T. Lacrevaz

449 citations

37 papers · 172 indexed · h-index 7

Co-authors: B. Fléchet C. Bermond A. Farcy J. Torrès Trinh Vo Emmanuel Defaÿ F. de Crécy T. Bertaud
Topics: 3D IC and TSV technologies (16 papers)Copper Interconnects and Reliability (14 papers)Electromagnetic Compatibility and Noise Suppression (13 papers)
Cited by: Electrical and Electronic Engineering Electronic, Optical and Magnetic Materials Acoustics and Ultrasonics
Journals: Applied Physics Letters Microelectronic Engineering IEEE Transactions on Components and Packaging Technologies
Partner nations: France Switzerland Hungary

In The Last Decade

T. Lacrevaz

35 papers receiving 165 citations

Peers

Countries citing papers authored by T. Lacrevaz

Since Specialization

Citations

This map shows the geographic impact of T. Lacrevaz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Lacrevaz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Lacrevaz more than expected).

Fields of papers citing papers by T. Lacrevaz

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Lacrevaz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Lacrevaz. The network helps show where T. Lacrevaz may publish in the future.

Co-authorship network of co-authors of T. Lacrevaz

This figure shows the co-authorship network connecting the top 25 collaborators of T. Lacrevaz. A scholar is included among the top collaborators of T. Lacrevaz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Lacrevaz. T. Lacrevaz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Characterization of Corrosive Lithium-Bromide/Water Solutions up to 6 GHz Using a Low Cost SMA Connector 2024 ·(unknown),(unknown),(unknown),(unknown),Benoı̂t Stutz,T. Lacrevaz	0
2	High gain Vivaldi antenna from 26 up to 40 GHz for 5G applications 2022 ·Microwave and Optical Technology Letters ·(unknown),(unknown),T. Lacrevaz,Tân-Phu Vuong	2
3	Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers 2017 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown),(unknown),C. Bermond,(unknown),T. Lacrevaz,(unknown),(unknown),A. Farcy,(unknown),Yann Lamy,(unknown)	5
4	RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits 2014 ·Microelectronic Engineering ·(unknown),(unknown),T. Lacrevaz,A. Farcy,(unknown),Philip R. LeDuc,(unknown),S. Chéramy,N. Sillon,B. Fléchet	3
5	Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results 2014 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·T. Lacrevaz,C. Bermond,(unknown),(unknown),(unknown),Yann Lamy,(unknown),(unknown)	3
6	Lateral Field Excitation of membrane-based Aluminum Nitride resonators 2011 ·(unknown),Alexandre Reinhardt,C. Billard,(unknown),Emmanuel Defaÿ,T. Bertaud,T. Lacrevaz,C. Bermond	5
7	Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology 2011 ·(unknown),T. Lacrevaz,Jean Charbonnier,C. Fuchs,A. Farcy,C. Bermond,(unknown),(unknown),B. Fléchet	6
8	Effective interconnect networks design in CMOS 45 nm circuits to joint reductions of XT and delay for transmission of very high speed signals 2010 ·S. de Rivaz,A. Farcy,D. Deschacht,T. Lacrevaz,B. Fléchet	2
9	Innovative HF extraction procedure of the characteristic impedance for embedded planar transmission line on high conductive Si substrate 2010 ·(unknown),T. Lacrevaz,Jean Charbonnier,A. Farcy,B. Fléchet	1
10	Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking 2010 ·Microelectronic Engineering ·(unknown),T. Lacrevaz,C. Bermond,(unknown),(unknown),B. Fléchet,(unknown),A. Farcy,P. Ancey,Françis Calmon,(unknown),Philip R. LeDuc	3
11	Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz 2009 ·Applied Physics Letters ·Emmanuel Defaÿ,T. Lacrevaz,Trinh Vo,(unknown),C. Bermond,M. Aïd,B. Fléchet	19
12	Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32nm node 2009 ·Microelectronic Engineering ·B. Blampey,(unknown),A. Farcy,T. Lacrevaz,S. de Rivaz,C. Bermond,B. Fléchet,V. Jousseaume,A. Zenasni,P. Ancey	1
13	Dielectric Loss Effects on the Modeling of Interconnect Responses for the 45 nm Node 2008 ·S. de Rivaz,T. Lacrevaz,(unknown),A. Farcy,B. Blampey,C. Bermond,B. Fléchet	1
14	In-situ Microwave Characterization of Medium-k HfO<inf>2</inf> and High-k STO Dielectrics for MIM Capacitors Integrated in Back-End of Line of IC 2007 ·Trinh Vo,T. Lacrevaz,B. Fléchet,A. Farcy,Y. Morand,S. Blonkowski,J. Torrès,Emmanuel Defaÿ	1
15	Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives 2006 ·Microelectronic Engineering ·T. Lacrevaz,B. Fléchet,A. Farcy,J. Torrès,M. Gros‐Jean,C. Bermond,Trinh Vo,O. Cueto,B. Blampey,(unknown),(unknown),F. de Crécy	11
16	Wide Band Frequency Characterization of High Permittivity Dielectrics (High-K) for RF MIM Capacitors Integrated in BEOL 2006 ·T. Lacrevaz,B. Fléchet,A. Farcy,J. Torrès,Trinh Vo,C. Bermond,O. Cueto,Emmanuel Defaÿ,M. Gros‐Jean,B. Blampey,(unknown),(unknown),F. de Crécy	1
17	High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits 2006 ·Microelectronic Engineering ·(unknown),C. Bermond,(unknown),B. Fléchet,A. Farcy,Trinh Vo,T. Lacrevaz,J. Torrès,O. Cueto,(unknown)	1
18	High Frequencies Characterization of High-K Insulators and their Impact on Architectures of MIM Capacitors in Advanced Integrated Circuits 2006 ·T. Lacrevaz,Trinh Vo,(unknown),C. Bermond,B. Fléchet,Emmanuel Defaÿ,(unknown),A. Farcy,O. Cueto,J. Torrès	0
19	Characterization and optimization of a new Cu/SiN/TaN/Cu damascene architecture for metal–insulator–metal capacitors 2005 ·Microelectronic Engineering ·(unknown),(unknown),A. Farcy,C. Bermond,J. Torrès,T. Lacrevaz,B. Fléchet,N. Casanova,C. Perrot,(unknown),B. Chenevier	9
20	Impact of Design on High Frequency Performances of Advanced MIM Capacitors Using SiN Dielectric Layers 2005 ·IEEE MTT-S International Microwave Symposium Digest, 2005. ·(unknown),C. Bermond,(unknown),A. Farcy,T. Lacrevaz,B. Blampey,J. Torrès,B. Fléchet,(unknown)	2

About T. Lacrevaz

T. Lacrevaz is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Aerospace Engineering, having authored 37 papers that have together received 172 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (16 papers), Copper Interconnects and Reliability (14 papers) and Electromagnetic Compatibility and Noise Suppression (13 papers). The work is most often cited by research in Electrical and Electronic Engineering (145 citations), Electronic, Optical and Magnetic Materials (37 citations) and Acoustics and Ultrasonics (1 citation). T. Lacrevaz has collaborated with scholars based in France, Switzerland and Hungary. Frequent co-authors include B. Fléchet, C. Bermond, A. Farcy, J. Torrès, Trinh Vo, Emmanuel Defaÿ, F. de Crécy, T. Bertaud, M. Aïd and B. Blampey. Their work appears in journals such as Applied Physics Letters, Microelectronic Engineering and IEEE Transactions on Components and Packaging Technologies.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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