Min-Suk Suh
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Electrodeposition and Electroless Coatings
- General Materials Science top 10%
Papers in
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- Electronic Packaging and Soldering Technologies 13
- 3D IC and TSV technologies 12
- Semiconductor materials and devices 4
- Integrated Circuits and Semiconductor Failure Analysis 2
- Co-authors
- Kwang-Yoo ByunHyukSang KwonEakhwan SongTaigon SongHyungdong LeeSeung-Taek YangKunwoo ParkJun So Pak
- Journals
- Surface and Coatings Technology (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Japanese Journal of Applied Physics (2 papers)Journal of The Electrochemical Society (2 papers)Materials Chemistry and Physics (1 paper)
- Partner nations
- South KoreaUnited States
In The Last Decade
Min-Suk Suh
19 papers receiving 690 citations
Hit Papers
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 684
- General Materials Science 12
- Automotive Engineering 43
- Hardware and Architecture 19
- Atomic and Molecular Physics, and Optics 81
Countries citing papers authored by Min-Suk Suh
This map shows the geographic impact of Min-Suk Suh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min-Suk Suh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min-Suk Suh more than expected).
Fields of papers citing papers by Min-Suk Suh
This network shows the impact of papers produced by Min-Suk Suh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min-Suk Suh. The network helps show where Min-Suk Suh may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Min-Suk Suh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Encourage Technology Transfer for Public Research Institutes and Universities in Korea | 2016 | 1 |
| 2 | 2015 | 7 | |
| 3 | 2014 | 1 | |
| 4 | 2014 | 21 | |
| 5 | 2013 | 2 | |
| 6 | 2013 | 11 | |
| 7 | 2011 | 134 | |
| 8 | High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Hit paper breakdown → | 2011 | 373 |
| 9 | 2009 | 9 | |
| 10 | 2008 | 23 | |
| 11 | 2008 | 5 | |
| 12 | 2007 | 17 | |
| 13 | The Effect of Insulating Material on WLCSP Reliability with Various Solder Ball Layout | 2006 | 1 |
| 14 | 2004 | 60 | |
| 15 | 2003 | 5 | |
| 16 | 2002 | 1 | |
| 17 | 2001 | 8 | |
| 18 | 2000 | 3 | |
| 19 | 1996 | 21 | |
| 20 | 1996 | 6 |
About Min-Suk Suh
Min-Suk Suh is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Hardware and Architecture and Atomic and Molecular Physics, and Optics, having authored 20 papers that have together received 709 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (12 papers), Semiconductor materials and devices (4 papers), Copper Interconnects and Reliability (3 papers), Semiconductor materials and interfaces (3 papers), Intermetallics and Advanced Alloy Properties (3 papers), Aluminum Alloy Microstructure Properties (2 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (684 citations), General Materials Science (12 citations), Automotive Engineering (43 citations), Hardware and Architecture (19 citations) and Atomic and Molecular Physics, and Optics (81 citations). Min-Suk Suh has collaborated with scholars based in South Korea and United States. Frequent co-authors include Kwang-Yoo Byun, HyukSang Kwon, Eakhwan Song, Taigon Song, Hyungdong Lee, Seung-Taek Yang, Kunwoo Park, Jun So Pak, Jonghyun Cho and Joohee Kim. Their work appears in journals such as Surface and Coatings Technology, IEEE Transactions on Components Packaging and Manufacturing Technology, Japanese Journal of Applied Physics, Journal of The Electrochemical Society and Materials Chemistry and Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.