Jay Im

2.6k total citations
79 papers, 1.9k citations indexed

About

Jay Im is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Jay Im has authored 79 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 73 papers in Electrical and Electronic Engineering, 23 papers in Biomedical Engineering and 14 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Jay Im's work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (33 papers) and Advancements in PLL and VCO Technologies (19 papers). Jay Im is often cited by papers focused on 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (33 papers) and Advancements in PLL and VCO Technologies (19 papers). Jay Im collaborates with scholars based in United States, South Korea and Germany. Jay Im's co-authors include Paul S. Ho, Rui Huang, Suk-Kyu Ryu, Kuan Lu, Tengfei Jiang, Xuefeng Zhang, Brook Chao, Qiu Zhao, Ken Chang and Yohan Frans and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Jay Im

77 papers receiving 1.8k citations

Peers

Countries citing papers authored by Jay Im

Since Specialization

Citations

This map shows the geographic impact of Jay Im's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jay Im with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jay Im more than expected).

Fields of papers citing papers by Jay Im

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jay Im. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jay Im. The network helps show where Jay Im may publish in the future.

Co-authorship network of co-authors of Jay Im

This figure shows the co-authorship network connecting the top 25 collaborators of Jay Im. A scholar is included among the top collaborators of Jay Im based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jay Im. Jay Im is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies 2023 ·Mayank Raj, (unknown), (unknown), (unknown), Wenfeng Zhang, Ying Cao, Jae Wook Kim, (unknown), (unknown), Yipeng Wang, (unknown), Winson Lin, Jay Im, (unknown), (unknown), Parag Upadhyaya, Yohan Frans	13
2	Patient Demographics and Extracorporeal Membranous Oxygenation (ECMO)-Related Complications Associated With Survival to Discharge or 30-Day Survival in Adult Patients Receiving Venoarterial (VA) and Venovenous (VV) ECMO in a Quaternary Care Urban Center 2018 ·Journal of Cardiothoracic and Vascular Anesthesia ·(unknown), (unknown), (unknown), Jay Im, Jonathan Leff, William Jakobleff, Galina Leyvi	32
3	A 4-to-16GHz inverter-based injection-locked quadrature clock generator with phase interpolators for multi-standard I/Os in 7nm FinFET 2018 ·Stanley Chen, Lei Zhou, (unknown), Jay Im, (unknown), (unknown), Mayank Raj, Jaewook Shin, Yohan Frans, Ken Chang	42
4	Design techniques for 32.75Gb/s and 56Gb/s wireline transceivers in 16nm FinFET 2017 ·(unknown), Parag Upadhyaya, Jay Im, Stanley Chen, Yohan Frans, Ken Chang	3
5	A 40-to-56 Gb/s PAM-4 Receiver With Ten-Tap Direct Decision-Feedback Equalization in 16-nm FinFET 2017 ·IEEE Journal of Solid-State Circuits ·Jay Im, (unknown), Arianne Roldan, Ronan Casey, Stanley Chen, (unknown), (unknown), (unknown), (unknown), Lei Zhou, (unknown), Jaeduk Han, Sen Lin, Parag Upadhyaya, (unknown), Yohan Frans, Ken Chang	47
6	A 56-Gb/s PAM4 Wireline Transceiver Using a 32-Way Time-Interleaved SAR ADC in 16-nm FinFET 2017 ·IEEE Journal of Solid-State Circuits ·Yohan Frans, Jaewook Shin, Lei Zhou, Parag Upadhyaya, Jay Im, (unknown), (unknown), Hiva Hedayati, Toan Thang Pham, (unknown), (unknown), Geoff G. Z. Zhang, Hongtao Zhang, Ken Chang	127
7	A 0.5-16.3Gbps multi-standard serial transceiver with 219mW/channel in 16nm FinFET 2016 ·(unknown), (unknown), Declan Carey, Ronan Casey, (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), Yohan Frans, Jay Im, Parag Upadhyaya, Wenfeng Zhang, Winson Lin, (unknown), Ken Chang	4
8	Through-silicon via stress characteristics and reliability impact on 3D integrated circuits 2015 ·MRS Bulletin ·Tengfei Jiang, Jay Im, Rui Huang, Paul S. Ho	49
9	Effect of Cu grain boundary sliding on TSV extrusion 2015 ·Chenglin Wu, Tengfei Jiang, Jay Im, Rui Huang, Paul S. Ho	3
10	Impact of Grain Structure and Material Properties on Via Extrusion in 3-D Interconnects 2014 ·IMAPSource Proceedings ·Tengfei Jiang, Chenglin Wu, Jay Im, Rui Huang, Paul S. Ho	1
11	Critical initial void growth for electromigration: Stress modeling and multi-link statistics for Cu/low-k interconnects 2013 ·(unknown), (unknown), Jay Im, (unknown), Paul S. Ho	2
12	Design of high-speed wireline transceivers for backplane communications in 28nm CMOS 2012 ·Jafar Savoj, (unknown), Parag Upadhyaya, Fu-Tai An, Jay Im, (unknown), (unknown), (unknown), Daniel Wu, Elad Alon, Ken Chang	21
13	Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique 2012 ·Applied Physics Letters ·Suk-Kyu Ryu, Tengfei Jiang, Kuan Lu, Jay Im, Hwa–Young Son, Kwang-Yoo Byun, Rui Huang, Paul S. Ho	95
14	Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect 2012 ·Yiwei Wang, (unknown), Rajiv Dunne, (unknown), Kazuaki Mawatari, Philipp Steinmann, (unknown), Tengfei Jiang, Jay Im, Paul S. Ho	22
15	Stress-Induced Delamination Of Through Silicon Via Structures 2011 ·AIP conference proceedings ·(unknown), (unknown), Jay Im, Rui Huang, Paul S. Ho	16
16	SUMO proteins are involved in the stress response during spermatogenesis and are localized to DNA double-strand breaks in germ cells 2010 ·Reproduction ·(unknown), (unknown), (unknown), Jay Im, Margarita Vigodner	47
17	Thermal stress induced delamination of through silicon vias in 3-D interconnects 2010 ·Kuan Lu, Suk-Kyu Ryu, Qiu Zhao, (unknown), Jay Im, Rui Huang, Paul S. Ho	100
18	Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing 2007 ·Acta Materialia ·Brook Chao, (unknown), Xuefeng Zhang, (unknown), Jay Im, Paul S. Ho	174
19	Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints 2006 ·(unknown), (unknown), Xuefeng Zhang, Kuan-Hsun Lu, Jay Im, Paul S. Ho	5
20	Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints 2006 ·Journal of Applied Physics ·Brook Chao, (unknown), Xuefeng Zhang, Kuan-Hsun Lu, Min Ding, Jay Im, Paul S. Ho	94

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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