Chuei-Tang Wang

493 total citations
19 papers, 360 citations indexed

About

Chuei-Tang Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Chuei-Tang Wang has authored 19 papers receiving a total of 360 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Chuei-Tang Wang's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (6 papers) and Radio Frequency Integrated Circuit Design (4 papers). Chuei-Tang Wang is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (6 papers) and Radio Frequency Integrated Circuit Design (4 papers). Chuei-Tang Wang collaborates with scholars based in Taiwan and United States. Chuei-Tang Wang's co-authors include Douglas Yu, Chung-Hao Tsai, Che‐Wei Hsu, Tzu-Jin Yeh, Jing‐Cheng Lin, Cheng‐Chieh Hsieh, Shin-Puu Jeng, Feng-Wei Kuo, Chewn-Pu Jou and Kai–Chiang Wu and has published in prestigious journals such as Journal of Applied Physics, IEEE Transactions on Electron Devices and 2021 IEEE International Electron Devices Meeting (IEDM).

In The Last Decade

Chuei-Tang Wang

18 papers receiving 338 citations

Peers

Chuei-Tang Wang
Jie Xue United States
Chih-Pin Hung Taiwan
Ka Fai Chang Singapore
Ronald Hagen Netherlands
Chong Ser Choong Singapore
S. Y. Hou Taiwan
C. T. Wang Taiwan
Jonghoon J. Kim South Korea
Bahareh Banijamali United States
Xiangkun Yin China
Jie Xue United States
Chuei-Tang Wang
Citations per year, relative to Chuei-Tang Wang Chuei-Tang Wang (= 1×) peers Jie Xue

Countries citing papers authored by Chuei-Tang Wang

Since Specialization
Citations

This map shows the geographic impact of Chuei-Tang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chuei-Tang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chuei-Tang Wang more than expected).

Fields of papers citing papers by Chuei-Tang Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chuei-Tang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chuei-Tang Wang. The network helps show where Chuei-Tang Wang may publish in the future.

Co-authorship network of co-authors of Chuei-Tang Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Chuei-Tang Wang. A scholar is included among the top collaborators of Chuei-Tang Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chuei-Tang Wang. Chuei-Tang Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

19 of 19 papers shown
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2.
Wang, Chuei-Tang, et al.. (2023). Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications. 296–301. 5 indexed citations
3.
Tai, Shih-Peng, et al.. (2023). Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch. 1–4. 18 indexed citations
4.
Wang, Chuei-Tang, et al.. (2022). SoIC_H Technology for Heterogenous System Integration. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits). 258–259. 2 indexed citations
5.
Yu, Douglas, et al.. (2022). SoIC_H Technology for Heterogeneous System Integration. IEEE Transactions on Electron Devices. 69(12). 7167–7172. 9 indexed citations
6.
Yu, Douglas, et al.. (2021). Foundry Perspectives on 2.5D/3D Integration and Roadmap. 2021 IEEE International Electron Devices Meeting (IEDM). 3.7.1–3.7.4. 28 indexed citations
7.
Wang, Chuei-Tang, et al.. (2020). InFO_SoW (System-on-Wafer) for High Performance Computing. 1–6. 26 indexed citations
8.
Hsu, Che‐Wei, et al.. (2019). High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration. 1–3. 3 indexed citations
9.
Wang, Chuei-Tang & Douglas Yu. (2019). Power-Performance Advantages of InFO Technology for Advanced System Integration. 1–4. 2 indexed citations
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Wang, Chuei-Tang, et al.. (2018). InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration. 202–207. 42 indexed citations
12.
Hsu, Che‐Wei, et al.. (2017). High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL. 254–259. 15 indexed citations
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Tsai, Chung-Hao, et al.. (2013). Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications. 25.1.1–25.1.4. 37 indexed citations
17.
Kuo, Feng-Wei, Cheng‐Chieh Hsieh, Tzu-Jin Yeh, et al.. (2012). High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration. 14.1.1–14.1.4. 101 indexed citations
18.
Wang, Chuei-Tang, et al.. (1997). Effects of lamination on soft magnetic properties of FeN films on sloping surfaces. Journal of Applied Physics. 81(8). 4507–4509. 10 indexed citations
19.
Wang, Chuei-Tang, Gaurav Khanna, B Clemens, & Robert L. White. (1997). Magnetic Anisotropy and Rotational Hysteresis Loss in Epitaxial TbFe2(110) Films. MRS Proceedings. 475. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026