Po-Ning Hsu
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Semiconductor materials and devices
Papers in
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- Electronic Packaging and Soldering Technologies 15
- 3D IC and TSV technologies 10
- Integrated Circuits and Semiconductor Failure Analysis 1
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- Aluminum Alloys Composites Properties 8
- Advanced Welding Techniques Analysis 2
- Intermetallics and Advanced Alloy Properties 2
- Co-authors
- Chih Chen (17 shared papers)K. N. Tu (8 shared papers)Kai-Cheng Shie (9 shared papers)Dinh-Phuc Tran (9 shared papers)Chia-Ling Lu (2 shared papers)K. N. Tu (2 shared papers)Chao‐Chang A. Chen (1 shared paper)Kuan‐Ju Chen (1 shared paper)
- Journals
- Materials (4 papers)Scientific Reports (3 papers)Journal of Materials Research and Technology (2 papers)Materials Science and Engineering A (1 paper)Results in Physics (2 papers)
- Partner nations
- TaiwanUnited StatesHong Kong
In The Last Decade
Po-Ning Hsu
17 papers receiving 312 citations
Peers
Comparison fields: 5 of 23
- Electronic, Optical and Magnetic Materials 140
- Electrical and Electronic Engineering 269
- Mechanical Engineering 85
- Materials Chemistry 80
- Ceramics and Composites 9
Countries citing papers authored by Po-Ning Hsu
This map shows the geographic impact of Po-Ning Hsu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Po-Ning Hsu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Po-Ning Hsu more than expected).
Fields of papers citing papers by Po-Ning Hsu
This network shows the impact of papers produced by Po-Ning Hsu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Po-Ning Hsu. The network helps show where Po-Ning Hsu may publish in the future.
Co-authors
The 16 scholars most cited alongside Po-Ning Hsu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 89 | |
| 2 | 2021 | 42 | |
| 3 | 2021 | 37 | |
| 4 | 2021 | 27 | |
| 5 | 2021 | 22 | |
| 6 | 2021 | 16 | |
| 7 | 2022 | 14 | |
| 8 | 2019 | 14 | |
| 9 | 2022 | 12 | |
| 10 | 2022 | 10 | |
| 11 | 2023 | 10 | |
| 12 | 2021 | 8 | |
| 13 | 2022 | 7 | |
| 14 | 2022 | 3 | |
| 15 | 2022 | 2 | |
| 16 | 2020 | 2 | |
| 17 | 2021 | 1 |
About Po-Ning Hsu
Po-Ning Hsu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry and Hardware and Architecture, having authored 17 papers that have together received 316 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (10 papers), Aluminum Alloys Composites Properties (8 papers), Copper Interconnects and Reliability (8 papers), Advanced Welding Techniques Analysis (2 papers), Microstructure and mechanical properties (2 papers), Intermetallics and Advanced Alloy Properties (2 papers) and Integrated Circuits and Semiconductor Failure Analysis (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (140 citations), Electrical and Electronic Engineering (269 citations), Mechanical Engineering (85 citations), Materials Chemistry (80 citations) and Ceramics and Composites (9 citations). Po-Ning Hsu has collaborated with scholars based in Taiwan, United States and Hong Kong. Frequent co-authors include Chih Chen, K. N. Tu, Kai-Cheng Shie, Dinh-Phuc Tran, Chia-Ling Lu, K. N. Tu, Chao‐Chang A. Chen, Kuan‐Ju Chen, Nien‐Ti Tsou and Chia‐Cheng Chang. Their work appears in journals such as Materials, Scientific Reports, Journal of Materials Research and Technology, Materials Science and Engineering A and Results in Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.