Michael Ellsworth
- Artificial Intelligence top 2%
- Natural Language Processing Techniques 15
- Topic Modeling 12
- Semantic Web and Ontologies 8
- Language and Linguistics top 2%
- Mechanical Engineering top 5%
- Heat Transfer and Optimization 21
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques 7
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- Advanced Data Storage Technologies 4
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- Fluid Dynamics and Turbulent Flows 4
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- Electronic Packaging and Soldering Technologies 4
- Co-authors
- Jan ScheffczykJosef RuppenhoferChristopher R. JohnsonMiriam R. L. PetruckRobert E. SimonsRichard C. ChuCollin F. BakerRoger Schmidt
- Journals
- Journal of Electronic Packaging (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)IBM Journal of Research and Development (1 paper)
- Partner nations
- United StatesCanadaBrazil
In The Last Decade
Michael Ellsworth
47 papers receiving 1.1k citations
Hit Papers
Peers
Comparison fields: 5 of 84
- Artificial Intelligence 665
- Language and Linguistics 207
- Mechanical Engineering 367
- Hardware and Architecture 60
- Experimental and Cognitive Psychology 82
Countries citing papers authored by Michael Ellsworth
This map shows the geographic impact of Michael Ellsworth's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Ellsworth with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Ellsworth more than expected).
Fields of papers citing papers by Michael Ellsworth
This network shows the impact of papers produced by Michael Ellsworth. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Ellsworth. The network helps show where Michael Ellsworth may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Michael Ellsworth, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Frame Semantics across Languages: Towards a Multilingual FrameNet | 2018 | 2 |
| 2 | 2018 | 7 | |
| 3 | 2015 | 2 | |
| 4 | 2014 | 1 | |
| 5 | 2013 | 5 | |
| 6 | 2013 | 11 | |
| 7 | 2012 | 53 | |
| 8 | 2010 | 17 | |
| 9 | 2009 | 10 | |
| 10 | 2008 | 51 | |
| 11 | Linking FrameNet to the Suggested Upper Merged Ontology | 2006 | 32 |
| 12 | BioFrameNet: A Domain-Specific FrameNet Extension with Links to Biomedical Ontologies. | 2006 | 40 |
| 13 | 2005 | 57 | |
| 14 | Reframing FrameNet Data | 2004 | 12 |
| 15 | 2004 | 5 | |
| 16 | 2004 | 23 | |
| 17 | 2003 | 12 | |
| 18 | 2003 | 3 | |
| 19 | 2002 | 2 | |
| 20 | 2000 | 3 |
About Michael Ellsworth
Michael Ellsworth is a scholar working on Hardware and Architecture, Mechanical Engineering, Artificial Intelligence, Language and Linguistics and Electrical and Electronic Engineering, having authored 49 papers that have together received 1.3k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (21 papers), Natural Language Processing Techniques (15 papers), Topic Modeling (12 papers), Semantic Web and Ontologies (8 papers), Parallel Computing and Optimization Techniques (7 papers), Advanced Data Storage Technologies (4 papers), Fluid Dynamics and Turbulent Flows (4 papers) and Electronic Packaging and Soldering Technologies (4 papers). The work is most often cited by research in Artificial Intelligence (665 citations), Language and Linguistics (207 citations), Mechanical Engineering (367 citations), Hardware and Architecture (60 citations) and Experimental and Cognitive Psychology (82 citations). Michael Ellsworth has collaborated with scholars based in United States, Canada and Brazil. Frequent co-authors include Jan Scheffczyk, Josef Ruppenhofer, Christopher R. Johnson, Miriam R. L. Petruck, Robert E. Simons, Richard C. Chu, Collin F. Baker, Roger Schmidt, Katrin Erk and Madhusudan Iyengar. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Device and Materials Reliability, IBM Journal of Research and Development, Language Resources and Evaluation and Journal of Thermophysics and Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.