Sam Gu

439 total citations
15 papers, 334 citations indexed

About

Sam Gu is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Sam Gu has authored 15 papers receiving a total of 334 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 2 papers in Automotive Engineering and 2 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Sam Gu's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (8 papers) and Semiconductor materials and devices (5 papers). Sam Gu is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (8 papers) and Semiconductor materials and devices (5 papers). Sam Gu collaborates with scholars based in United States, United Kingdom and Belgium. Sam Gu's co-authors include Dongwook Kim, Yingxia Liu, Menglu Li, Wei Zhao, K. N. Tu, K. N. Tu, Li Xia, Yu Cao, Seung H. Kang and Riko Radojcic and has published in prestigious journals such as Journal of Applied Physics, Scripta Materialia and IEEE Transactions on Electron Devices.

In The Last Decade

Sam Gu

15 papers receiving 323 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sam Gu United States 11 309 71 49 37 27 15 334
A. Sharma United States 6 327 1.1× 29 0.4× 33 0.7× 47 1.3× 21 0.8× 8 362
C. T. Wang Taiwan 10 338 1.1× 37 0.5× 19 0.4× 31 0.8× 32 1.2× 13 379
K. Soejima Japan 8 272 0.9× 30 0.4× 16 0.3× 33 0.9× 19 0.7× 16 297
S. Chéramy France 14 490 1.6× 41 0.6× 40 0.8× 104 2.8× 42 1.6× 61 522
Chong Ser Choong Singapore 10 340 1.1× 48 0.7× 36 0.7× 25 0.7× 7 0.3× 47 375
M. J. Interrante United States 6 463 1.5× 52 0.7× 24 0.5× 77 2.1× 33 1.2× 7 487
R. Yu United States 6 370 1.2× 59 0.8× 17 0.3× 47 1.3× 26 1.0× 10 403
Yoichiro Kurita Japan 9 374 1.2× 37 0.5× 19 0.4× 47 1.3× 21 0.8× 32 387
S. Y. Hou Taiwan 11 343 1.1× 41 0.6× 16 0.3× 21 0.6× 35 1.3× 20 395
Suresh Ramalingam United States 13 513 1.7× 50 0.7× 32 0.7× 63 1.7× 30 1.1× 38 563

Countries citing papers authored by Sam Gu

Since Specialization
Citations

This map shows the geographic impact of Sam Gu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sam Gu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sam Gu more than expected).

Fields of papers citing papers by Sam Gu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sam Gu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sam Gu. The network helps show where Sam Gu may publish in the future.

Co-authorship network of co-authors of Sam Gu

This figure shows the co-authorship network connecting the top 25 collaborators of Sam Gu. A scholar is included among the top collaborators of Sam Gu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sam Gu. Sam Gu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

15 of 15 papers shown
1.
Liu, Yingxia, Yi‐Ting Chen, Sam Gu, Dongwook Kim, & K. N. Tu. (2016). Fracture reliability concern of (Au, Ni)Sn 4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scripta Materialia. 119. 9–12. 22 indexed citations
2.
Liu, Yingxia, et al.. (2016). Joule Heating Enhanced Electromigration Failure in Redistribution Layer in 2.5D IC. 1359–1363. 14 indexed citations
3.
Li, Menglu, K. N. Tu, Dongwook Kim, & Sam Gu. (2016). Electromigration induced thermomigration in microbumps by thermal cross-talk across neighboring chips in 2.5D IC. 118. PA–3. 3 indexed citations
4.
Li, Menglu, Dongwook Kim, Sam Gu, et al.. (2016). Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology. Journal of Applied Physics. 120(7). 20 indexed citations
5.
Gu, Sam. (2015). Material innovation opportunities for 3D integrated circuits from a wireless application point of view. MRS Bulletin. 40(3). 233–241. 28 indexed citations
6.
Liu, Yingxia, Menglu Li, Dongwook Kim, Sam Gu, & K. N. Tu. (2015). Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits. Journal of Applied Physics. 118(13). 47 indexed citations
7.
Liu, Yingxia, Nobumichi Tamura, Dongwook Kim, Sam Gu, & K. N. Tu. (2015). A metastable phase of tin in 3D integrated circuit solder microbumps. Scripta Materialia. 102. 39–42. 19 indexed citations
8.
Kim, Dong Wook, Keun‐Soo Kim, Minjae Lee, et al.. (2015). Multi-die chip on wafer thermo-compression bonding using non-conductive film. 17–21. 22 indexed citations
9.
Liu, Yingxia, Menglu Li, Dong Wook Kim, et al.. (2014). Filler trap and solder extrusion in 3D IC thermo-compression bonded microbumps. 609–612. 4 indexed citations
10.
Kim, Dong Wook, V. Ramachandran, B. Henderson, et al.. (2013). Development of 3D through silicon stack (TSS) assembly for wide IO memory to logic devices integration. 77–80. 22 indexed citations
11.
Ramachandran, V., Dongwook Kim, Sam Gu, et al.. (2013). A Wide I/O Memory-on-Logic Product Prototype Enabled by Through-Silicon Stacking Technology. IMAPSource Proceedings. 2013(1). 442–446. 1 indexed citations
12.
Wu, Xiaoxia, et al.. (2010). Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20(1). 186–191. 33 indexed citations
13.
14.
Zhao, Wei, et al.. (2009). Field-Based Capacitance Modeling for Sub-65-nm On-Chip Interconnect. IEEE Transactions on Electron Devices. 56(9). 1862–1872. 54 indexed citations
15.
Gu, Sam, et al.. (2008). Stackable memory of 3D chip integration for mobile applications. 1–4. 40 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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