Josef Weber
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Microwave Engineering and Waveguides
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Additive Manufacturing and 3D Printing Technologies 5
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- 3D IC and TSV technologies 15
- Advanced MEMS and NEMS Technologies 5
- Electronic Packaging and Soldering Technologies 5
- Semiconductor Lasers and Optical Devices 3
- Microwave Engineering and Waveguides 2
- Co-authors
- Peter RammArmin KlumppR. MerkelMaaike M. Visser TakloRobert WielandW. De RaedtT. FritzschAndreas Ostmann
- Journals
- Japanese Journal of Applied Physics (1 paper)Microelectronic Engineering (1 paper)Microsystem Technologies (1 paper)Applied Thermal Engineering (1 paper)ECS Transactions (1 paper)
- Partner nations
- GermanyNorwaySwitzerland
In The Last Decade
Josef Weber
18 papers receiving 300 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 295
- Automotive Engineering 48
- Hardware and Architecture 10
- Biomedical Engineering 59
- Radiation 11
Countries citing papers authored by Josef Weber
This map shows the geographic impact of Josef Weber's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Josef Weber with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Josef Weber more than expected).
Fields of papers citing papers by Josef Weber
This network shows the impact of papers produced by Josef Weber. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Josef Weber. The network helps show where Josef Weber may publish in the future.
Co-authorship network
The 22 scholars most cited alongside Josef Weber, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 4 | |
| 2 | 2019 | 0 | |
| 3 | 2018 | 2 | |
| 4 | 2018 | 1 | |
| 5 | 2016 | 5 | |
| 6 | 2015 | 14 | |
| 7 | 2015 | 1 | |
| 8 | 2015 | 10 | |
| 9 | 2012 | 4 | |
| 10 | Towards new business models in the energy sector based on Software-as-a-Service-Utilities and value-added services | 2010 | 1 |
| 11 | 2010 | 4 | |
| 12 | 2010 | 62 | |
| 13 | 3D integration technologies | 2009 | 5 |
| 14 | 2009 | 50 | |
| 15 | 2009 | 22 | |
| 16 | 2008 | 7 | |
| 17 | 2008 | 1 | |
| 18 | 2005 | 31 | |
| 19 | 2004 | 60 | |
| 20 | 2003 | 39 |
About Josef Weber
Josef Weber is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Bioengineering and Electronic, Optical and Magnetic Materials, having authored 20 papers that have together received 323 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Advanced MEMS and NEMS Technologies (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Manufacturing Process and Optimization (3 papers), Semiconductor Lasers and Optical Devices (3 papers), Copper Interconnects and Reliability (2 papers) and Microwave Engineering and Waveguides (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (295 citations), Automotive Engineering (48 citations), Hardware and Architecture (10 citations), Biomedical Engineering (59 citations) and Radiation (11 citations). Josef Weber has collaborated with scholars based in Germany, Norway and Switzerland. Frequent co-authors include Peter Ramm, Armin Klumpp, R. Merkel, Maaike M. Visser Taklo, Robert Wieland, W. De Raedt, T. Fritzsch, Andreas Ostmann, Adrian M. Ionescu and Wolfgang A. Vitale. Their work appears in journals such as Japanese Journal of Applied Physics, Microelectronic Engineering, Microsystem Technologies, Applied Thermal Engineering and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.