Emmanuel Chery
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Photolithography Techniques
Papers in
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- Semiconductor materials and devices 20
- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 8
- Ferroelectric and Negative Capacitance Devices 5
- Advancements in Semiconductor Devices and Circuit Design 4
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- Copper Interconnects and Reliability 12
- Co-authors
- Eric Beyne (18 shared papers)John Slabbekoorn (8 shared papers)Kristof Croes (10 shared papers)Michele Stucchi (8 shared papers)Andy Miller (5 shared papers)Aurélie Thuaire (1 shared paper)F. Lorut (1 shared paper)S. Moreau (2 shared papers)
- Journals
- IEEE Transactions on Device and Materials Reliability (2 papers)JOM (2 papers)Microelectronic Engineering (2 papers)Solid-State Electronics (2 papers)Microelectronics Reliability (1 paper)
- Partner nations
- BelgiumUnited StatesFrance
In The Last Decade
Emmanuel Chery
26 papers receiving 282 citations
Peers
Comparison fields: 5 of 23
- Electronic, Optical and Magnetic Materials 99
- Electrical and Electronic Engineering 269
- Automotive Engineering 23
- Polymers and Plastics 19
- Ceramics and Composites 6
Countries citing papers authored by Emmanuel Chery
This map shows the geographic impact of Emmanuel Chery's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Emmanuel Chery with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Emmanuel Chery more than expected).
Fields of papers citing papers by Emmanuel Chery
This network shows the impact of papers produced by Emmanuel Chery. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Emmanuel Chery. The network helps show where Emmanuel Chery may publish in the future.
Co-authors
The 25 scholars most cited alongside Emmanuel Chery, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 89 | |
| 2 | 2020 | 43 | |
| 3 | 2023 | 24 | |
| 4 | 2013 | 23 | |
| 5 | 2021 | 18 | |
| 6 | 2021 | 17 | |
| 7 | 2020 | 14 | |
| 8 | 2023 | 12 | |
| 9 | 2023 | 8 | |
| 10 | 2022 | 8 | |
| 11 | 2022 | 6 | |
| 12 | 2023 | 5 | |
| 13 | 2023 | 4 | |
| 14 | 2024 | 4 | |
| 15 | 2023 | 4 | |
| 16 | 2022 | 3 | |
| 17 | 2024 | 3 | |
| 18 | 2023 | 2 | |
| 19 | 2012 | 2 | |
| 20 | 2018 | 2 |
About Emmanuel Chery
Emmanuel Chery is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Biomedical Engineering and Atomic and Molecular Physics, and Optics, having authored 30 papers that have together received 297 indexed citations. Recurring topics across this work include Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (12 papers), 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (8 papers), Ferroelectric and Negative Capacitance Devices (5 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Corrosion Behavior and Inhibition (3 papers) and Semiconductor materials and interfaces (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (99 citations), Electrical and Electronic Engineering (269 citations), Automotive Engineering (23 citations), Polymers and Plastics (19 citations) and Ceramics and Composites (6 citations). Emmanuel Chery has collaborated with scholars based in Belgium, United States and France. Frequent co-authors include Eric Beyne, John Slabbekoorn, Kristof Croes, Michele Stucchi, Andy Miller, Aurélie Thuaire, F. Lorut, S. Moreau, C. Chappaz and Lorena Anghel. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, JOM, Microelectronic Engineering, Solid-State Electronics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.