Chuei-Tang Wang
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- 3D IC and TSV technologies 14
- Electronic Packaging and Soldering Technologies 6
- Radio Frequency Integrated Circuit Design 4
- Electromagnetic Compatibility and Noise Suppression 4
- Semiconductor materials and devices 4
- Microwave Engineering and Waveguides 3
- Photonic and Optical Devices 2
- Hardware and Architecture top 10%
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- Magnetic properties of thin films 2
- Co-authors
- Douglas YuChung-Hao TsaiChe‐Wei HsuTzu-Jin YehJing‐Cheng LinCheng‐Chieh HsiehShin-Puu JengFeng-Wei Kuo
- Journals
- Journal of Applied Physics (1 paper)IEEE Transactions on Electron Devices (1 paper)2021 IEEE International Electron Devices Meeting (IEDM) (1 paper)
- Partner nations
- TaiwanUnited States
In The Last Decade
Chuei-Tang Wang
18 papers receiving 338 citations
Peers
Comparison fields: 5 of 23
- Electrical and Electronic Engineering 334
- Hardware and Architecture 30
- Aerospace Engineering 62
- Electronic, Optical and Magnetic Materials 35
- Automotive Engineering 18
Countries citing papers authored by Chuei-Tang Wang
This map shows the geographic impact of Chuei-Tang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chuei-Tang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chuei-Tang Wang more than expected).
Fields of papers citing papers by Chuei-Tang Wang
This network shows the impact of papers produced by Chuei-Tang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chuei-Tang Wang. The network helps show where Chuei-Tang Wang may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Chuei-Tang Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2023 | 5 | |
| 3 | 2023 | 18 | |
| 4 | 2022 | 2 | |
| 5 | 2022 | 9 | |
| 6 | 2021 | 28 | |
| 7 | 2020 | 26 | |
| 8 | 2019 | 3 | |
| 9 | 2019 | 2 | |
| 10 | 2019 | 18 | |
| 11 | 2018 | 42 | |
| 12 | 2017 | 15 | |
| 13 | 2016 | 26 | |
| 14 | 2015 | 12 | |
| 15 | 2015 | 5 | |
| 16 | 2013 | 37 | |
| 17 | 2012 | 101 | |
| 18 | 1997 | 10 | |
| 19 | 1997 | 1 |
About Chuei-Tang Wang
Chuei-Tang Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Hardware and Architecture, having authored 19 papers that have together received 360 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (6 papers), Radio Frequency Integrated Circuit Design (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Semiconductor materials and devices (4 papers), Microwave Engineering and Waveguides (3 papers), Photonic and Optical Devices (2 papers) and Magnetic properties of thin films (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (334 citations), Hardware and Architecture (30 citations) and Aerospace Engineering (62 citations). Chuei-Tang Wang has collaborated with scholars based in Taiwan and United States. Frequent co-authors include Douglas Yu, Chung-Hao Tsai, Che‐Wei Hsu, Tzu-Jin Yeh, Jing‐Cheng Lin, Cheng‐Chieh Hsieh, Shin-Puu Jeng, Feng-Wei Kuo, Chewn-Pu Jou and Kai–Chiang Wu. Their work appears in journals such as Journal of Applied Physics, IEEE Transactions on Electron Devices and 2021 IEEE International Electron Devices Meeting (IEDM).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.