Seungbae Park

3.5k total citations · 1 hit paper
164 papers, 2.8k citations indexed

About

Seungbae Park is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Seungbae Park has authored 164 papers receiving a total of 2.8k indexed citations (citations by other indexed papers that have themselves been cited), including 137 papers in Electrical and Electronic Engineering, 51 papers in Mechanics of Materials and 45 papers in Mechanical Engineering. Recurrent topics in Seungbae Park's work include Electronic Packaging and Soldering Technologies (116 papers), 3D IC and TSV technologies (81 papers) and Integrated Circuits and Semiconductor Failure Analysis (16 papers). Seungbae Park is often cited by papers focused on Electronic Packaging and Soldering Technologies (116 papers), 3D IC and TSV technologies (81 papers) and Integrated Circuits and Semiconductor Failure Analysis (16 papers). Seungbae Park collaborates with scholars based in United States, South Korea and China. Seungbae Park's co-authors include Soonwan Chung, Jiefeng Xu, Ke Pan, Da Yu, Huayan Wang, Dapeng Liu, Jae B. Kwak, Yangyang Lai, Yuling Niu and Jing Wang and has published in prestigious journals such as Acta Materialia, Journal of the American Ceramic Society and Sensors.

In The Last Decade

Seungbae Park

158 papers receiving 2.7k citations

Hit Papers

Fracture Criteria for Pie... 1995 2026 2005 2015 1995 100 200 300 400 500
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Fracture Criteria for Piezoelectric Ceramics
    1995 507 citations Seungbae Park et al. Journal of the American Ceramic Society profile →

Author Peers

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author Last Decade Papers Cites
Seungbae Park 1.7k 1.1k 631 425 248 164 2.8k
B. Michel 2.1k 1.2× 855 0.8× 834 1.3× 435 1.0× 53 0.2× 211 2.7k
Ganesh Subbarayan 906 0.5× 610 0.6× 627 1.0× 119 0.3× 188 0.8× 192 1.8k
Bongtae Han 2.2k 1.3× 968 0.9× 1.3k 2.1× 504 1.2× 305 1.2× 198 4.0k
Ying Guo 694 0.4× 770 0.7× 855 1.4× 437 1.0× 158 0.6× 127 2.0k
Kuo‐Shen Chen 1.0k 0.6× 397 0.4× 470 0.7× 947 2.2× 72 0.3× 149 2.1k
Fujun Wang 932 0.5× 285 0.3× 917 1.5× 1.0k 2.5× 133 0.5× 150 3.1k
Kuo‐Ning Chiang 2.1k 1.2× 466 0.4× 775 1.2× 349 0.8× 109 0.4× 264 2.7k
E. Suhir 3.0k 1.7× 1.5k 1.4× 820 1.3× 650 1.5× 396 1.6× 307 4.6k
Bernhard Wunderle 1.8k 1.0× 780 0.7× 869 1.4× 423 1.0× 85 0.3× 310 2.6k
Jongwon Seok 753 0.4× 317 0.3× 1.6k 2.5× 1.0k 2.4× 565 2.3× 90 2.5k

Countries citing papers authored by Seungbae Park

Since Specialization
Citations

This map shows the geographic impact of Seungbae Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seungbae Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seungbae Park more than expected).

Fields of papers citing papers by Seungbae Park

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Seungbae Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seungbae Park. The network helps show where Seungbae Park may publish in the future.

Co-authorship network of co-authors of Seungbae Park

This figure shows the co-authorship network connecting the top 25 collaborators of Seungbae Park. A scholar is included among the top collaborators of Seungbae Park based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seungbae Park. Seungbae Park is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lai, Yangyang, Ke Pan, & Seungbae Park. (2024). Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review. Microelectronics Reliability. 161. 115477–115477. 10 indexed citations
2.
Lai, Yangyang, Atsushi Takahashi, & Seungbae Park. (2024). Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(11). 1936–1942. 3 indexed citations
3.
Lai, Yangyang, et al.. (2024). Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions. 1538–1542. 2 indexed citations
4.
Lai, Yangyang, et al.. (2023). Enhanced solder fatigue life of chip resistor by optimizing solder shape. Microelectronics Reliability. 145. 114994–114994. 8 indexed citations
5.
Park, Seungbae, et al.. (2023). Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(9). 1388–1398. 5 indexed citations
6.
Pan, Ke, et al.. (2023). High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(11). 1861–1867. 4 indexed citations
7.
Park, Seungbae, et al.. (2023). Enhanced Foam Package Design for Drop/Impact Using Accurate Predictive Simulation. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(5). 638–645. 2 indexed citations
8.
Lai, Yangyang, et al.. (2023). Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(1). 127–134. 11 indexed citations
9.
Lai, Yangyang, et al.. (2023). Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment. 6. 1085–1090. 1 indexed citations
10.
Lai, Yangyang, et al.. (2022). Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(3). 562–569. 19 indexed citations
11.
Lai, Yangyang, et al.. (2022). Shape Dependency of Fatigue Life in Solder Joints of Chip Resistors. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1489–1494. 10 indexed citations
12.
13.
Pan, Ke, et al.. (2020). An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(1). 161–168. 25 indexed citations
14.
Park, Seungbae, et al.. (2019). The effect of solder paste volume on surface mount assembly self-alignment. Procedia Manufacturing. 38. 1381–1393. 19 indexed citations
15.
Liu, Dapeng, et al.. (2016). An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system. Microelectronics Reliability. 60. 109–115. 17 indexed citations
16.
Wang, Zhaoyang, et al.. (2009). Three-dimensional shape measurement with a fast and accurate approach. Applied Optics. 48(6). 1052–1052. 56 indexed citations
17.
Park, Seungbae & Haojun Zhang. (2007). Investigation of Hygroscopic Swelling of Polymers in Freezing Temperature. 281–285. 2 indexed citations
18.
Park, Seungbae, et al.. (1995). Fracture Criteria for Piezoelectric Ceramics. Journal of the American Ceramic Society. 78(6). 1475–1480. 507 indexed citations breakdown →
19.
Park, Seungbae. (1994). Fracture behavior of piezoelectric materials. Purdue e-Pubs (Purdue University System). 28 indexed citations
20.
Park, Seungbae & Chin-Teh Sun. (1994). <title>Crack extension in piezoelectric materials</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2189. 357–368. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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