Suk-Kyu Ryu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 16
- Electronic Packaging and Soldering Technologies 7
- Integrated Circuits and Semiconductor Failure Analysis 4
- Semiconductor materials and devices 2
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- Advanced Surface Polishing Techniques 11
- Nanofabrication and Lithography Techniques 3
- Journals
- IEEE Transactions on Device and Materials Reliability (3 papers)Applied Physics Letters (1 paper)AIP conference proceedings (1 paper)Journal of the Korean Society for Aeronautical & Space Sciences (1 paper)
- Partner nations
- United StatesSouth Korea
In The Last Decade
Suk-Kyu Ryu
17 papers receiving 772 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 762
- Automotive Engineering 112
- Biomedical Engineering 210
- Electronic, Optical and Magnetic Materials 80
- Atomic and Molecular Physics, and Optics 72
Countries citing papers authored by Suk-Kyu Ryu
This map shows the geographic impact of Suk-Kyu Ryu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Suk-Kyu Ryu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Suk-Kyu Ryu more than expected).
Fields of papers citing papers by Suk-Kyu Ryu
This network shows the impact of papers produced by Suk-Kyu Ryu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Suk-Kyu Ryu. The network helps show where Suk-Kyu Ryu may publish in the future.
Co-authors
The 21 scholars most cited alongside Suk-Kyu Ryu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 5 | |
| 2 | 2013 | 24 | |
| 3 | 2012 | 95 | |
| 4 | 2012 | 3 | |
| 5 | 2012 | 1 | |
| 6 | 2012 | 2 | |
| 7 | 2012 | 95 | |
| 8 | 2011 | 9 | |
| 9 | 2011 | 12 | |
| 10 | 2011 | 25 | |
| 11 | 2010 | 100 | |
| 12 | 2010 | 4 | |
| 13 | 2010 | 206 | |
| 14 | 2009 | 178 | |
| 15 | 2009 | 18 | |
| 16 | 2008 | 9 | |
| 17 | Optimization of Composite Laminated Structures by the Mixed Method | 2000 | 1 |
About Suk-Kyu Ryu
Suk-Kyu Ryu is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Civil and Structural Engineering and Mechanics of Materials, having authored 17 papers that have together received 787 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (16 papers), Advanced Surface Polishing Techniques (11 papers), Electronic Packaging and Soldering Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Nanofabrication and Lithography Techniques (3 papers), Copper Interconnects and Reliability (2 papers), Semiconductor materials and devices (2 papers) and Topology Optimization in Engineering (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (762 citations), Automotive Engineering (112 citations), Biomedical Engineering (210 citations), Electronic, Optical and Magnetic Materials (80 citations) and Atomic and Molecular Physics, and Optics (72 citations). Suk-Kyu Ryu has collaborated with scholars based in United States and South Korea. Frequent co-authors include Rui Huang, Paul S. Ho, Jay Im, Xuefeng Zhang, Kuan Lu, Kuan-Hsun Lu, Jang‐Hi Im, Tengfei Jiang, Qiu Zhao and Kwang-Yoo Byun. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Applied Physics Letters, AIP conference proceedings and Journal of the Korean Society for Aeronautical & Space Sciences.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.