Sam Gu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 14
- Electronic Packaging and Soldering Technologies 8
- Semiconductor materials and devices 5
- Integrated Circuits and Semiconductor Failure Analysis 2
- VLSI and FPGA Design Techniques 1
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- Additive Manufacturing and 3D Printing Technologies 2
Sam Gu
15 papers receiving 323 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 309
- Electronic, Optical and Magnetic Materials 71
- Hardware and Architecture 21
- Automotive Engineering 37
- General Materials Science 6
Countries citing papers authored by Sam Gu
This map shows the geographic impact of Sam Gu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sam Gu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sam Gu more than expected).
Fields of papers citing papers by Sam Gu
This network shows the impact of papers produced by Sam Gu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sam Gu. The network helps show where Sam Gu may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Sam Gu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 22 | |
| 2 | 2016 | 14 | |
| 3 | 2016 | 3 | |
| 4 | 2016 | 20 | |
| 5 | 2015 | 28 | |
| 6 | 2015 | 47 | |
| 7 | 2015 | 19 | |
| 8 | 2015 | 22 | |
| 9 | 2014 | 4 | |
| 10 | 2013 | 22 | |
| 11 | 2013 | 1 | |
| 12 | 2010 | 33 | |
| 13 | 2010 | 5 | |
| 14 | 2009 | 54 | |
| 15 | 2008 | 40 |
About Sam Gu
Sam Gu is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Hardware and Architecture, Electronic, Optical and Magnetic Materials and Industrial and Manufacturing Engineering, having authored 15 papers that have together received 334 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and devices (5 papers), Copper Interconnects and Reliability (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Additive Manufacturing and 3D Printing Technologies (2 papers), Manufacturing Process and Optimization (1 paper) and VLSI and FPGA Design Techniques (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (309 citations), Electronic, Optical and Magnetic Materials (71 citations), Hardware and Architecture (21 citations), Automotive Engineering (37 citations) and General Materials Science (6 citations). Sam Gu has collaborated with scholars based in United States, United Kingdom and Belgium. Frequent co-authors include Dongwook Kim, Yingxia Liu, Menglu Li, Wei Zhao, K. N. Tu, K. N. Tu, Li Xia, Yu Cao, Seung H. Kang and Riko Radojcic. Their work appears in journals such as Journal of Applied Physics, Scripta Materialia, MRS Bulletin, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.