp fiber composites: Mechanical, thermal, and microcomputed tomography data. SHILAP Revista de lepidopterología. 39. 107534–107534. 8 indexed citations
2.
Arnold, John, et al.. (2021). Extrusion of shrimp shell-polylactic acid composites: Dataset for the impact of surfactants on their morphology and thermal properties. SHILAP Revista de lepidopterología. 36. 107059–107059. 2 indexed citations
3.
Al–Salem, S.M., et al.. (2019). Study of the degradation profile for virgin linear low-density polyethylene (LLDPE) and polyolefin (PO) plastic waste blends. Journal of Material Cycles and Waste Management. 21(5). 1106–1122. 34 indexed citations
4.
Liu, Chi‐Chun, Richard A. Farrell, Kafai Lai, et al.. (2019). Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning. 10143. 20–20. 1 indexed citations
5.
Labelle, Catherine B., et al.. (2018). Introduction of pre-etch deposition techniques in EUV patterning. 9776. 19–19. 2 indexed citations
6.
Silva, Anuja De, Karen Petrillo, Luciana Meli, et al.. (2017). Single-expose patterning development for EUV lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10143. 101431G–101431G. 7 indexed citations
7.
Seshadri, Indira, Anuja De Silva, Luciana Meli, et al.. (2017). Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10143. 101431D–101431D. 3 indexed citations
8.
Chi, Cheng, Chi‐Chun Liu, Luciana Meli, et al.. (2016). DSA via hole shrink for advanced node applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9777. 97770L–97770L. 6 indexed citations
9.
Holmes, Steven J., John Arnold, Rex Chen, et al.. (2010). Process characterization of pitch-split resist materials for application at 16nm node. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7639. 76392X–76392X.
10.
Arnold, John, et al.. (2009). Influence of production parameters on surface energy of tinplate. Ironmaking & Steelmaking Processes Products and Applications. 36(6). 456–461. 2 indexed citations
11.
Goldfarb, Darı́o L., Sean Burns, Ladislav Vyklický, et al.. (2008). Graded spin-on organic bottom antireflective coating for high NA lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6923. 69230V–69230V. 3 indexed citations
12.
Arnold, John, et al.. (2007). Prediction of the long-term creep behaviour of hydroxyapatite-filled polyethylmethacrylate bone cements. Journal of Materials Science Materials in Medicine. 18(9). 1849–1858. 18 indexed citations
13.
Arnold, John, et al.. (2001). Effects of environment on the creep properties of a poly(ethylmethacrylate) based bone cement. Journal of Materials Science Materials in Medicine. 12(8). 707–717. 25 indexed citations
14.
Arnold, John, et al.. (1999). The properties of recycled PVC bottle compounds. 2: Reprocessing stability. Polymer Engineering and Science. 39(7). 1242–1250. 18 indexed citations
15.
Arnold, John, et al.. (1998). The Use of Miniature Disc Bend Tests with Plastic Materials. Polymer Testing. 17(8). 597–611. 3 indexed citations
16.
Arnold, John. (1996). Environmental stress crack initiation in glassy polymers. 12(4). 403–408. 12 indexed citations
17.
Isaac, D.H., et al.. (1996). Environmental stress cracking in uniaxial tension of urethane methacrylate based resins. Materials Science and Engineering A. 214(1-2). 68–77. 1 indexed citations
18.
Arnold, John. (1995). The influence of liquid uptake on environmental stress cracking of glassy polymers. Materials Science and Engineering A. 197(1). 119–124. 49 indexed citations
19.
Arnold, John & Victor White. (1995). Predictive models for the creep behaviour of PMMA. Materials Science and Engineering A. 197(2). 251–260. 13 indexed citations
20.
Li, Jiajun, John Arnold, & D.H. Isaac. (1994). Environmental stress cracking behaviour of urethane methacrylate based resins. Journal of Materials Science. 29(12). 3095–3101. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Yanan Jiao Breakdown of academic impact, for papers by Suli Xing Breakdown of academic impact, for papers by Kaifeng Zhang Breakdown of academic impact, for papers by W.P. Vellinga Breakdown of academic impact, for papers by В. П. Сергеев Breakdown of academic impact, for papers by Vladimír Čech Breakdown of academic impact, for papers by Weining Lei Breakdown of academic impact, for papers by Jianfeng Zhou Breakdown of academic impact, for papers by YunHo Kim Breakdown of academic impact, for papers by David Jauffrès
Rankless by CCL
2026