Klaus Hummler
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 20
- Electronic Packaging and Soldering Technologies 17
- Integrated Circuits and Semiconductor Failure Analysis 9
- Advancements in Photolithography Techniques 8
- Advancements in Semiconductor Devices and Circuit Design 3
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- Additive Manufacturing and 3D Printing Technologies 3
- Co-authors
- Yaw S. Obeng (7 shared papers)Chukwudi Okoro (7 shared papers)June W. Lau (1 shared paper)Larry Smith (4 shared papers)Ruqing Xu (4 shared papers)Lyle E. Levine (4 shared papers)James Lu (1 shared paper)Victor Vartanian (3 shared papers)
- Journals
- IEEE Transactions on Electron Devices (3 papers)Journal of Applied Physics (1 paper)Journal of Micro/Nanolithography MEMS and MOEMS (1 paper)Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena (1 paper)IMAPSource Proceedings (3 papers)
- Partner nations
- United StatesNetherlands
In The Last Decade
Klaus Hummler
26 papers receiving 291 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 283
- Electronic, Optical and Magnetic Materials 52
- Automotive Engineering 25
- Biomedical Engineering 66
- Atomic and Molecular Physics, and Optics 38
Countries citing papers authored by Klaus Hummler
This map shows the geographic impact of Klaus Hummler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Klaus Hummler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Klaus Hummler more than expected).
Fields of papers citing papers by Klaus Hummler
This network shows the impact of papers produced by Klaus Hummler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Klaus Hummler. The network helps show where Klaus Hummler may publish in the future.
Co-authors
The 25 scholars most cited alongside Klaus Hummler, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 81 | |
| 2 | 2014 | 30 | |
| 3 | 2013 | 29 | |
| 4 | 2012 | 28 | |
| 5 | 2014 | 23 | |
| 6 | 2014 | 23 | |
| 7 | 2013 | 16 | |
| 8 | 2013 | 10 | |
| 9 | 2011 | 10 | |
| 10 | 2011 | 9 | |
| 11 | 2013 | 8 | |
| 12 | 2013 | 7 | |
| 13 | 2024 | 4 | |
| 14 | 2014 | 4 | |
| 15 | 1997 | 3 | |
| 16 | 2014 | 3 | |
| 17 | 2021 | 3 | |
| 18 | 2013 | 3 | |
| 19 | 2013 | 3 | |
| 20 | 2003 | 2 |
About Klaus Hummler
Klaus Hummler is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films and Electronic, Optical and Magnetic Materials, having authored 26 papers that have together received 307 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (17 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Advancements in Photolithography Techniques (8 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), Electron and X-Ray Spectroscopy Techniques (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers) and Copper Interconnects and Reliability (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (283 citations), Electronic, Optical and Magnetic Materials (52 citations), Automotive Engineering (25 citations), Biomedical Engineering (66 citations) and Atomic and Molecular Physics, and Optics (38 citations). Klaus Hummler has collaborated with scholars based in United States and Netherlands. Frequent co-authors include Yaw S. Obeng, Chukwudi Okoro, June W. Lau, Larry Smith, Ruqing Xu, Lyle E. Levine, James Lu, Victor Vartanian, Pavel Kaboš and Jan Obrzut. Their work appears in journals such as IEEE Transactions on Electron Devices, Journal of Applied Physics, Journal of Micro/Nanolithography MEMS and MOEMS, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.