Yaw S. Obeng

3.4k total citations · 1 hit paper
97 papers, 2.7k citations indexed

About

Yaw S. Obeng is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Yaw S. Obeng has authored 97 papers receiving a total of 2.7k indexed citations (citations by other indexed papers that have themselves been cited), including 68 papers in Electrical and Electronic Engineering, 30 papers in Biomedical Engineering and 29 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Yaw S. Obeng's work include Copper Interconnects and Reliability (25 papers), 3D IC and TSV technologies (22 papers) and Semiconductor materials and devices (21 papers). Yaw S. Obeng is often cited by papers focused on Copper Interconnects and Reliability (25 papers), 3D IC and TSV technologies (22 papers) and Semiconductor materials and devices (21 papers). Yaw S. Obeng collaborates with scholars based in United States, France and Germany. Yaw S. Obeng's co-authors include Allen J. Bard, Chukwudi Okoro, Qiliang Li, Angela R. Hight Walker, Curt A. Richter, Hui Yuan, Christophe Jehoulet, Feimeng Zhou, Guangjun Cheng and Qin Zhang and has published in prestigious journals such as Journal of the American Chemical Society, ACS Nano and Journal of Applied Physics.

In The Last Decade

Yaw S. Obeng

89 papers receiving 2.6k citations

Hit Papers

Toward Clean and Crackless Transfer of Graphene 2011 2026 2016 2021 2011 200 400 600

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yaw S. Obeng United States 20 1.4k 1.4k 826 448 367 97 2.7k
Jian Tang China 30 2.1k 1.5× 1.2k 0.8× 671 0.8× 120 0.3× 343 0.9× 101 3.5k
Matthew S. Dyer United Kingdom 33 2.3k 1.6× 1.5k 1.0× 781 0.9× 172 0.4× 588 1.6× 132 3.6k
Alwin R. M. Verschueren Netherlands 15 4.0k 2.8× 1.9k 1.3× 1.6k 1.9× 387 0.9× 366 1.0× 37 5.3k
Robert Geer United States 24 733 0.5× 862 0.6× 379 0.5× 243 0.5× 586 1.6× 105 2.0k
Thomas Szkopek Canada 29 2.2k 1.5× 1.4k 1.0× 1.1k 1.3× 91 0.2× 613 1.7× 106 3.3k
Martin Thuo United States 33 1.3k 0.9× 2.0k 1.4× 1.6k 1.9× 110 0.2× 176 0.5× 106 3.7k
Haiqian Wang China 26 1.6k 1.1× 1.0k 0.7× 436 0.5× 299 0.7× 504 1.4× 96 2.3k
Zhenting Dai United States 12 3.1k 2.2× 1.5k 1.1× 1.2k 1.4× 132 0.3× 422 1.1× 22 3.8k
Koichiro Saiki Japan 36 2.6k 1.8× 2.5k 1.7× 739 0.9× 356 0.8× 472 1.3× 222 4.4k
Li Ding China 35 2.7k 1.9× 2.2k 1.6× 1.7k 2.0× 253 0.6× 327 0.9× 115 4.5k

Countries citing papers authored by Yaw S. Obeng

Since Specialization
Citations

This map shows the geographic impact of Yaw S. Obeng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yaw S. Obeng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yaw S. Obeng more than expected).

Fields of papers citing papers by Yaw S. Obeng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yaw S. Obeng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yaw S. Obeng. The network helps show where Yaw S. Obeng may publish in the future.

Co-authorship network of co-authors of Yaw S. Obeng

This figure shows the co-authorship network connecting the top 25 collaborators of Yaw S. Obeng. A scholar is included among the top collaborators of Yaw S. Obeng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yaw S. Obeng. Yaw S. Obeng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Celano, Umberto, et al.. (2024). Metrology for 2D materials: a perspective review from the international roadmap for devices and systems. Nanoscale Advances. 6(9). 2260–2269. 12 indexed citations
2.
Obrzut, Jan, et al.. (2019). Contactless Resonant Cavity Dielectric Spectroscopic Studies of Recycled Office Papers. Recycling. 4(4). 43–43. 1 indexed citations
4.
Obeng, Yaw S.. (2017). Characterization and Reliability.
5.
Sunday, Christopher E., Dmitry Veksler, Kin P. Cheung, & Yaw S. Obeng. (2017). Microwave evaluation of electromigration susceptibility in advanced interconnects. Journal of Applied Physics. 122(17). 1 indexed citations
6.
Okoro, Chukwudi, et al.. (2017). The Impact of Organic Additives on Copper Trench Microstructure. Journal of The Electrochemical Society. 164(9). D543–D550. 18 indexed citations
7.
Kopanski, Joseph J., et al.. (2016). Characterization of Buried Interfaces with Scanning Probe Microscopes. ECS Transactions. 72(2). 2 indexed citations
8.
Darroudi, Taghi, et al.. (2016). The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films. Thin Solid Films. 621. 91–97. 30 indexed citations
9.
Obeng, Yaw S., et al.. (2016). Towards Understanding Early Failures Behavior during Device Burn-In: Broadband RF Monitoring of Atomistic Changes in Materials. ECS Journal of Solid State Science and Technology. 5(9). N61–N66. 7 indexed citations
10.
Kopanski, Joseph J., et al.. (2015). Subsurface Imaging with the Scanning Microwave Microscope. Bulletin of the American Physical Society. 2015. 1 indexed citations
11.
Okoro, Chukwudi, Lyle E. Levine, Ruqing Xu, & Yaw S. Obeng. (2015). Experimental measurement of the effect of copper through-silicon via diameter on stress buildup using synchrotron-based X-ray source. Journal of Materials Science. 50(18). 6236–6244. 16 indexed citations
12.
You, Lin, et al.. (2015). Electromagnetic field test structure chip for back end of the line metrology. 4. 235–239. 2 indexed citations
13.
Yuan, Hui, Guangjun Cheng, Lin You, et al.. (2014). Influence of Metal¿MoS2 Interface on MoS2 Transistor Performance: Comparison of Ag and Ti Contacts. ACS Nano. 1 indexed citations
14.
Kopanski, Joseph J., et al.. (2014). (Invited) Scanning Probe Microscopes for Subsurface Imaging. ECS Transactions. 61(2). 185–193. 11 indexed citations
15.
Okoro, Chukwudi, et al.. (2013). Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals. IEEE Transactions on Electron Devices. 60(6). 2015–2021. 16 indexed citations
17.
Misra, D., Hiroshi Iwai, Yaw S. Obeng, Toyohiro Chikyow, & Jan Vanhellemont. (2008). Dielectrics for nanosystems 3: materials science, processing, reliability, and manufacturing. 6 indexed citations
18.
Deshpande, Sameer, et al.. (2005). Surface-modified polymeric pads for enhanced performance during chemical mechanical planarization. Thin Solid Films. 483(1-2). 261–269. 10 indexed citations
19.
Zantye, Parshuram B., et al.. (2004). Metrology of Psiloquest's Application Specific Pads (ASP) for CMP Applications. MRS Proceedings. 816. 1 indexed citations
20.
Bulhões, L.O.S., Yaw S. Obeng, & Allen J. Bard. (1993). Langmuir-Blodgett and electrochemical studies of fullerene films. Chemistry of Materials. 5(1). 110–114. 64 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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